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STF7N95K3

STMicroelectronics

STF7N95K3 by STMicroelectronics

STF7N95K3 by STMicroelectronics is a N-CHANNEL FET with 950V DS Breakdown Voltage, 28.8A IDM, and 220mJ EAS. Ideal for SWITCHING applications due to its 35W Max Power Dissipation and ENHANCEMENT MODE operation at up to 150°C.

Median Price

$2.260

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$3.050

100+ parts

$1.270

1k+ parts

$1.130

10k+ parts

-

1,000

$3.050

$1.270

$1.130

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Verical

USA . 3,996 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.312

10k+ parts

$1.287

3,996

-

$1.470

$1.312

$1.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,522 parts In-Stock

1+ parts

$2.898

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1,522

$2.898

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Vyrian

USA . 8,012 parts In-Stock

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8,012

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Anansix

USA . 1,339 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,326 parts In-Stock

1+ parts

$1.789

100+ parts

-

1k+ parts

$1.610

10k+ parts

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2,326

$1.789

-

$1.610

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Ampacity Inc.

Singapore . 908 parts In-Stock

1+ parts

$2.590

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908

$2.590

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Corphita

USA . 858 parts In-Stock

1+ parts

$2.745

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858

$2.745

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MKK Technologies

India . 588 parts In-Stock

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$3.365

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588

$3.365

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DigiPath Technology Company

USA . 588 parts In-Stock

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$3.365

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588

$3.365

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AZTECH Wire

Italy . 1,093 parts In-Stock

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$13.530

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$13.530

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Microchip USA

USA . 6,366 parts In-Stock

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$27.105

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6,366

$27.105

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,474 parts In-Stock

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13,474

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Alle Elektronik GmbH

Germany . 3,366 parts In-Stock

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3,366

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Parana Technologies

USA . 1,371 parts In-Stock

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$2.140

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$2.140

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Discover the STF7N95K3 by STMicroelectronics, a high-quality Power FET that delivers exceptional performance in switching applications. With a breakdown voltage of 950V and a maximum drain current of 7.2A, this N-CHANNEL transistor offers reliability and efficiency for your projects. The single configuration with a built-in diode simplifies design while the metal-oxide semiconductor technology ensures optimal functionality. Trust STMicroelectronics for cutting-edge solutions that exceed expectations. Experience the value and benefits of the STF7N95K3 in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, making it reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance and higher mobility, resulting in better efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from reverse voltage spikes and enhances the overall reliability of the transistor.

Transistor Application: SWITCHING

Being designed for switching applications, this transistor can rapidly switch between ON and OFF states, making it suitable for various electronic circuits.

Minimum DS Breakdown Voltage: 950 V

The high breakdown voltage ensures that the transistor can handle large voltage fluctuations without getting damaged, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 28.8 A

With a high pulsed drain current rating, this transistor can handle surges in current without overheating, ensuring reliable performance under varying load conditions.

Maximum Power Dissipation (Abs): 35 W

The high power dissipation rating allows the transistor to handle high power levels without overheating, ensuring long-term reliability and performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature rating ensures that the transistor can perform reliably even in elevated temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) STF7N95K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

220 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (Abs) (ID):

7.2 A

Maximum Drain Current (ID):

7.2 A

Maximum Drain-Source On Resistance:

1.35 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28.8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF7N95K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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