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STF7NM80

STMicroelectronics

STF7NM80 by STMicroelectronics

STF7NM80 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 6.5 A and a breakdown voltage of 800 V. It operates in enhancement mode with a power dissipation of up to 25 W. Ideal for high-voltage circuits, it ensures reliable performance in compact designs.

Median Price

$3.692

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 219 parts In-Stock

1+ parts

$5.050

100+ parts

$2.392

1k+ parts

$1.856

10k+ parts

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219

$5.050

$2.392

$1.856

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Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$2.333

1k+ parts

$1.862

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4,000

-

$2.333

$1.862

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Avnet

USA . 3,000 parts In-Stock

1+ parts

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3,000

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EBV Elektronik

Germany . 1,000 parts In-Stock

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1,000

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Digiode

USA . 4,799 parts In-Stock

1+ parts

$4.798

100+ parts

-

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4,799

$4.798

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Vyrian

USA . 8,705 parts In-Stock

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8,705

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Anansix

USA . 2,003 parts In-Stock

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2,003

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Bristol Electronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Martec Srl

Italy . 50 parts In-Stock

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50

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Jameco Electronics

USA . 14 parts In-Stock

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14

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,341 parts In-Stock

1+ parts

$1.159

100+ parts

-

1k+ parts

$1.043

10k+ parts

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1,341

$1.159

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$1.043

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MKK Technologies

India . 2,337 parts In-Stock

1+ parts

$2.180

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2,337

$2.180

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

$2.180

100+ parts

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2,337

$2.180

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Corphita

USA . 965 parts In-Stock

1+ parts

$4.545

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965

$4.545

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Kepictronics

USA . 23,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,265 parts In-Stock

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22,265

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Microchip USA

USA . 10,479 parts In-Stock

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10,479

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,189 parts In-Stock

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6,189

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Alle Elektronik GmbH

Germany . 4,218 parts In-Stock

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4,218

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Parana Technologies

USA . 1,739 parts In-Stock

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$1.386

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1,739

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$1.386

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Perfect Parts

USA . 1,098 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Unlock superior performance with the STF7NM80 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficient switching applications, this N-Channel power FET guarantees reliability and robust operation under demanding conditions. With its high voltage capability and built-in diode, it offers exceptional value for your projects, ensuring durability while streamlining design complexity. Elevate your electronic systems with the unmatched quality and expertise of STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides excellent protection and durability, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, which makes them ideal for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration into circuits and enhanced performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient control over power flow, making it suitable for a wide range of power management tasks.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage ensures reliability in high-voltage applications, adding to the safety and durability of the component.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are ideal for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption in idle states, improving overall energy efficiency.

Maximum Pulsed Drain Current (IDM): 26 A

A high pulsed drain current rating enables the FET to handle transient loads effectively, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 240 mJ

This rating indicates that the FET can withstand energy spikes, which increases reliability and reduces failure risk in circuit operation.

Maximum Drain Current (Abs) (ID): 6.5 A

This allows for solid performance across various applications without overheating, ensuring longevity and reliability.

No. of Terminals: 3

Three terminals allow for versatile circuit configurations, enabling designers to create efficient layouts.

Maximum Power Dissipation (Abs): 25 W

The ability to dissipate 25 W of power reduces heat generation, enhancing the overall performance of the circuit.

Package Style (Meter): FLANGE MOUNT

Flange mount design simplifies installation and enhances thermal management, ensuring optimal performance and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high efficiency and low signal loss, making this FET suitable for high-speed applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET is ideal for applications in harsh environments.

Transistor Element Material: SILICON

Silicon is a standard semiconducting material known for its reliability and efficiency, making this product suitable for various applications.

Terminal Finish: MATTE TIN

Matte tin provides good solderability and corrosion resistance, ensuring a longer lifespan and better connectivity.

Maximum Drain Current (ID): 6.5 A

Repeating spec - This FET can handle a solid amount of current, making it applicable in a wide range of operations.

Maximum Drain-Source On Resistance: 1.05 ohm

A low on-resistance leads to less power loss and improved efficiency, making this FET ideal for energy-sensitive applications.

Terminal Position: SINGLE

Single terminal positioning simplifies integration into circuits and minimizes space requirements, benefiting compact designs.

Case Connection: ISOLATED

An isolated case connection provides enhanced safety by preventing short circuits and allowing for reliable operation in sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF7NM80 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

1.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

26 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF7NM80 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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