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STF7N52K3

STMicroelectronics

STF7N52K3 by STMicroelectronics

STF7N52K3 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 6.3 A and a breakdown voltage of 525 V. It operates in enhancement mode with a power dissipation of 25 W. Ideal for high-temperature environments, it supports efficient circuit designs.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 977 parts In-Stock

1+ parts

$2.550

100+ parts

$1.125

1k+ parts

$0.903

10k+ parts

-

977

$2.550

$1.125

$0.903

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 347 parts In-Stock

1+ parts

$2.422

100+ parts

-

1k+ parts

-

10k+ parts

-

347

$2.422

-

-

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Vyrian

USA . 6,884 parts In-Stock

1+ parts

-

100+ parts

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6,884

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ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

1+ parts

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4,000

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-

-

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Anansix

USA . 2,497 parts In-Stock

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-

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2,497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 237 parts In-Stock

1+ parts

$0.385

100+ parts

-

1k+ parts

$0.346

10k+ parts

-

237

$0.385

-

$0.346

-

MKK Technologies

India . 910 parts In-Stock

1+ parts

$0.723

100+ parts

-

1k+ parts

-

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910

$0.723

-

-

-

DigiPath Technology Company

USA . 910 parts In-Stock

1+ parts

$0.723

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$0.723

-

-

-

Ampacity Inc.

Singapore . 772 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

-

10k+ parts

-

772

$2.170

-

-

-

Corphita

USA . 179 parts In-Stock

1+ parts

$2.295

100+ parts

-

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179

$2.295

-

-

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Microchip USA

USA . 412 parts In-Stock

1+ parts

$11.245

100+ parts

-

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412

$11.245

-

-

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 21,562 parts In-Stock

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21,562

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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A-Z Elektronik GmbH

Germany . 4,604 parts In-Stock

1+ parts

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4,604

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Perfect Parts

USA . 2,998 parts In-Stock

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2,998

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Parana Technologies

USA . 2,309 parts In-Stock

1+ parts

-

100+ parts

$0.460

1k+ parts

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10k+ parts

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2,309

-

$0.460

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Alle Elektronik GmbH

Germany . 977 parts In-Stock

1+ parts

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100+ parts

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977

-

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Kepictronics

USA . 838 parts In-Stock

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838

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Assy Fe

Spain . 500 parts In-Stock

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500

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Overview

Unlock exceptional efficiency and reliability with the STF7N52K3 from STMicroelectronics, a leader in semiconductor innovation. This N-channel power FET excels in high-performance switching applications, delivering robust control for your designs. With its advanced technology and built-in diode, it ensures optimal heat management and durability. Elevate your projects with a component that promises unparalleled quality, proven reliability, and long-lasting performance—ideal for industrial automation, renewable energy systems, and more!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for a variety of operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide lower on-state resistance and higher efficiency in most applications, making them a favorable choice for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves protection against reverse voltage, simplifying the circuit design and enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET efficiently handles rapid on/off states, suitable for power supply and motor control.

Minimum DS Breakdown Voltage: 525 V

A high breakdown voltage makes this FET capable of handling high-voltage applications, ensuring reliability in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easier layout and integration into various circuit designs, facilitating space-saving implementations.

Terminal Form: THROUGH-HOLE

Through-hole technology provides strong mechanical connections and is well-suited for prototyping and high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode improves performance in applications requiring dynamic switching, allowing for efficient control over device operation.

Maximum Pulsed Drain Current (IDM): 25 A

The ability to handle pulsed currents up to 25 A equips this transistor for demanding transient applications, providing robustness under peak loads.

Maximum Drain Current (Abs) (ID): 6.2 A

With a maximum drain current rating of 6.2 A, this FET is suitable for a wide range of power electronics applications, ensuring versatility.

No. of Terminals: 3

The 3-terminal design simplifies integration and connectivity within circuits, minimizing complexity in PCB layouts.

Maximum Power Dissipation (Abs): 25 W

A maximum power dissipation rating of 25 W allows this FET to operate efficiently without overheating, ensuring longevity and reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides secured and stable mounting options for heavy-duty applications, enhancing thermal and mechanical stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high speed and efficiency, making it suitable for various modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliability in extreme thermal environments, expanding application possibilities.

Transistor Element Material: SILICON

Silicon as the material enables good electrical performance and thermal stability, making it a common choice in the semiconductor industry.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain Current (ID): 6.3 A

With a maximum drain current of 6.3 A, this FET meets the demands of power applications and provides a margin for reliability.

Maximum Drain-Source On Resistance: 0.98 ohm

A low on-resistance of 0.98 ohms reduces power loss during operation, enhancing overall efficiency in switching applications.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and integration into existing systems, promoting ease of use.

Case Connection: ISOLATED

Isolated case connections reduce the risk of unwanted parasitic effects, improving safety and performance in signal integrity.

Technical Specifications

Power Field Effect Transistors (FET) STF7N52K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (Abs) (ID):

6.2 A

Maximum Drain Current (ID):

6.3 A

Maximum Drain-Source On Resistance:

.98 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF7N52K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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