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STF7NM50N

STMicroelectronics

STF7NM50N by STMicroelectronics

STF7NM50N by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 20A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,344 parts In-Stock

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8,344

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Anansix

USA . 2,084 parts In-Stock

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2,084

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Lakeland Logistics Inc

USA . 1,750 parts In-Stock

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1,750

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Bristol Electronics

USA . 1,750 parts In-Stock

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1,750

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Zilex Electronics Inc.

Canada . 700 parts In-Stock

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700

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Digiode

USA . 320 parts In-Stock

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320

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 674 parts In-Stock

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$0.485

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$0.436

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674

$0.485

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$0.436

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MKK Technologies

India . 859 parts In-Stock

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$0.912

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859

$0.912

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DigiPath Technology Company

USA . 859 parts In-Stock

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$0.912

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859

$0.912

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AZTECH Wire

Italy . 400 parts In-Stock

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$19.520

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$19.520

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,657 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Corphita

USA . 4,785 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,758 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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Perfect Parts

USA . 933 parts In-Stock

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Parana Technologies

USA . 931 parts In-Stock

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$0.580

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931

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$0.580

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Overview

Unleash the power of innovation with the STF7NM50N from STMicroelectronics, a beacon of reliability in the world of Power Field Effect Transistors. Designed for dynamic switching applications, this N-channel FET delivers exceptional performance while effortlessly handling high voltages up to 500V. With STMicroelectronics' renowned quality and commitment to excellence, you can trust that your projects will benefit from enhanced efficiency, robust durability, and superior thermal management—empowering your designs for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight design and excellent thermal stability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer higher efficiency and are preferred for switching applications due to lower on-resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode provides additional protection against reverse voltage, improving reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this FET is ideal for various applications including power management and control.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage indicates the ability to handle significant voltage levels, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

Rectangular packaging optimizes layout and space efficiency on circuit boards, allowing for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures strong mechanical connections and is preferable for high power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode functionality allows for better control and reduced leakage current in off states.

Maximum Pulsed Drain Current (IDM): 20 A

A high pulsed drain current capability allows this FET to handle short bursts of high power efficiently.

Avalanche Energy Rating (EAS): 100 mJ

This rating indicates good performance under avalanche conditions, enhancing overall reliability in transient situations.

Maximum Drain Current (Abs) (ID): 5 A

This specification indicates that the FET can handle a robust current, making it suitable for various applications without risk of damage.

No. of Terminals: 3

The three-terminal design allows for easy integration into circuits, providing a simplified connection and layout.

Maximum Power Dissipation (Abs): 20 W

A high power dissipation capability allows for effective heat management, ensuring stable performance during operation.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides a secure attachment to heatsinks, contributing to better thermal management and device longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making it effective for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high operating temperature tolerance enhances reliability and expands the range of applications in harsh environments.

Transistor Element Material: SILICON

Silicon as a base material provides excellent electrical properties, contributing to overall efficiency and performance.

Maximum Drain Current (ID): 5 A

This rating provides confidence in the FET's capability to conduct significant currents, suitable for many power applications.

Maximum Drain-Source On Resistance: 0.78 ohm

Low on-resistance ensures efficient power delivery and minimal energy losses in operating conditions.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design, making installation and repairs straightforward.

Case Connection: ISOLATED

Isolation of the case connection enhances safety and prevents malfunction due to unintended ground loops.

Technical Specifications

Power Field Effect Transistors (FET) STF7NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.78 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF7NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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