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STF5N52U

STMicroelectronics

STF5N52U by STMicroelectronics

STF5N52U by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 525V breakdown voltage and a max drain current of 4.4A. It operates in enhancement mode with a power dissipation of 25W. Ideal for high-voltage circuits, it ensures reliable performance in compact designs.

Median Price

$0.782

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 182 parts In-Stock

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$0.690

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Verical

USA . 182 parts In-Stock

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$0.874

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$0.849

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$0.849

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Digiode

USA . 445 parts In-Stock

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$0.656

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Vyrian

USA . 3,081 parts In-Stock

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Anansix

USA . 401 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 393 parts In-Stock

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Bristol Electronics

USA . 393 parts In-Stock

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$1.012

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$0.945

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$1.012

$0.945

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Dan-Mar Components

USA . 393 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Ampacity Inc.

Singapore . 182 parts In-Stock

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$0.590

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Corphita

USA . 121 parts In-Stock

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$0.621

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$0.621

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IDEA Electronic Components Group

UK . 2,362 parts In-Stock

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$0.902

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$0.811

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MKK Technologies

India . 1,381 parts In-Stock

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$1.695

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DigiPath Technology Company

USA . 1,381 parts In-Stock

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$1.695

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AZTECH Wire

Italy . 214 parts In-Stock

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$16.400

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,712 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,680 parts In-Stock

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Perfect Parts

USA . 1,326 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 240 parts In-Stock

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$1.078

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$1.078

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Overview

Elevate your power management solutions with the STF5N52U from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality N-channel Power FET is designed for optimal efficiency in switching applications, delivering exceptional performance and reliability. With its robust avalanche capabilities and compact design, it seamlessly integrates into various systems, ensuring durability and longevity. Choose STF5N52U for superior quality that empowers your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures high reliability and ruggedness, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency compared to P-channel options, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse voltage, enhancing the durability and safety of the circuit.

Transistor Application: SWITCHING

Optimized for switching applications allows for fast operation and makes it suitable for various electronic devices and power management roles.

Minimum DS Breakdown Voltage: 525 V

High breakdown voltage is critical for applications involving high voltages, ensuring reliable operation without failure.

Package Shape: RECTANGULAR

Rectangular packages offer efficient space utilization on circuit boards, allowing for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are easier to solder, contributing to overall reliability in installations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low off-state current, resulting in energy savings and improved efficiency in electronic circuits.

Maximum Pulsed Drain Current (IDM): 17.6 A

High pulsed drain current capacity allows the product to handle demanding transients, suitable for robust applications.

Avalanche Energy Rating (EAS): 170 mJ

A high avalanche energy rating ensures that the transistor can safely dissipate energy during fault conditions.

Maximum Drain Current (Abs) (ID): 4.4 A

This capability allows the FET to handle significant current loads, making it suitable for a variety of power applications.

No. of Terminals: 3

The three-terminal configuration simplifies design and connection, facilitating integration into various circuits.

Maximum Power Dissipation (Abs): 25 W

With a high power dissipation rating, this FET can handle substantial heat, reducing the need for additional cooling solutions.

Package Style (Meter): FLANGE MOUNT

The flange mount design provides secure mounting options, helping maintain stability and reliability in circuit assemblies.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for low power consumption and high-speed operation, making it ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

High operating temperature tolerance ensures performance stability under varying conditions, fitting for demanding environments.

Transistor Element Material: SILICON

Silicon is well-known for its excellent electronic properties, enabling efficient operation in a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces the chances of oxidation, ensuring robust electrical connections.

Maximum Drain Current (ID): 4.4 A

Allows for handling higher loads and ensures stability in performance across various applications.

Maximum Drain-Source On Resistance: 1.5 ohm

Low on-resistance reduces power loss and improves efficiency, making this FET suitable for power switching applications.

Terminal Position: SINGLE

Single terminal positioning facilitates easy integration into circuits and simplifies layout design.

Case Connection: ISOLATED

Isolated case connection enhances safety and performance by reducing the risk of short circuits or interference.

Technical Specifications

Power Field Effect Transistors (FET) STF5N52U attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

170 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (Abs) (ID):

4.4 A

Maximum Drain Current (ID):

4.4 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

17.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF5N52U Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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