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STF5N95K3

STMicroelectronics

STF5N95K3 by STMicroelectronics

STF5N95K3 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 950V breakdown voltage and 4A max drain current. It operates in enhancement mode with a power dissipation of up to 25W. Ideal for high-voltage circuits, it ensures reliable performance in compact designs.

Median Price

$4.130

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 931 parts In-Stock

1+ parts

$4.130

100+ parts

$1.913

1k+ parts

$1.460

10k+ parts

$1.414

931

$4.130

$1.913

$1.460

$1.414

Avnet

USA . 10,600 parts In-Stock

1+ parts

-

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10,600

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Distributors (In-Stock)

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Digiode

USA . 4,611 parts In-Stock

1+ parts

$2.024

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-

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4,611

$2.024

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Vyrian

USA . 7,661 parts In-Stock

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7,661

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,202 parts In-Stock

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1,202

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Sunrise Surplus Inc.

USA . 32 parts In-Stock

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32

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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2

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Dan-Mar Components

USA . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 295 parts In-Stock

1+ parts

$0.431

100+ parts

-

1k+ parts

$0.388

10k+ parts

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295

$0.431

-

$0.388

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MKK Technologies

India . 930 parts In-Stock

1+ parts

$0.810

100+ parts

-

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930

$0.810

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DigiPath Technology Company

USA . 930 parts In-Stock

1+ parts

$0.810

100+ parts

-

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930

$0.810

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Corphita

USA . 1,017 parts In-Stock

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$1.917

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$1.917

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Microchip USA

USA . 9,692 parts In-Stock

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$20.475

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9,692

$20.475

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,563 parts In-Stock

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Perfect Parts

USA . 5,181 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,723 parts In-Stock

1+ parts

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$0.515

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1,723

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$0.515

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Epart123

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Overview

Unlock the power of reliability and efficiency with the STF5N95K3 from STMicroelectronics, a leader in semiconductor innovation. This high-performance N-channel FET is engineered for seamless switching applications, providing superior quality and long-lasting durability. With an impressive breakdown voltage and built-in diode, it delivers exceptional value for your projects while enhancing energy management. Trust in STMicroelectronics to elevate your designs with cutting-edge technology and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight and durable packaging, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower on-state resistance and better efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and facilitates easier circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in high-speed operations.

Minimum DS Breakdown Voltage: 950 V

A high breakdown voltage increases the reliability of the FET in high-voltage environments.

Package Shape: RECTANGULAR

The rectangular package allows for efficient use of space on PCBs, making it ideal for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and ease of soldering for robust connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides high input impedance, which minimizes power consumption during operation.

Maximum Pulsed Drain Current (IDM): 16 A

The high pulsed drain current capability allows for handling of more demanding applications.

Avalanche Energy Rating (EAS): 100 mJ

This rating indicates good robustness against transient voltage spikes, enhancing circuit reliability.

Maximum Drain Current (Abs) (ID): 4 A

Allows handling of higher current loads without risk of damage, ensuring stable performance under varying conditions.

No. of Terminals: 3

Three terminals allow for simple circuit integration and versatile configurations.

Maximum Power Dissipation (Abs): 25 W

This high power dissipation capability enables effective thermal management, prolonging device life.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides secure installation and improved heat dissipation, contributing to system reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation and low power consumption, making it ideal for modern applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature offers versatility in various environments and conditions.

Transistor Element Material: SILICON

Silicon is a widely used material that provides stability and reliability in transistor operation.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures oxidation resistance over time.

Maximum Drain Current (ID): 4 A

Allows for handling of higher current loads without risk of damage, ensuring stable performance under varying conditions.

Maximum Drain-Source On Resistance: 3.5 ohm

Low on-resistance reduces power loss and improves efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and minimizes complexity during design.

Case Connection: ISOLATED

Isolated case connections provide protection against electrical leakage, enhancing safety in circuit applications.

Technical Specifications

Power Field Effect Transistors (FET) STF5N95K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF5N95K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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