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STF57N65M5

STMicroelectronics

STF57N65M5 by STMicroelectronics

STF57N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, 168A IDM, and 0.063 ohm RDS(on). Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with PLASTIC/EPOXY body material.

Median Price

$8.820

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 937 parts In-Stock

1+ parts

$7.386

100+ parts

$4.994

1k+ parts

-

10k+ parts

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937

$7.386

$4.994

-

-

Farnell

UK . 985 parts In-Stock

1+ parts

$7.660

100+ parts

$4.450

1k+ parts

$4.360

10k+ parts

-

985

$7.660

$4.450

$4.360

-

Chip1Stop

Japan . 611 parts In-Stock

1+ parts

$9.980

100+ parts

$5.060

1k+ parts

$4.370

10k+ parts

-

611

$9.980

$5.060

$4.370

-

Mouser Electronics

USA . 1,996 parts In-Stock

1+ parts

$10.000

100+ parts

$5.260

1k+ parts

-

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-

1,996

$10.000

$5.260

-

-

DigiKey

USA . 1,078 parts In-Stock

1+ parts

$10.000

100+ parts

$5.120

1k+ parts

$4.601

10k+ parts

-

1,078

$10.000

$5.120

$4.601

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

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-

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1,000

-

-

-

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Verical

USA . 937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.736

10k+ parts

-

937

-

-

$3.736

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 378 parts In-Stock

1+ parts

$5.320

100+ parts

-

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-

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378

$5.320

-

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Vyrian

USA . 1,110 parts In-Stock

1+ parts

$5.600

100+ parts

-

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-

10k+ parts

-

1,110

$5.600

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-

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Anansix

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

-

-

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Cogito LLC

Ukraine . 350 parts In-Stock

1+ parts

-

100+ parts

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350

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Bristol Electronics

USA . 118 parts In-Stock

1+ parts

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118

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Sunrise Surplus Inc.

USA . 100 parts In-Stock

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100+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,285 parts In-Stock

1+ parts

$1.463

100+ parts

-

1k+ parts

$1.317

10k+ parts

-

1,285

$1.463

-

$1.317

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MKK Technologies

India . 872 parts In-Stock

1+ parts

$2.751

100+ parts

-

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872

$2.751

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DigiPath Technology Company

USA . 872 parts In-Stock

1+ parts

$2.751

100+ parts

-

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872

$2.751

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Corphita

USA . 4,686 parts In-Stock

1+ parts

$5.040

100+ parts

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4,686

$5.040

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Microchip USA

USA . 370 parts In-Stock

1+ parts

$31.136

100+ parts

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370

$31.136

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Lixinc

USA . 11,025 parts In-Stock

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11,025

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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A-Z Elektronik GmbH

Germany . 6,719 parts In-Stock

1+ parts

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6,719

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Alle Elektronik GmbH

Germany . 3,639 parts In-Stock

1+ parts

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3,639

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Parana Technologies

USA . 2,047 parts In-Stock

1+ parts

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100+ parts

$1.749

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2,047

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$1.749

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Perfect Parts

USA . 1,758 parts In-Stock

1+ parts

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1,758

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Kepictronics

USA . 37 parts In-Stock

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37

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Overview

Enhance your electronic projects with the STF57N65M5 by STMicroelectronics, a top-quality Power FET that offers unrivaled performance and reliability. Manufactured by industry leader STMicroelectronics, this N-CHANNEL transistor with built-in diode is ideal for switching applications, providing a breakthrough in efficiency and power management. With a minimum DS breakdown voltage of 650V and an impressive maximum pulsed drain current of 168A, this transistor guarantees optimal functionality and long-term durability. Upgrade your designs today with the STF57N65M5 and experience the difference in performance and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high efficiency and fast switching speeds, making them suitable for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect against reverse polarity, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can efficiently control the flow of power in various electronic circuits.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows the transistor to handle high voltage applications, providing robust performance under high stress conditions.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures easy installation and mounting in electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer secure connections and ease of soldering during assembly, enhancing the overall reliability of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easy to control and operate, making them suitable for various power management applications.

Maximum Pulsed Drain Current (IDM): 168 A

With a high pulsed drain current rating, this transistor can handle sudden surges in power, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 960 mJ

The high avalanche energy rating ensures the transistor can withstand voltage spikes and transient conditions, enhancing its reliability in tough environments.

No. of Terminals: 3

Having three terminals allows for easy connectivity in circuits, enabling efficient power flow control.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and heat dissipation, ensuring optimal performance in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this transistor suitable for energy-efficient applications.

Transistor Element Material: SILICON

Silicon transistors provide high performance and reliability, making them ideal for a wide range of applications.

Maximum Drain Current (ID): 42 A

With a high drain current rating, this transistor can handle continuous power flow, ensuring stable operation in demanding conditions.

Maximum Drain-Source On Resistance: 0.063 ohm

The low drain-source on resistance minimizes power loss and heat generation, improving the efficiency of the transistor in power switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and circuit design, making this transistor user-friendly and easy to integrate.

Case Connection: ISOLATED

The isolated case connection provides protection against electrical interference and improves the overall reliability of the transistor in complex electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) STF57N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

960 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.063 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

168 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF57N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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