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STF20NK50Z

STMicroelectronics

STF20NK50Z by STMicroelectronics

STF20NK50Z by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and 68A max pulsed drain current. It operates in enhancement mode with a low on-resistance of 0.27Ω. This versatile transistor suits various power management needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 9,750 parts In-Stock

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9,750

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Digiode

USA . 2,741 parts In-Stock

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2,741

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Vyrian

USA . 2,487 parts In-Stock

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2,487

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Anansix

USA . 2,401 parts In-Stock

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2,401

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,220 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

$1.386

10k+ parts

-

2,220

$1.540

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$1.386

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MKK Technologies

India . 1,829 parts In-Stock

1+ parts

$2.896

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1,829

$2.896

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DigiPath Technology Company

USA . 1,829 parts In-Stock

1+ parts

$2.896

100+ parts

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1,829

$2.896

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AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$20.610

100+ parts

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445

$20.610

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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A-Z Elektronik GmbH

Germany . 5,067 parts In-Stock

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5,067

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Corphita

USA . 3,906 parts In-Stock

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3,906

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Perfect Parts

USA . 1,098 parts In-Stock

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1,098

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Alle Elektronik GmbH

Germany . 1,005 parts In-Stock

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1,005

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Parana Technologies

USA . 688 parts In-Stock

1+ parts

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100+ parts

$1.841

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688

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$1.841

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Overview

Elevate your designs with the STF20NK50Z from STMicroelectronics—a trusted leader in semiconductor technology. This N-channel power FET excels in efficiency and reliability, perfect for demanding switching applications. With its robust performance under high voltages and temperatures, it ensures optimal power management. Experience unmatched quality and durability that add real value to your projects, making them more efficient and cost-effective. Choose STF20NK50Z for superior results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material helps ensure reliable performance and protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and faster switching speeds, making them ideal for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and adds protection against voltage spikes, enhancing reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power, reducing energy loss.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage makes this FET suitable for high-voltage applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs, allowing for more compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and stable electrical connections, suitable for various PCB designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation contributes to better control over the device, ensuring efficient performance.

Maximum Pulsed Drain Current (IDM): 68 A

This high pulsed drain current rating allows for greater flexibility in high-performance applications.

Avalanche Energy Rating (EAS): 850 mJ

A high avalanche energy rating indicates the ability to withstand voltage spikes, ensuring durability.

Maximum Drain Current (Abs) (ID): 17 A

This abs maximum drain current makes the FET suitable for a range of applications without overheating.

No. of Terminals: 3

The 3-terminal configuration allows for straightforward integration into designs, promoting ease of use.

Maximum Power Dissipation (Abs): 40 W

A high power dissipation capability means that this FET can handle higher loads, adding to its versatility.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides additional structural support in operational settings, ensuring stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to low power consumption and high-speed switching, making them efficient.

Maximum Operating Temperature: 150 °C

High operating temperature tolerance enables the FET to perform reliably in demanding environments.

Transistor Element Material: SILICON

Silicon material offers excellent electrical properties, ensuring consistent performance across applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, contributing to reliability.

Maximum Drain Current (ID): 17 A

This maximum drain current reinforces reliability and performance, suitable for various load conditions.

Maximum Drain-Source On Resistance: 0.27 ohm

A low on-resistance ensures efficient power transfer with minimal heat generation, enhancing performance.

Terminal Position: SINGLE

A single terminal position simplifies the design process and reduces PCB complexity.

Case Connection: ISOLATED

An isolated case connection enhances safety and minimizes the risk of unwanted short circuits.

Technical Specifications

Power Field Effect Transistors (FET) STF20NK50Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.27 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF20NK50Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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