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STF14NM65N

STMicroelectronics

STF14NM65N by STMicroelectronics

STF14NM65N by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 12A max drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,141 parts In-Stock

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Digiode

USA . 670 parts In-Stock

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670

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Anansix

USA . 666 parts In-Stock

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666

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IDEA Electronic Components Group

UK . 1,408 parts In-Stock

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$1.145

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$1.031

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MKK Technologies

India . 1,868 parts In-Stock

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$2.154

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DigiPath Technology Company

USA . 1,868 parts In-Stock

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AZTECH Wire

Italy . 1,134 parts In-Stock

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$21.260

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,273 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,796 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,099 parts In-Stock

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Parana Technologies

USA . 1,764 parts In-Stock

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$1.370

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Overview

Elevate your designs with the STF14NM65N from STMicroelectronics, a powerhouse in the world of Power FETs. Known for their high quality and reliability, STMicroelectronics ensures optimal performance across various applications from industrial machinery to consumer electronics. With its impressive switching capabilities and robust build, this N-channel transistor delivers exceptional efficiency and durability, empowering you to create innovative solutions that stand the test of time. Unlock the potential of your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally provide higher electron mobility, resulting in faster switching speeds and better efficiency in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode allows for easy integration in circuits requiring flyback or freewheeling diodes, simplifying design and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient performance in power management and control circuits.

Minimum DS Breakdown Voltage: 650 V

With a breakdown voltage of 650V, this FET can handle high-voltage applications, ensuring reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it suitable for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliable electrical connections, suitable for diverse mounting applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers greater versatility by enabling the transistor to conduct fully only when an adequate gate voltage is applied.

Maximum Pulsed Drain Current (IDM): 48 A

A high pulsed drain current capability allows this FET to handle surge currents effectively, enhancing its performance in transient applications.

Avalanche Energy Rating (EAS): 300 mJ

A high avalanche energy rating means the FET can withstand high energy spikes, increasing reliability in rugged applications.

Maximum Drain Current (Abs) (ID): 12 A

With a maximum continuous drain current of 12A, this FET is suitable for mid-range power applications.

No. of Terminals: 3

The 3-terminal design simplifies circuit integration while maintaining essential functionality for switching applications.

Maximum Power Dissipation (Abs): 30 W

A power dissipation capacity of 30W allows the FET to operate efficiently in high-power applications, maintaining thermal stability.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides enhanced thermal management and mechanical stability, making it easier to integrate into various systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures low on-resistance and high-speed operation, ideal for modern power electronic applications.

Maximum Operating Temperature: 150 °C

Operating up to 150 °C ensures reliability in high-temperature environments, making it suitable for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon material offers excellent electronic properties, making it the standard choice for high-performance transistors.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Maximum Drain Current (ID): 12 A

This specification is repeated, emphasizing the FET's capability to handle substantial current demands in various applications.

Maximum Drain-Source On Resistance: 0.38 ohm

With a low on-resistance of 0.38 ohm, this FET minimizes power loss during operation, improving overall efficiency.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout and integration, making it user-friendly for engineers.

Case Connection: ISOLATED

Isolated case connections enhance safety and reduce the risk of short circuits, making the FET ideal for sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF14NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF14NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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