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STF10NM65N

STMicroelectronics

STF10NM65N by STMicroelectronics

STF10NM65N by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 650V breakdown voltage and 36A pulsed drain current. It operates in enhancement mode with a max power dissipation of 25W. Its compact design ensures efficient thermal management in various electronic circuits.

Median Price

$1.911

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,000 parts In-Stock

1+ parts

$1.432

100+ parts

$1.432

1k+ parts

$1.432

10k+ parts

$1.432

1,000

$1.432

$1.432

$1.432

$1.432

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$2.390

100+ parts

-

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1,000

$2.390

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-

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Verical

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Distributors (In-Stock)

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Digiode

USA . 1,296 parts In-Stock

1+ parts

$1.360

100+ parts

-

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1,296

$1.360

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-

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Bristol Electronics

USA . 997 parts In-Stock

1+ parts

$1.800

100+ parts

$1.116

1k+ parts

$0.675

10k+ parts

-

997

$1.800

$1.116

$0.675

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Vyrian

USA . 13,168 parts In-Stock

1+ parts

-

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13,168

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Anansix

USA . 1,953 parts In-Stock

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1,953

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Dan-Mar Components

USA . 997 parts In-Stock

1+ parts

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997

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 853 parts In-Stock

1+ parts

$0.688

100+ parts

-

1k+ parts

$0.619

10k+ parts

-

853

$0.688

-

$0.619

-

Corphita

USA . 612 parts In-Stock

1+ parts

$1.289

100+ parts

-

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612

$1.289

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MKK Technologies

India . 2,337 parts In-Stock

1+ parts

$1.294

100+ parts

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2,337

$1.294

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

$1.294

100+ parts

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1k+ parts

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2,337

$1.294

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Component Stockers USA

USA . 2,315 parts In-Stock

1+ parts

$1.640

100+ parts

$1.640

1k+ parts

$1.640

10k+ parts

-

2,315

$1.640

$1.640

$1.640

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Andel Nordic

Denmark . 1,118 parts In-Stock

1+ parts

$8.077

100+ parts

-

1k+ parts

$7.754

10k+ parts

$7.754

1,118

$8.077

-

$7.754

$7.754

AZTECH Wire

Italy . 332 parts In-Stock

1+ parts

$9.850

100+ parts

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332

$9.850

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Alle Elektronik GmbH

Germany . 4,151 parts In-Stock

1+ parts

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4,151

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Parana Technologies

USA . 1,291 parts In-Stock

1+ parts

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100+ parts

$0.823

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1,291

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$0.823

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Elevate your designs with the STF10NM65N from STMicroelectronics—a powerhouse N-channel MOSFET engineered for exceptional efficiency and reliability. Renowned for their commitment to innovation, STMicroelectronics delivers unmatched quality in every component, ensuring seamless performance in high-voltage applications. Experience reduced energy losses and enhanced switching capabilities, making it ideal for power management and industrial automation projects. Unlock the potential of your systems while enjoying the peace of mind that comes from partnering with a leader in semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package enhances the durability and reliability of the transistor, ensuring it can withstand various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for higher efficiency and better performance in switching applications, making this FET a strong choice for high-speed operations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit protection by allowing for safe reverse current flow, which is essential in many power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high efficiency, suitable for a wide range of electronic circuits.

Minimum DS Breakdown Voltage: 650 V

A minimum breakdown voltage of 650V ensures reliability in high-voltage applications, enhancing the versatility of this FET in various circuits.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier mounting and installation in various designs, improving overall layout efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and stability, making the transistor suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and lower power consumption in electronics, making this product ideal for modern applications.

Maximum Pulsed Drain Current (IDM): 36 A

A high pulsed drain current capability indicates the FET can handle significant power surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 300 mJ

An avalanche energy rating of 300 mJ ensures protection against damaging transient conditions, enhancing the reliability of the circuit.

Maximum Drain Current (Abs) (ID): 9 A

With a maximum drain current rating of 9A, this FET can power a variety of devices, making it versatile for different applications.

No. of Terminals: 3

Three terminals provide flexibility in design and functionality, enabling various circuit configurations while maintaining ease of integration.

Maximum Power Dissipation (Abs): 25 W

A maximum power dissipation of 25W indicates that the FET can manage heat effectively, reducing the risk of overheating in high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure mounting, which enhances thermal management and improves reliability in operational settings.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for low gate current and high input impedance, making this FET efficient in control applications.

Maximum Operating Temperature: 150 °C

Operating up to 150 °C ensures robustness in high-temperature environments, making this FET suitable for demanding industrial applications.

Transistor Element Material: SILICON

Silicon material handles high thermal and electrical performance, ensuring stable operation even under varying load conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and resistance to corrosion, ensuring long-term reliability in electronic applications.

Maximum Drain Current (ID): 9 A

This reiteration of the 9A max drain current signifies its capability to handle well in both continuous and pulsed conditions, maintaining strong performance across applications.

Maximum Drain-Source On Resistance: 0.48 ohm

0.48 ohm on-resistance minimizes energy loss during operation, making this transistor an efficient choice for power management applications.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout and design, facilitating easier integration into various electronic systems.

Case Connection: ISOLATED

Isolated case connection prevents thermal and electrical interference, ensuring stable operation and enhancing safety in applications.

Technical Specifications

Power Field Effect Transistors (FET) STF10NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.48 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF10NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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