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STE45NK80ZD

STMicroelectronics

STE45NK80ZD by STMicroelectronics

STE45NK80ZD from STMicroelectronics is a powerful N-channel MOSFET designed for efficient switching applications. It features an 800V breakdown voltage, 180A pulsed drain current, and a max power dissipation of 600W. Ideal for high-performance power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,854 parts In-Stock

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Digiode

USA . 1,572 parts In-Stock

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Anansix

USA . 816 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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IDEA Electronic Components Group

UK . 337 parts In-Stock

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$0.370

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$0.333

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337

$0.370

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$0.333

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MKK Technologies

India . 968 parts In-Stock

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$0.695

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968

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DigiPath Technology Company

USA . 968 parts In-Stock

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$0.695

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968

$0.695

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AZTECH Wire

Italy . 344 parts In-Stock

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$20.600

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QUARKTWIN TECHNOLOGY LTD

USA . 28,290 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,913 parts In-Stock

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Parana Technologies

USA . 992 parts In-Stock

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$0.442

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Corphita

USA . 590 parts In-Stock

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Kepictronics

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Overview

Elevate your power management solutions with the STE45NK80ZD from STMicroelectronics, a leader in innovative semiconductor technology. This high-performance N-channel FET excels in demanding applications, delivering outstanding efficiency and reliability. With an impressive breakdown voltage of 800V and robust current handling, it ensures seamless operation even under extreme conditions. Choose STMicroelectronics for quality you can trust, empowering your designs with performance and durability that set you apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material ensures durability and resistance to environmental factors, making the FET reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency in switching applications, making this component suitable for high-speed operations.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode improves circuit design flexibility by providing protection against back EMF, enhancing overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is ideal for power management and control in various electronic circuits.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can operate reliably in high-voltage environments, offering more design versatility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout on PCBs, optimizing space while maintaining thermal performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation means lower power loss and higher efficiency, making this FET suitable for energy-sensitive applications.

Maximum Pulsed Drain Current (IDM): 180 A

The ability to handle high pulsed drain currents makes this FET capable of managing significant transient loads in switching applications.

Avalanche Energy Rating (EAS): 1200 mJ

A high avalanche energy rating offers protection against voltage spikes, ensuring the FET can withstand unforeseen electrical stress.

Maximum Drain Current (Abs) (ID): 45 A

This maximum rating allows for substantial current handling, making it suitable for high-power applications without thermal failures.

No. of Terminals: 4

Having four terminals provides flexibility in circuit design, allowing for easier integration into complex systems.

Maximum Power Dissipation (Abs): 600 W

High power dissipation capacity ensures performance reliability under heavy load conditions, making this FET durable in demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style improves thermal management and mechanical stability, crucial for high-current applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures fast switching speeds and high efficiency, advantageous for modern electronic designs.

Maximum Operating Temperature: 150 °C

Designed to operate at high temperatures, this FET is suitable for harsh environments without compromising performance.

Transistor Element Material: SILICON

Silicon as the semiconductor material provides excellent electrical properties and stability, making this FET reliable over its lifespan.

Terminal Finish: NICKEL

A nickel terminal finish enhances solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain Current (ID): 45 A

Repeated maximum drain current rating indicates consistent performance even under heavy load situations.

Maximum Drain-Source On Resistance: 0.13 ohm

A low on-resistance figure improves energy efficiency and reduces heat generation during operation, ideal for power-sensitive designs.

Terminal Position: UPPER

Upper terminal positioning is advantageous for layout design in PCBs, allowing for easier routing and connections.

Case Connection: ISOLATED

Isolated case connections enhance safety by preventing unintended electrical interactions, crucial for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) STE45NK80ZD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

NICKEL

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE45NK80ZD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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