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STE47N50

STMicroelectronics

STE47N50 by STMicroelectronics

STE47N50 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a 500V breakdown voltage, 47A max drain current, and 450W power dissipation. Ideal for high-performance power management in various electronic devices.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Digiode

USA . 809 parts In-Stock

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809

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Vyrian

USA . 557 parts In-Stock

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Anansix

USA . 192 parts In-Stock

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Pegasus Components GmbH

Germany . 6 parts In-Stock

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ABC Electronics Ltd.

UK . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 2,314 parts In-Stock

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$1.574

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$1.417

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2,314

$1.574

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$1.417

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MKK Technologies

India . 305 parts In-Stock

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$2.960

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305

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DigiPath Technology Company

USA . 305 parts In-Stock

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$2.960

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305

$2.960

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Corphita

USA . 3,807 parts In-Stock

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Parana Technologies

USA . 1,490 parts In-Stock

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$1.882

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Kepictronics

USA . 553 parts In-Stock

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553

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Overview

Unlock the power of efficiency with the STE47N50 from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This N-channel power FET is designed for optimal performance in demanding switching applications, providing superior reliability and exceptional thermal management. With its robust construction and innovative features, you can trust it to enhance system durability while minimizing energy loss. Elevate your projects and enjoy the benefits of ST's unparalleled quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for flyback protection in inductive load applications, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product ensures fast and efficient operation in power management systems.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage provides a safety margin for power applications, allowing it to handle high-voltage scenarios.

Package Shape: RECTANGULAR

The rectangular package shape facilitates ease of mounting and integration into various circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers high input impedance and low power consumption during standby, optimizing overall system efficiency.

Maximum Pulsed Drain Current (IDM): 188 A

The capability to handle high pulsed currents makes it suitable for applications where brief high-current spikes are common.

Maximum Drain Current (Abs) (ID): 47 A

A high maximum drain current allows the FET to support demanding applications, providing reliable performance under heavy load.

No. of Terminals: 4

Four terminals provide versatility in circuit design, enabling more complex configurations tailored to specific applications.

Maximum Power Dissipation (Abs): 450 W

A high power dissipation rating ensures the FET can handle substantial power without overheating, enhancing reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure attachment and efficient heat dissipation, critical for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers excellent switching speeds and low power consumption, making it a preferred choice for modern electronic designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature broadens the range of environments in which this FET can reliably operate.

Transistor Element Material: SILICON

Silicon provides optimal performance characteristics for FETs, ensuring stability and efficiency in various applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-lasting connections.

Maximum Drain-Source On Resistance: 0.1 ohm

Low on-resistance minimizes energy loss during operation, enhancing overall efficiency in power conversion applications.

Terminal Position: UPPER

Upper terminal positioning allows for straightforward layout and soldering in circuit designs, improving manufacturing efficiency.

Case Connection: ISOLATED

Isolation of the case connection enhances safety by reducing the risk of unintended shorts to the case.

Reference Standard: UL RECOGNIZED

UL recognition signifies adherence to rigorous safety standards, assuring users of device reliability and safety.

Technical Specifications

Power Field Effect Transistors (FET) STE47N50 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

47 A

Maximum Drain Current (ID):

47 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

188 A

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE47N50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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