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STE40NC60

STMicroelectronics

STE40NC60 by STMicroelectronics

STE40NC60 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 40A max drain current, and 460W power dissipation. Ideal for high-efficiency circuits in demanding environments.

Median Price

$31.372

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 146 parts In-Stock

1+ parts

$39.310

100+ parts

-

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146

$39.310

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EBV Elektronik

Germany . 690 parts In-Stock

1+ parts

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690

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Verical

USA . 100 parts In-Stock

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-

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$23.434

1k+ parts

$21.579

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$21.136

100

-

$23.434

$21.579

$21.136

Avnet

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 19 parts In-Stock

1+ parts

$23.457

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19

$23.457

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Digiode

USA . 4,340 parts In-Stock

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$39.615

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4,340

$39.615

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Vyrian

USA . 7,257 parts In-Stock

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7,257

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Anansix

USA . 1,278 parts In-Stock

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1,278

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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70

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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40

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IBS Electronics

USA . 20 parts In-Stock

1+ parts

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100+ parts

$20.748

1k+ parts

$20.566

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20

-

$20.748

$20.566

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Dan-Mar Components

USA . 19 parts In-Stock

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GES GmbH

Germany . 10 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$0.734

100+ parts

-

1k+ parts

$0.661

10k+ parts

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1,499

$0.734

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$0.661

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MKK Technologies

India . 1,211 parts In-Stock

1+ parts

$1.381

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1,211

$1.381

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DigiPath Technology Company

USA . 1,211 parts In-Stock

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$1.381

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1,211

$1.381

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Allen Electronics Distributors

USA . 17 parts In-Stock

1+ parts

$33.410

100+ parts

$25.960

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17

$33.410

$25.960

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Corphita

USA . 891 parts In-Stock

1+ parts

$37.530

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891

$37.530

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Microchip USA

USA . 8,568 parts In-Stock

1+ parts

$97.037

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8,568

$97.037

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Alle Elektronik GmbH

Germany . 3,947 parts In-Stock

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3,947

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Parana Technologies

USA . 1,572 parts In-Stock

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$0.878

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1,572

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$0.878

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Perfect Parts

USA . 380 parts In-Stock

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Kepictronics

USA . 265 parts In-Stock

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265

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Assy Fe

Spain . 5 parts In-Stock

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5

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Overview

Unlock unparalleled efficiency and reliability with the STE40NC60 from STMicroelectronics. Designed for high-performance power switching applications, this N-channel FET delivers robust performance with a 600V breakdown voltage and exceptional thermal management. With ST's renowned quality assurance, you can trust in its durability and precision. Elevate your projects today—experience the benefits of superior energy efficiency and resilience that lead to longer operational life and reduced costs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures a lightweight and cost-effective solution, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their better efficiency and higher electron mobility, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection and simplifies circuit design, providing greater reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this FET can handle rapid on-off operations making it perfect for power management applications.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage enhances reliability and makes this FET suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape ensures more efficient use of space in PCB designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation is advantageous for low power consumption in idle states, which improves overall efficiency.

Maximum Pulsed Drain Current (IDM): 160 A

With a high pulsed drain current rating, this FET can handle substantial loads, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1150 mJ

A high avalanche energy rating protects against unexpected voltage spikes, thereby increasing reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 40 A

A maximum drain current rating of 40 A ensures ample capacity for most switching applications.

No. of Terminals: 4

Four terminals provide flexibility in circuit design, enabling versatile configurations.

Maximum Power Dissipation (Abs): 460 W

With a maximum power dissipation of 460 W, this FET can efficiently handle significant power without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for easier heat dissipation and installation in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to higher switching speeds and greater efficiency, which is essential in modern electronic applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for reliable performance in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the elemental material offers excellent thermal stability and enhanced performance characteristics.

Maximum Drain Current (ID): 40 A

This specification assures that this FET is capable of handling high current loads, which is crucial for power applications.

Maximum Drain-Source On Resistance: 0.13 ohm

Low on-resistance minimizes power loss during operation, leading to greater overall efficiency.

Terminal Position: UPPER

An upper terminal position facilitates easier access and optimal layout configurations on circuit boards.

Case Connection: ISOLATED

Isolation of the case enhances safety by reducing risks of short circuits and ensures compliance with safety standards.

Technical Specifications

Power Field Effect Transistors (FET) STE40NC60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1150 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE40NC60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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