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STE40NK90ZD

STMicroelectronics

STE40NK90ZD by STMicroelectronics

STE40NK90ZD from STMicroelectronics is a powerful N-channel FET designed for switching applications, featuring a 900V breakdown voltage and 40A max drain current. It offers high efficiency with a low on-resistance of 0.18Ω and can handle up to 600W power dissipation. Ideal for robust power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,824 parts In-Stock

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Vyrian

USA . 2,005 parts In-Stock

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2,005

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Anansix

USA . 1,251 parts In-Stock

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Zilex Electronics Inc.

Canada . 50 parts In-Stock

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50

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IDEA Electronic Components Group

UK . 1,723 parts In-Stock

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$0.443

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-

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$0.398

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1,723

$0.443

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$0.398

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MKK Technologies

India . 372 parts In-Stock

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$0.832

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372

$0.832

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DigiPath Technology Company

USA . 372 parts In-Stock

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$0.832

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372

$0.832

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AZTECH Wire

Italy . 620 parts In-Stock

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$14.960

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620

$14.960

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Component Stockers USA

USA . 239 parts In-Stock

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$99.990

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$99.990

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Alle Elektronik GmbH

Germany . 4,432 parts In-Stock

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Parana Technologies

USA . 2,041 parts In-Stock

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$0.529

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$0.529

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Kepictronics

USA . 607 parts In-Stock

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Corphita

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Overview

Elevate your power solutions with the STE40NK90ZD from STMicroelectronics, a leader in innovative semiconductor technology. This N-channel FET, designed for efficient switching, boasts remarkable reliability and superior performance across diverse applications, from industrial equipment to renewable energy systems. With its impressive breakdown voltage and built-in diode, the STE40NK90ZD ensures robust operation while enhancing energy efficiency, making it the optimal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers a lightweight and cost-effective solution while ensuring durability and resistance to harsh environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency compared to P-channel devices, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature provides enhanced protection against back EMF and improves reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET efficiently handles rapid on/off states, making it suitable for power management and signal amplification.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this FET can operate in demanding electrical environments, thus providing reliability in various industrial applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and design integration in circuit boards, optimizing space utilization.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the transistor remains off until a sufficient gate voltage is applied, providing better control in switching applications.

Maximum Pulsed Drain Current (IDM): 160 A

The ability to handle high pulsed current makes this FET suitable for applications requiring high power spikes without damaging the device.

Avalanche Energy Rating (EAS): 1200 mJ

A high avalanche energy rating indicates robust performance under fault conditions, enhancing the reliability of the device in power circuits.

Maximum Drain Current (Abs) (ID): 40 A

This maximum drain current rating allows for substantial load handling, making this FET ideal for various power applications.

No. of Terminals: 4

Four terminals enable versatile connections and configurations, improving flexibility in circuit design and implementation.

Maximum Power Dissipation (Abs): 600 W

A high power dissipation capability ensures that the FET can operate efficiently under heavy load conditions without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mounting allows for easier installation and improved heat dissipation, benefiting applications where thermal management is critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for high switching speeds and low power loss, making it suitable for high-frequency and high-efficiency applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating provides flexibility for use in extreme environments, ensuring the FET remains functional in demanding applications.

Transistor Element Material: SILICON

Silicon is a widely used material known for its excellent electrical properties, reliability, and thermal stability, making it a standard choice for FETs.

Terminal Finish: NICKEL

Nickel terminal finish provides excellent corrosion resistance and ensures good electrical conductivity, enhancing the longevity and performance of the device.

Maximum Drain Current (ID): 40 A

This repeated spec confirms that the FET can sustain significant current loads, ensuring reliability for heavy power applications.

Maximum Drain-Source On Resistance: 0.18 ohm

A low on-resistance translates to lower power losses during operation, improving overall efficiency in switching applications.

Terminal Position: UPPER

An upper terminal position makes it convenient for mounting and facilitates optimal circuit layout for power applications.

Case Connection: ISOLATED

Isolated case connections enhance safety and allow for effective heat dissipation, minimizing interference with other components.

Technical Specifications

Power Field Effect Transistors (FET) STE40NK90ZD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

NICKEL

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE40NK90ZD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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