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STE48NM60

STMicroelectronics

STE48NM60 by STMicroelectronics

STE48NM60 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 600V breakdown voltage and max drain current of 48A. It supports high power dissipation up to 450W and operates at a max temp of 150 °C. Perfect for efficient power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,094 parts In-Stock

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Anansix

USA . 268 parts In-Stock

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268

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Digiode

USA . 170 parts In-Stock

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170

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IDEA Electronic Components Group

UK . 1,095 parts In-Stock

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$0.421

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$0.379

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$0.421

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$0.379

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MKK Technologies

India . 1,131 parts In-Stock

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$0.792

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$0.792

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DigiPath Technology Company

USA . 1,131 parts In-Stock

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$0.792

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$0.792

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AZTECH Wire

Italy . 706 parts In-Stock

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$12.350

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706

$12.350

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Component Stockers USA

USA . 660 parts In-Stock

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$99.990

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$99.990

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Alle Elektronik GmbH

Germany . 4,562 parts In-Stock

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Corphita

USA . 4,335 parts In-Stock

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Parana Technologies

USA . 1,387 parts In-Stock

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$0.504

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$0.504

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Kepictronics

USA . 266 parts In-Stock

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Overview

Unlock unparalleled performance with the STE48NM60 from STMicroelectronics, a leader in power solutions. This cutting-edge N-channel FET is engineered for efficient switching, delivering exceptional reliability and durability across diverse applications. With robust thermal management and superior breakdown voltage, it ensures optimal operation even in demanding environments. Choose STMicroelectronics for advanced technology that empowers your designs and enhances productivity, driving your projects toward success!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance in switching applications, making them suitable for high-efficiency power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse voltage, increasing reliability in power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast operation and energy efficiency, ideal for various power management tasks.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage makes this FET capable of handling high voltage applications, offering reliability under stress.

Package Shape: RECTANGULAR

The rectangular package design can facilitate easier mounting and installation in circuit boards, enhancing versatility in design.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors provide better control over the conduction state, increasing efficiency in switching operations.

Maximum Pulsed Drain Current (IDM): 192 A

High pulsed drain current capability allows for excellent performance in transient conditions, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 850 mJ

A high avalanche energy rating enhances the durability of the FET in surge conditions, making it a robust choice for critical applications.

Maximum Drain Current (Abs) (ID): 30 A

This maximum rating ensures that the FET can handle substantial continuous loads, suitable for high-power applications.

No. of Terminals: 4

The four-terminal design allows for more complex configurations and improved reliability in connections.

Maximum Power Dissipation (Abs): 450 W

A high power dissipation capability contributes to better thermal management, enabling longer device lifetimes in power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances mounting stability and thermal performance, making it durable for various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance and fast switching speeds, which are essential for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature expands application possibilities, allowing for use in harsh environments.

Transistor Element Material: SILICON

Silicon as a material provides good semiconductor properties and reliability, making this FET a dependable choice.

Maximum Drain Current (ID): 48 A

The elevated drain current rating allows for more power handling, making it suitable for high-demand applications.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance ensures minimal power loss during operation, increasing overall efficiency of power transfer.

Terminal Position: UPPER

Upper terminal positioning can improve accessibility for wiring and installation, making integration easier within devices.

Case Connection: ISOLATED

An isolated case connection enhances safety and reduces the risk of unwanted current paths, improving reliability in operation.

Technical Specifications

Power Field Effect Transistors (FET) STE48NM60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

48 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE48NM60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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