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STD9NM50N-1

STMicroelectronics

STD9NM50N-1 by STMicroelectronics

STD9NM50N-1 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 30A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,762 parts In-Stock

1+ parts

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8,762

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Digiode

USA . 4,439 parts In-Stock

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4,439

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Anansix

USA . 542 parts In-Stock

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542

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,835 parts In-Stock

1+ parts

$0.316

100+ parts

-

1k+ parts

$0.284

10k+ parts

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1,835

$0.316

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$0.284

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MKK Technologies

India . 708 parts In-Stock

1+ parts

$0.593

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708

$0.593

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DigiPath Technology Company

USA . 708 parts In-Stock

1+ parts

$0.593

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708

$0.593

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AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$18.120

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1,023

$18.120

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Alle Elektronik GmbH

Germany . 4,721 parts In-Stock

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4,721

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Corphita

USA . 2,196 parts In-Stock

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2,196

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Parana Technologies

USA . 1,251 parts In-Stock

1+ parts

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$0.377

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1,251

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$0.377

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Overview

Elevate your designs with the STD9NM50N-1 from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance N-channel power FET delivers exceptional switching efficiency and reliability for diverse applications, from industrial control to consumer electronics. With its robust construction and advanced technology, it ensures superior performance under demanding conditions, providing you with unmatched value and peace of mind for your projects. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body offers durability and protection against environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically provide higher efficiency and better performance in switching applications compared to P-channel types, enhancing overall circuit functionality.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and improved protection against reverse polarity, making it versatile for different applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET enables faster and more efficient operation in various electronic circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage of 500V allows the transistor to be used in high-voltage applications, increasing its versatility in different environments.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient board layout and integration into various designs, facilitating better space management.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure a secure and stable connection to PCBs, providing reliability in both temporary and permanent setups.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables the FET to have low off-state current, making it more power-efficient and better for battery-operated devices.

Maximum Pulsed Drain Current (IDM): 30 A

The ability to handle high pulsed drain currents makes this FET suitable for high-performance applications, supporting heavy loads without failure.

Avalanche Energy Rating (EAS): 150 mJ

A reasonably high avalanche energy rating indicates robustness and reliability, making it suitable for applications subjected to voltage surges.

Maximum Drain Current (Abs) (ID): 7.5 A

This maximum drain current rating provides good current capacity for a variety of power applications, allowing for efficient device operation.

No. of Terminals: 3

Having three terminals simplifies integration into circuits while providing necessary connections for functionality.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation capability suggests that this FET can handle significant power levels, making it a reliable choice for demanding applications.

Package Style (Meter): IN-LINE

The in-line package style is ideal for automated assembling techniques, improving manufacturing efficiency and reducing costs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOS technology provides high input impedance and fast switching capabilities, contributing to the transistor's efficiency and effectiveness in modern electronics.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in harsh environments, extending the range of potential applications.

Transistor Element Material: SILICON

Silicon is a widely used material in electronics, ensuring availability and compatibility with existing technology while offering good performance characteristics.

Maximum Drain Current (ID): 7.5 A

This specification, reiterating the 7.5 A drain current, confirms the FET's capability to handle sufficient current for effective circuit operations.

Maximum Drain-Source On Resistance: 0.56 ohm

A low on-resistance indicates reduced power losses during operation, improving the efficiency of the circuit and maintaining thermal performance.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design and assembly, allowing for efficient and straightforward integration into devices.

Technical Specifications

Power Field Effect Transistors (FET) STD9NM50N-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

7.5 A

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

.56 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD9NM50N-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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