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STD78N75F4

STMicroelectronics

STD78N75F4 by STMicroelectronics

STD78N75F4 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 70 A, a breakdown voltage of 75 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,744 parts In-Stock

1+ parts

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4,744

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Digiode

USA . 2,285 parts In-Stock

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2,285

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Anansix

USA . 1,815 parts In-Stock

1+ parts

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1,815

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,110 parts In-Stock

1+ parts

$0.650

100+ parts

-

1k+ parts

$0.585

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1,110

$0.650

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$0.585

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MKK Technologies

India . 651 parts In-Stock

1+ parts

$1.221

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651

$1.221

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DigiPath Technology Company

USA . 651 parts In-Stock

1+ parts

$1.221

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651

$1.221

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AZTECH Wire

Italy . 910 parts In-Stock

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$21.930

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910

$21.930

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Component Stockers USA

USA . 325 parts In-Stock

1+ parts

$99.990

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325

$99.990

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Alle Elektronik GmbH

Germany . 3,477 parts In-Stock

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3,477

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Corphita

USA . 1,548 parts In-Stock

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1,548

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Parana Technologies

USA . 708 parts In-Stock

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$0.777

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708

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$0.777

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Overview

Elevate your power management solutions with the STD78N75F4 from STMicroelectronics, a leader in innovative semiconductor technology. This robust N-channel FET delivers exceptional efficiency and reliability for all your switching applications. With superior performance tailored for demanding environments, it ensures seamless operation even under high loads. Trust in STMicroelectronics' legacy of quality to enhance your designs and drive your projects forward with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the FET reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency compared to P-channel, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added functionality by enabling reverse current protection, improving circuit design flexibility.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in speed and efficiency for various electronic circuits.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCB assemblies.

Minimum DS Breakdown Voltage: 75 V

A minimum breakdown voltage of 75V ensures reliability in high-voltage applications, reducing the risk of failure.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and component spacing on the PCB, optimizing design.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and better mechanical strength, enhancing the reliability of connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode offers better control over the device, contributing to higher efficiency in operation.

Maximum Pulsed Drain Current (IDM): 280 A

A high pulsed drain current capacity enables this FET to handle transient loads effectively, beneficial for dynamic applications.

Avalanche Energy Rating (EAS): 185 mJ

A robust avalanche energy rating indicates the FET’s ability to withstand energy spikes, boosting reliability.

Maximum Drain Current (Abs) (ID): 70 A

With a maximum drain current of 70A, this FET is suitable for high-current applications without overheating.

No. of Terminals: 2

A two-terminal configuration simplifies circuit layout and reduces complexity in designs.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capacity allows the FET to handle demanding applications, ensuring stable performance under load.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space on PCBs, ideal for compact electronics while maintaining functionality.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology delivers superior electrical performance, including high-speed switching and low power consumption.

Maximum Operating Temperature: 175 °C

A high operating temperature rating makes this FET suitable for applications in harsh environments, enhancing versatility.

Transistor Element Material: SILICON

Silicon material provides excellent thermal stability and electrical performance, making it a standard choice for FETs.

Maximum Drain Current (ID): 70 A

A consistent maximum drain current rating of 70A ensures reliable performance under demanding loads.

Maximum Drain-Source On Resistance: 0.011 ohm

Low on-resistance reduces power losses during operation, enhancing the efficiency and overall performance of the FET.

Terminal Position: SINGLE

A single terminal position simplifies integration into circuit designs, making assembly and layout easier.

Technical Specifications

Power Field Effect Transistors (FET) STD78N75F4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

185 mJ

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD78N75F4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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