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STB75N20

STMicroelectronics

STB75N20 by STMicroelectronics

STB75N20 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 75 A, breakdown voltage of 200 V, and operates at up to 150 °C. Ideal for high-efficiency power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,654 parts In-Stock

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8,654

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Digiode

USA . 3,531 parts In-Stock

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3,531

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Anansix

USA . 2,454 parts In-Stock

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2,454

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,125 parts In-Stock

1+ parts

$1.632

100+ parts

-

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$1.469

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1,125

$1.632

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$1.469

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MKK Technologies

India . 2,137 parts In-Stock

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$3.069

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2,137

$3.069

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DigiPath Technology Company

USA . 2,137 parts In-Stock

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$3.069

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2,137

$3.069

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AZTECH Wire

Italy . 752 parts In-Stock

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$9.340

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752

$9.340

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A-Z Elektronik GmbH

Germany . 5,547 parts In-Stock

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5,547

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,325 parts In-Stock

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4,325

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Corphita

USA . 3,540 parts In-Stock

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3,540

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Parana Technologies

USA . 1,145 parts In-Stock

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$1.951

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$1.951

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock unparalleled efficiency with the STB75N20 from STMicroelectronics, a leader in power solutions. This N-channel FET delivers robust performance for your switching applications, ensuring reliability and longevity. Built with advanced technology, it excels in high-power environments, making it perfect for automotive, industrial, and consumer electronics. Benefit from its compact design and exceptional thermal management, elevating your projects to new heights while enjoying ST's commitment to quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and makes it suitable for various ambient conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for flyback protection in inductive load conditions, increasing circuit reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, it provides fast response times and efficient operation.

Surface Mount: YES

Surface mount design enables compact PCB layouts, saving space in modern electronics.

Minimum DS Breakdown Voltage: 200 V

A minimum breakdown voltage of 200V allows for high voltage applications, offering versatility in designs.

Package Shape: RECTANGULAR

The rectangular package shape contributes to ease of placement and soldering during assembly.

Terminal Form: GULL WING

Gull wing terminals provide reliable connections and are easy to handle during manufacturing.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enables low power consumption and high efficiency in on-state conditions.

Maximum Pulsed Drain Current (IDM): 300 A

A high pulsed drain current capability allows for demanding applications, such as in power amplifiers.

Avalanche Energy Rating (EAS): 205 mJ

The avalanche energy rating ensures reliability under stress conditions, making it suitable for transient applications.

Maximum Drain Current (Abs) (ID): 75 A

With a maximum drain current of 75A, this FET is robust for both standard and high-performance applications.

No. of Terminals: 2

The simple two-terminal configuration allows for straightforward integration into various electronic circuits.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capability ensures efficient thermal management, improving overall device longevity.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, making it versatile for various designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances power efficiency and switching speed, making it suitable for sophisticated applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature improves reliability in high-temperature environments, extending product lifespan.

Transistor Element Material: SILICON

Silicon's prevalent use provides excellent thermal and electrical performance, enabling efficient operation.

Maximum Drain Current (ID): 75 A

This allows for robust performance in diverse applications, ensuring that it can handle significant loads.

Maximum Drain-Source On Resistance: 0.034 ohm

Low on-resistance leads to reduced power loss during operation, enhancing overall efficiency.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and enhances ease of use in compact layouts.

Technical Specifications

Power Field Effect Transistors (FET) STB75N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

205 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB75N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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