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STB35NF10T4

STMicroelectronics

STB35NF10T4 by STMicroelectronics

STB35NF10T4 by STMicroelectronics is a N-CHANNEL FET with 100V DS Breakdown Voltage, 160A IDM, and 0.035 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 115W Pdiss and -55 to 175°C temp range.

Median Price

$1.619

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$1.670

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$1.670

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Vyrian

USA . 3,518 parts In-Stock

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Chip Stock

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Digiode

USA . 2,554 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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Anansix

USA . 1,500 parts In-Stock

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Bristol Electronics

USA . 1,090 parts In-Stock

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$1.568

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$1.378

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$1.568

$1.378

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A2Z Electronics, Inc.

USA . 891 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 443 parts In-Stock

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ComSIT Distribution GmbH

Germany . 395 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$0.671

100+ parts

$0.611

1k+ parts

$0.550

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$0.671

$0.611

$0.550

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IDEA Electronic Components Group

UK . 546 parts In-Stock

1+ parts

$0.705

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$0.634

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546

$0.705

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MKK Technologies

India . 855 parts In-Stock

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$1.325

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$1.325

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DigiPath Technology Company

USA . 855 parts In-Stock

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$1.325

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$1.325

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AZTECH Wire

Italy . 643 parts In-Stock

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$5.289

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Semicontronic

India . 329 parts In-Stock

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$11.050

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$10.774

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$10.718

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Ampacity Inc.

Singapore . 1,259 parts In-Stock

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$15.050

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RC Electronics

USA . 44,545 parts In-Stock

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Lixinc

USA . 14,353 parts In-Stock

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Perfect Parts

USA . 10,273 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,951 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,978 parts In-Stock

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Kepictronics

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Corphita

USA . 2,274 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 551 parts In-Stock

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$0.843

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551

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$0.843

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Overview

Unleash the power of innovation with the STB35NF10T4 by STMicroelectronics. Designed for high performance, this N-channel power field effect transistor is a game-changer in switching applications. With a maximum drain current of 40A and a low on-resistance of just 0.035 ohms, this transistor delivers unmatched efficiency and reliability. Whether you're in automotive, industrial, or consumer electronics, trust STMicroelectronics to provide cutting-edge technology that exceeds expectations. Elevate your designs with the STB35NF10T4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and performance for the application of switching.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by having a built-in diode, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in this use case.

Minimum DS Breakdown Voltage: 100 V

Provides a high breakdown voltage, allowing for reliable operation in high voltage applications.

Package Shape: RECTANGULAR

Offers a compact and efficient packaging design for easy integration into circuits.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the circuit board, improving overall assembly efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor's conductivity, enabling precise switching.

Maximum Pulsed Drain Current (IDM): 160 A

Capable of handling high current loads during pulsed operation, ensuring reliable performance in demanding conditions.

Avalanche Energy Rating (EAS): 300 mJ

With a high avalanche energy rating, this product can withstand energy spikes and surges without damage.

Maximum Drain Current (Abs) (ID): 40 A

With a high maximum drain current rating, this FET can handle significant current levels, suitable for various applications.

Maximum Power Dissipation (Abs): 115 W

Capable of dissipating heat effectively, leading to improved reliability and longevity of the product.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and allows for high-density circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for efficient and reliable performance in switching applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without sacrificing performance, suitable for harsh environments.

Transistor Element Material: SILICON

Utilizes silicon material for the transistor element, providing high performance and reliability.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold temperatures, offering versatility for various operating conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance for reliable connections.

Maximum Drain-Source On Resistance: 0.035 ohm

Low on-resistance ensures minimal power loss and efficient operation in switching applications.

Terminal Position: SINGLE

Simplified terminal layout for ease of connection and integration into the circuit.

Case Connection: DRAIN

Designed with drain connection for improved heat dissipation and performance in high current applications.

Technical Specifications

Power Field Effect Transistors (FET) STB35NF10T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB35NF10T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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