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STB37N60DM2AG

STMicroelectronics

STB37N60DM2AG by STMicroelectronics

STB37N60DM2AG by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage and 28A max drain current. Ideal for switching applications, it operates in enhancement mode with a built-in diode, GULL WING terminals, and -55 to 150 °C temperature range.

Median Price

$6.938

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 994 parts In-Stock

1+ parts

$6.596

100+ parts

$4.815

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994

$6.596

$4.815

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Farnell

UK . 1,980 parts In-Stock

1+ parts

$7.281

100+ parts

$4.725

1k+ parts

$4.454

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1,980

$7.281

$4.725

$4.454

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$7.620

100+ parts

$3.840

1k+ parts

$3.360

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-

1,000

$7.620

$3.840

$3.360

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Mouser Electronics

USA . 2,053 parts In-Stock

1+ parts

$7.680

100+ parts

$4.000

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$3.730

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2,053

$7.680

$4.000

$3.730

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DigiKey

USA . 1,220 parts In-Stock

1+ parts

$7.700

100+ parts

$3.991

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$3.261

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1,220

$7.700

$3.991

$3.261

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Newark

USA . 1,610 parts In-Stock

1+ parts

$9.050

100+ parts

$5.910

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$4.990

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1,610

$9.050

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$4.990

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Avnet

USA . 34,000 parts In-Stock

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EBV Elektronik

Germany . 5,000 parts In-Stock

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Future Electronics

Canada . 2,000 parts In-Stock

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$3.050

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2,000

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$3.050

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Element14

Singapore . 1,980 parts In-Stock

1+ parts

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$4.675

1k+ parts

$3.797

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1,980

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$4.675

$3.797

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Arrow

USA . 1,000 parts In-Stock

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$3.859

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$3.859

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Verical

USA . 1,000 parts In-Stock

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$3.859

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$3.859

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Distributors (In-Stock)

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Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$4.191

100+ parts

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44

$4.191

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Digiode

USA . 3,884 parts In-Stock

1+ parts

$6.070

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3,884

$6.070

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Chip Stock

USA . 2,919 parts In-Stock

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2,919

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

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$3.899

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2,000

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$3.899

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Vyrian

USA . 1,057 parts In-Stock

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1,057

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Bristol Electronics

USA . 1,000 parts In-Stock

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Anansix

USA . 145 parts In-Stock

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145

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Prism Electronics

USA . 59 parts In-Stock

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59

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 310 parts In-Stock

1+ parts

$0.498

100+ parts

-

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310

$0.498

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Corohmni

South Africa . 645 parts In-Stock

1+ parts

$1.439

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645

$1.439

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IDEA Electronic Components Group

UK . 373 parts In-Stock

1+ parts

$1.457

100+ parts

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$1.312

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373

$1.457

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$1.312

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MKK Technologies

India . 1,771 parts In-Stock

1+ parts

$2.740

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1,771

$2.740

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DigiPath Technology Company

USA . 1,771 parts In-Stock

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$2.740

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1,771

$2.740

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Ampacity Inc.

Singapore . 1,113 parts In-Stock

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$2.860

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1,113

$2.860

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Argo Parts USA

USA . 3,903 parts In-Stock

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$3.952

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$3.952

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Netroflash

USA . 1,000 parts In-Stock

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$4.191

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$3.982

10k+ parts

$3.898

1,000

$4.191

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$3.982

$3.898

Corphita

USA . 3,598 parts In-Stock

1+ parts

$5.751

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3,598

$5.751

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

$6.010

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$3.620

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$3.200

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$6.010

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$3.200

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Semicontronic

India . 1,289 parts In-Stock

1+ parts

$6.230

100+ parts

$6.074

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$6.043

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1,289

$6.230

$6.074

$6.043

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Microchip USA

USA . 3,414 parts In-Stock

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$24.527

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$24.527

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Alle Elektronik GmbH

Germany . 4,713 parts In-Stock

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4,713

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,393 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,010 parts In-Stock

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Formix International (Excess)

India . 2,000 parts In-Stock

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2,000

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Lixinc

USA . 1,680 parts In-Stock

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1,680

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 310 parts In-Stock

1+ parts

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$1.742

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310

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$1.742

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Overview

Unlock the power of innovation with the STB37N60DM2AG by STMicroelectronics, a high-quality Power Field Effect Transistor designed for switching applications. Manufactured with precision and expertise, this N-CHANNEL FET offers unmatched performance, reliability, and efficiency. Ideal for a wide range of industrial and automotive applications, this transistor provides exceptional value with its built-in diode, high breakdown voltage, and low on-resistance. Trust STMicroelectronics to deliver cutting-edge technology that meets your power needs with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high-power applications due to their lower ON-state resistance and higher efficiency compared to P-CHANNEL FETs.

Minimum DS Breakdown Voltage: 600 V

With a high minimum breakdown voltage of 600V, this FET can handle high voltage applications, providing reliable performance and protection against electrical overloads.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage, making it suitable for applications where reverse polarity protection is needed.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control and higher switching speeds, making them suitable for applications requiring fast switching and high frequency operation.

Avalanche Energy Rating (EAS): 650 mJ

The high avalanche energy rating of 650 mJ ensures the FET can withstand short circuit conditions and transient voltage spikes, increasing device reliability in harsh operating environments.

Maximum Drain-Source On Resistance: 0.11 ohm

The low maximum drain-source ON resistance of 0.11 ohm results in reduced power losses and improved efficiency during operation, making it ideal for high current applications.

Technical Specifications

Power Field Effect Transistors (FET) STB37N60DM2AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

650 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB37N60DM2AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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