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STB30N65M5

STMicroelectronics

STB30N65M5 by STMicroelectronics

STB30N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS breakdown voltage and 88A pulsed drain current. Ideal for switching applications, it features a built-in diode, 0.139 ohm max on-resistance, and 140W power dissipation in a small outline package.

Median Price

$4.902

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,143 parts In-Stock

1+ parts

$6.970

100+ parts

$3.494

1k+ parts

$2.855

10k+ parts

-

1,143

$6.970

$3.494

$2.855

-

Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$6.970

100+ parts

$3.500

1k+ parts

$3.270

10k+ parts

-

1,000

$6.970

$3.500

$3.270

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Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.834

10k+ parts

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3,000

-

-

$2.834

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Verical

USA . 3,000 parts In-Stock

1+ parts

-

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$2.834

10k+ parts

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3,000

-

-

$2.834

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Distributors (In-Stock)

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Greenchips

USA . 8,164 parts In-Stock

1+ parts

$2.360

100+ parts

$2.248

1k+ parts

$2.141

10k+ parts

$1.932

8,164

$2.360

$2.248

$2.141

$1.932

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$3.680

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-

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200

$3.680

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Digiode

USA . 4,750 parts In-Stock

1+ parts

$6.289

100+ parts

-

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4,750

$6.289

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-

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Bristol Electronics

USA . 26,519 parts In-Stock

1+ parts

-

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$2.300

1k+ parts

$2.021

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26,519

-

$2.300

$2.021

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Dan-Mar Components

USA . 26,519 parts In-Stock

1+ parts

-

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26,519

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SIE Connect GmbH - GreenChips

Germany . 8,164 parts In-Stock

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8,164

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J2 Sourcing AB

Sweden . 2,000 parts In-Stock

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2,000

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,916 parts In-Stock

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1,916

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Vyrian

USA . 1,482 parts In-Stock

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1,482

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Chip Stock

USA . 887 parts In-Stock

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887

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ComSIT Distribution GmbH

Germany . 750 parts In-Stock

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750

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Microfarads

USA . 603 parts In-Stock

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603

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Prism Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 189 parts In-Stock

1+ parts

$0.438

100+ parts

-

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10k+ parts

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189

$0.438

-

-

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Aztec Data Supply Inc.

USA . 1,028 parts In-Stock

1+ parts

$0.700

100+ parts

-

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1,028

$0.700

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.738

100+ parts

$0.672

1k+ parts

$0.605

10k+ parts

-

2,500

$0.738

$0.672

$0.605

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IDEA Electronic Components Group

UK . 186 parts In-Stock

1+ parts

$0.856

100+ parts

-

1k+ parts

$0.770

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186

$0.856

-

$0.770

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MKK Technologies

India . 271 parts In-Stock

1+ parts

$1.609

100+ parts

-

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271

$1.609

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DigiPath Technology Company

USA . 271 parts In-Stock

1+ parts

$1.609

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271

$1.609

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Benley Electronics

USA . 2 parts In-Stock

1+ parts

$1.750

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2

$1.750

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Argo Parts USA

USA . 1,992 parts In-Stock

1+ parts

$3.680

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1,992

$3.680

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Continental Prestige Electronics

USA . 1,207 parts In-Stock

1+ parts

$3.680

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$3.606

1,207

$3.680

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$3.606

Netroflash

USA . 50 parts In-Stock

1+ parts

$3.680

100+ parts

-

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$3.496

10k+ parts

$3.422

50

$3.680

-

$3.496

$3.422

Ampacity Inc.

Singapore . 1,493 parts In-Stock

1+ parts

$5.630

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1,493

$5.630

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Corphita

USA . 1,081 parts In-Stock

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$5.958

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1,081

$5.958

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Microchip USA

USA . 8,881 parts In-Stock

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$23.678

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8,881

$23.678

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iodParts Technologies Inc.

India . 22,000 parts In-Stock

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Lixinc

USA . 15,058 parts In-Stock

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Kepictronics

USA . 12,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,247 parts In-Stock

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7,247

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Epart123

USA . 2,000 parts In-Stock

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2,000

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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Alle Elektronik GmbH

Germany . 985 parts In-Stock

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985

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Parana Technologies

USA . 338 parts In-Stock

1+ parts

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100+ parts

$1.023

1k+ parts

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338

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$1.023

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Overview

Experience the ultimate power and efficiency with the STB30N65M5 by STMicroelectronics. Crafted with precision using cutting-edge technology, this N-channel Power FET offers unparalleled performance in switching applications. From its high breakdown voltage to its low on-resistance, this transistor delivers reliability and durability that exceed expectations. Whether you're looking to optimize your energy efficiency or enhance your system's overall performance, the STB30N65M5 is the ideal solution. Trust STMicroelectronics to provide you with the quality and innovation you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high input impedance and fast switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies the design and allows for reverse current flow protection.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring efficient power management.

Surface Mount: YES

Surface mount installation offers space-saving benefits and ease of assembly.

Maximum DS Breakdown Voltage: 650 V

High breakdown voltage ensures reliable operation in high voltage applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement on PCBs and efficient use of space.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connections for enhanced reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy and precise control of the transistor.

Maximum Pulsed Drain Current (IDM): 88 A

High pulsed drain current capability for handling peak loads and surge currents.

Avalanche Energy Rating (EAS): 500 mJ

Avalanche energy rating indicates the ability to withstand voltage spikes without damage.

Maximum Drain Current (Abs) (ID): 22 A

High drain current capacity for handling continuous load currents.

No. of Terminals: 2

Simple two-terminal design for easy integration into electronic circuits.

Maximum Power Dissipation (Abs): 140 W

High power dissipation capability ensures reliable performance under heavy loads.

Package Style (Meter): SMALL OUTLINE

Small outline package for compact PCB designs and space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds.

Maximum Operating Temperature: 150 °C

High maximum operating temperature for operation in a wide range of environments.

Transistor Element Material: SILICON

Silicon material provides high performance and reliability in power transistor applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and corrosion resistance.

Maximum Drain-Source On Resistance: 0.139 ohm

Low on-resistance for efficient power handling and minimal power loss.

Terminal Position: SINGLE

Single terminal position simplifies installation and maintenance.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time for easy assembly and reduced manufacturing costs.

Peak Reflow Temperature °C: 245

High peak reflow temperature capability for lead-free soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) STB30N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.139 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB30N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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