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STB33N60DM2

STMicroelectronics

STB33N60DM2 by STMicroelectronics

STB33N60DM2 by STMicroelectronics is a N-CHANNEL FET with 600V DS Breakdown Voltage and 96A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.13 ohm RDS(on), and operates in ENHANCEMENT MODE.

Median Price

$5.260

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 868 parts In-Stock

1+ parts

$5.260

100+ parts

$2.503

1k+ parts

$1.961

10k+ parts

-

868

$5.260

$2.503

$1.961

-

Mouser Electronics

USA . 857 parts In-Stock

1+ parts

$5.260

100+ parts

$2.510

1k+ parts

$1.960

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857

$5.260

$2.510

$1.960

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Avnet

USA . 9,000 parts In-Stock

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9,000

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.890

100+ parts

-

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10

$2.890

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Digiode

USA . 2,319 parts In-Stock

1+ parts

$4.066

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2,319

$4.066

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Chip Stock

USA . 42,745 parts In-Stock

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42,745

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Anansix

USA . 1,143 parts In-Stock

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1,143

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Vyrian

USA . 756 parts In-Stock

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756

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,134 parts In-Stock

1+ parts

$0.578

100+ parts

-

1k+ parts

$0.520

10k+ parts

-

1,134

$0.578

-

$0.520

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MKK Technologies

India . 1,747 parts In-Stock

1+ parts

$1.086

100+ parts

-

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1,747

$1.086

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DigiPath Technology Company

USA . 1,747 parts In-Stock

1+ parts

$1.086

100+ parts

-

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1,747

$1.086

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Argo Parts USA

USA . 4,599 parts In-Stock

1+ parts

$2.890

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4,599

$2.890

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Continental Prestige Electronics

USA . 281 parts In-Stock

1+ parts

$2.890

100+ parts

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$2.832

281

$2.890

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$2.832

Netroflash

USA . 50 parts In-Stock

1+ parts

$2.890

100+ parts

$2.832

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50

$2.890

$2.832

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Corphita

USA . 1,564 parts In-Stock

1+ parts

$3.852

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1,564

$3.852

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Semicontronic

India . 4,323 parts In-Stock

1+ parts

$4.390

100+ parts

$4.280

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$4.258

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4,323

$4.390

$4.280

$4.258

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Ampacity Inc.

Singapore . 937 parts In-Stock

1+ parts

$4.390

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937

$4.390

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Microchip USA

USA . 5,945 parts In-Stock

1+ parts

$17.285

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5,945

$17.285

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iodParts Technologies Inc.

India . 36,000 parts In-Stock

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36,000

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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Lixinc

USA . 6,002 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Parana Technologies

USA . 2,203 parts In-Stock

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$0.691

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2,203

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$0.691

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Alle Elektronik GmbH

Germany . 1,111 parts In-Stock

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1,111

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Overview

Upgrade your power systems with the STB33N60DM2 by STMicroelectronics. Made with high-quality materials and cutting-edge technology, this N-CHANNEL Power FET is designed for switching applications with a built-in diode for added convenience. With a maximum operating temperature of 150°C and a minimum DS breakdown voltage of 600V, this transistor ensures reliable performance in a compact and efficient package. Trust STMicroelectronics to deliver superior products that meet your power needs seamlessly. Experience the difference with the STB33N60DM2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the FET long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower ON resistance, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse currents, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid fluctuations in voltage and current with ease.

Maximum Pulsed Drain Current (IDM): 96 A

With a high pulsed current rating, this FET can handle short bursts of high power without overheating or failing.

Avalanche Energy Rating (EAS): 570 mJ

The high avalanche energy rating ensures that the FET can withstand sudden spikes in voltage, protecting the device and increasing reliability.

Maximum Power Dissipation (Abs): 190 W

With a high power dissipation rating, this FET can handle large amounts of power without overheating, ensuring stable operation.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the FET to be used in a variety of environments without risking damage or malfunction.

Technical Specifications

Power Field Effect Transistors (FET) STB33N60DM2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

570 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB33N60DM2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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