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STB30NF20TRL

STMicroelectronics

STB30NF20TRL by STMicroelectronics

STB30NF20TRL from STMicroelectronics is a robust N-channel MOSFET designed for efficient switching applications. It features a max drain current of 30 A, a breakdown voltage of 200 V, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,284 parts In-Stock

1+ parts

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3,284

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Anansix

USA . 1,806 parts In-Stock

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1,806

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Vyrian

USA . 723 parts In-Stock

1+ parts

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723

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,811 parts In-Stock

1+ parts

$1.317

100+ parts

-

1k+ parts

$1.186

10k+ parts

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1,811

$1.317

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$1.186

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MKK Technologies

India . 671 parts In-Stock

1+ parts

$2.477

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671

$2.477

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DigiPath Technology Company

USA . 671 parts In-Stock

1+ parts

$2.477

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671

$2.477

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Parana Technologies

USA . 1,719 parts In-Stock

1+ parts

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100+ parts

$1.575

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1,719

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$1.575

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Corphita

USA . 738 parts In-Stock

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738

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Overview

Unlock the power of efficiency with the STB30NF20TRL from STMicroelectronics. Renowned for their reliability and innovation, STMicroelectronics delivers a top-tier N-Channel Power FET designed for seamless switching applications, ensuring optimal performance in compact designs. Benefit from reduced energy consumption and enhanced thermal management, making it ideal for automotive, industrial, and consumer electronics. Elevate your projects with this high-quality component that embodies excellence and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resilience against environmental stress, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility, allowing faster switching speeds and better efficiency in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection against damage from voltage spikes, enhancing the reliability of the device in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers optimal performance and efficiency, making it a great choice for power management tasks.

Surface Mount: YES

Surface mount technology makes this FET easier to integrate into compact designs, optimizing space and enabling more versatile circuit layouts.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage ensures that this FET can handle significant voltage levels, thus providing robustness in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular form factor contributes to efficient layout and PCB design, allowing for better heat dissipation and improved performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly processes, improving manufacturing efficiency and reducing assembly time.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high efficiency and excellent control over the current flow, making this FET suitable for diverse power applications.

Maximum Pulsed Drain Current (IDM): 120 A

A high pulsed drain current capability enables this FET to handle transient spikes effectively, ensuring reliability in dynamic load conditions.

Avalanche Energy Rating (EAS): 140 mJ

A solid avalanche energy rating indicates that this FET can withstand voltage transients without failing, making it ideal for rugged applications.

No. of Terminals: 2

The simplicity of a two-terminal design reduces complexity and is suitable for straightforward connections within circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for modern electronics, allowing for compact circuit designs and reducing board space requirements.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high input impedance and low power consumption, making this FET energy-efficient for a wide range of applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures that this FET can function reliably under extreme thermal conditions, expanding its suitability for various applications.

Transistor Element Material: SILICON

Silicon is a well-established material for transistors, providing excellent electrical performance and reliability in electronic components.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, ensuring reliable electrical connections and extending the lifespan of the component.

Maximum Drain Current (ID): 30 A

A peak drain current rating of 30 A supports significant current loads, making this FET suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.075 ohm

Low on-resistance minimizes power losses during operation, contributing to the overall efficiency of power management and switching applications.

Terminal Position: SINGLE

Single terminal position simplifies the integration into circuits, enhancing design flexibility for various applications.

Technical Specifications

Power Field Effect Transistors (FET) STB30NF20TRL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB30NF20TRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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