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STB30NM60N

STMicroelectronics

STB30NM60N by STMicroelectronics

STB30NM60N from STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 25A max drain current, and operates at up to 150 °C. Ideal for high-performance power management in compact designs.

Median Price

$7.840

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 567 parts In-Stock

1+ parts

$7.840

100+ parts

$3.397

1k+ parts

$3.214

10k+ parts

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567

$7.840

$3.397

$3.214

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Vyrian

USA . 7,872 parts In-Stock

1+ parts

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7,872

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Digiode

USA . 3,129 parts In-Stock

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3,129

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Anansix

USA . 2,687 parts In-Stock

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2,687

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ACDS - Activité Composants Distribution Service

France . 567 parts In-Stock

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567

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Dan-Mar Components

USA . 567 parts In-Stock

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567

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Sunrise Surplus Inc.

USA . 27 parts In-Stock

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27

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$0.512

100+ parts

-

1k+ parts

$0.460

10k+ parts

-

1,500

$0.512

-

$0.460

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MKK Technologies

India . 1,081 parts In-Stock

1+ parts

$0.962

100+ parts

-

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1,081

$0.962

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DigiPath Technology Company

USA . 1,081 parts In-Stock

1+ parts

$0.962

100+ parts

-

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1,081

$0.962

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AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$9.050

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244

$9.050

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,770 parts In-Stock

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3,770

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Corphita

USA . 2,261 parts In-Stock

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2,261

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QUARKTWIN TECHNOLOGY LTD

USA . 2,140 parts In-Stock

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2,140

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Parana Technologies

USA . 956 parts In-Stock

1+ parts

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100+ parts

$0.612

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956

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$0.612

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unlock unparalleled performance with the STB30NM60N from STMicroelectronics, a leader in innovation and quality. This N-channel power FET is designed for seamless switching applications, offering remarkable efficiency and durability. Its robust features ensure reliable operation in demanding environments, making it ideal for industrial and consumer electronics. Experience enhanced reliability and superior thermal management, elevating your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material provides good durability and thermal stability, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and have better performance compared to P-channel types, making this product a strong choice for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode offers protection against back EMF in inductive loads, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on-off operations, ideal for power management and control scenarios.

Surface Mount: YES

Surface mounting allows for compact designs, making this FET suitable for high-density circuit boards and modern electronic devices.

Minimum DS Breakdown Voltage: 600 V

A minimum breakdown voltage of 600 V ensures that the FET can operate safely in high-voltage applications without risk of failure.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on circuit boards, allowing for better arrangement and layout of electronic components.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and better mechanical stability, ensuring reliable connections in challenging environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enhances the FET's performance in switching and amplification, resulting in improved overall efficiency.

Maximum Pulsed Drain Current (IDM): 100 A

The ability to handle pulsed drain currents up to 100 A makes this FET suitable for high-current applications without thermal stress.

Avalanche Energy Rating (EAS): 900 mJ

A high avalanche energy rating makes it resilient against transients, increasing reliability in conditions that may lead to voltage spikes.

Maximum Drain Current (Abs) (ID): 25 A

With a maximum drain current of 25 A, this FET is capable of operating efficiently in various power applications without overheating.

No. of Terminals: 2

Having only 2 terminals simplifies the design and integration into circuits, making it easier to implement in various applications.

Maximum Power Dissipation (Abs): 190 W

A high power dissipation capability of 190 W allows for effective heat management, making it suitable for power-intensive applications.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications, providing versatility in design without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances switching speeds and minimizes power loss, making this product a high-performance choice for modern electronics.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can operate reliably in high-temperature environments, expanding its application range.

Transistor Element Material: SILICON

Silicon as the element material ensures good thermal conductivity and reliability, making it ideal for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections even in harsh environments.

Maximum Drain Current (ID): 25 A

This specification reflects the FET's capacity to handle substantial current loads, making it a robust option for power applications.

Maximum Drain-Source On Resistance: 0.13 ohm

A low on-resistance of 0.13 ohm minimizes power losses during operation, improving the efficiency of the overall circuit.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and layout, facilitating easier integration into various electronic configurations.

Technical Specifications

Power Field Effect Transistors (FET) STB30NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB30NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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