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STB30NM50N

STMicroelectronics

STB30NM50N by STMicroelectronics

STB30NM50N from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and 27A max drain current. It offers a low on-resistance of 0.115Ω and operates at up to 150 °C. Its compact design suits surface mount configurations.

Median Price

$3.692

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1,150 parts In-Stock

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$2.865

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$2.865

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Chip1Stop

Japan . 1,150 parts In-Stock

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$4.520

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$4.520

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Verical

USA . 1,150 parts In-Stock

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1,150

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Digiode

USA . 3,153 parts In-Stock

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$2.690

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3,153

$2.690

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Vyrian

USA . 3,859 parts In-Stock

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3,859

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Anansix

USA . 1,702 parts In-Stock

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1,702

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Bristol Electronics

USA . 20 parts In-Stock

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Atlantic Semiconductor

USA . 20 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,409 parts In-Stock

1+ parts

$0.615

100+ parts

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1k+ parts

$0.553

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1,409

$0.615

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$0.553

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MKK Technologies

India . 1,346 parts In-Stock

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$1.156

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DigiPath Technology Company

USA . 1,346 parts In-Stock

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$1.156

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Ampacity Inc.

Singapore . 878 parts In-Stock

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$2.410

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$2.410

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Corphita

USA . 801 parts In-Stock

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$2.549

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801

$2.549

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Component Stockers USA

USA . 2,259 parts In-Stock

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$3.270

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$3.270

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$3.270

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2,259

$3.270

$3.270

$3.270

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AZTECH Wire

Italy . 718 parts In-Stock

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$19.230

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$19.230

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Alle Elektronik GmbH

Germany . 3,518 parts In-Stock

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3,518

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Parana Technologies

USA . 1,867 parts In-Stock

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$0.735

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1,867

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$0.735

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Kepictronics

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Unlock the potential of your designs with the STB30NM50N from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This powerful N-channel FET delivers impressive switching performance, making it ideal for a variety of applications, from power supplies to motor controls. With exceptional reliability and efficiency, you can count on this high-performance transistor to enhance your systems while enjoying peace of mind from a manufacturer renowned for quality and excellence. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides good durability and protection for the internal components.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the performance in applications where reverse polarity protection is critical.

Transistor Application: SWITCHING

Optimized for switching applications, this FET ensures quick response times and efficient operation.

Surface Mount: YES

Surface mount technology allows for more compact designs and ease of automated assembly.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage indicates strong performance in high-voltage applications, providing reliability and safety.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle and fit into standard circuit board layouts.

Terminal Form: GULL WING

Gull wing terminals improve the mounting stability and soldering reliability of the component.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide high control and low power loss, making them ideal for efficient power management.

Maximum Pulsed Drain Current (IDM): 108 A

The high pulsed drain current capability makes this FET suitable for demanding load conditions.

Avalanche Energy Rating (EAS): 900 mJ

A high avalanche energy rating indicates robustness against voltage spikes, ensuring long-term reliability.

Maximum Drain Current (Abs) (ID): 27 A

This maximum drain current supports a wide range of applications, offering flexibility in design.

No. of Terminals: 2

The simplicity of a two-terminal design facilitates easier integration into circuits.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capabilities allow the FET to handle large power loads without failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes space-saving designs in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers superior efficiency and performance in a variety of applications.

Maximum Operating Temperature: 150 °C

A wide operating temperature range enhances the versatility of the FET under different environmental conditions.

Transistor Element Material: SILICON

Silicon as the element material ensures good electrical characteristics and reliable performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and corrosion resistance, enhancing longevity.

Maximum Drain Current (ID): 27 A

Repeated maximum drain current value emphasizes the FET's robustness under load, ensuring reliability.

Maximum Drain-Source On Resistance: 0.115 ohm

A low on-resistance value indicates reduced power losses during operation, improving overall efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies the layout for circuit designs and minimizes space requirements.

Case Connection: ISOLATED

Isolated case connections enhance safety by preventing unwanted current paths during operation.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, improving assembly efficiency.

Peak Reflow Temperature °C: 245

The peak reflow temperature allows for effective soldering without damaging the component, ensuring reliability.

Technical Specifications

Power Field Effect Transistors (FET) STB30NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB30NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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