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STB230NH03L

STMicroelectronics

STB230NH03L by STMicroelectronics

STB230NH03L by STMicroelectronics is a high-performance N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, breakdown voltage of 30 V, and power dissipation up to 300 W. Ideal for compact designs with its surface mount configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,684 parts In-Stock

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4,684

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Digiode

USA . 2,954 parts In-Stock

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Anansix

USA . 432 parts In-Stock

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432

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IDEA Electronic Components Group

UK . 2,034 parts In-Stock

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$0.653

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-

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$0.588

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2,034

$0.653

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$0.588

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MKK Technologies

India . 1,791 parts In-Stock

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$1.228

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1,791

$1.228

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DigiPath Technology Company

USA . 1,791 parts In-Stock

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$1.228

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1,791

$1.228

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AZTECH Wire

Italy . 44 parts In-Stock

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$10.410

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44

$10.410

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A-Z Elektronik GmbH

Germany . 6,422 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,985 parts In-Stock

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Corphita

USA . 3,578 parts In-Stock

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Parana Technologies

USA . 361 parts In-Stock

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$0.781

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Kepictronics

USA . 173 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of efficiency with the STB230NH03L from STMicroelectronics, a premier choice in the realm of N-channel Power FETs. Renowned for its exceptional quality and reliability, STMicroelectronics brings you a transistor that excels in switching applications, ensuring optimal performance even under high loads. Experience unmatched durability and low resistance, making it perfect for demanding environments in automotive, industrial, and consumer electronics. Elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and thermal stability of the product, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance for switching applications, as they tend to have lower on-resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration into circuits, providing protection against voltage spikes and ensuring reliable operation.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is particularly well-suited for power management and control in various electronic devices.

Surface Mount: YES

Surface mount technology allows for compact designs, making it easier to save space on printed circuit boards (PCBs).

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures the FET operates safely within high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout on PCBs, optimizing space and improving electrical performance.

Terminal Form: GULL WING

Gull wing terminals provide better soldering contact and mechanical stability, enhancing the reliability of the connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation results in better control of the current flow, improving energy efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 1000 A

The high pulsed current rating allows this FET to handle demanding applications, especially in transient load conditions.

Avalanche Energy Rating (EAS): 1150 mJ

A high avalanche energy rating indicates robust performance in conditions where voltage spikes can occur, enhancing safety.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum drain current of 80A, this FET is capable of driving significant loads, making it suitable for high-power applications.

No. of Terminals: 2

The simplicity of a two-terminal design allows for easy integration into circuits, minimizing complexity.

Maximum Power Dissipation (Abs): 300 W

A high power dissipation rating ensures that this device can handle significant power without overheating, increasing reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact design and decreased footprint, fitting well in space-constrained environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is known for its high input impedance and minimal power consumption, making it energy efficient.

Maximum Operating Temperature: 175 °C

A high operating temperature rating enables the FET to function effectively in harsh environments, broadening its application range.

Transistor Element Material: SILICON

Silicon material provides excellent performance characteristics for power applications, ensuring reliability and efficiency.

Maximum Drain Current (ID): 80 A

This rating ensures that the FET can handle high power loads, crucial for power switching applications.

Maximum Drain-Source On Resistance: 0.003 ohm

Low on-resistance means reduced energy losses during operation, contributing to better efficiency in power applications.

Terminal Position: SINGLE

The single terminal position simplifies the design and reduces the complexity of integration in circuits.

Technical Specifications

Power Field Effect Transistors (FET) STB230NH03L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1150 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1000 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB230NH03L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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