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STB21NM60ND

STMicroelectronics

STB21NM60ND by STMicroelectronics

STB21NM60ND by STMicroelectronics is a robust N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 68A pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$2.954

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 425 parts In-Stock

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$2.954

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425

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$2.954

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Distributors (In-Stock)

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Component Electronics Inc.

Canada . 25 parts In-Stock

1+ parts

$7.690

100+ parts

$5.770

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$5.000

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25

$7.690

$5.770

$5.000

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Vyrian

USA . 4,409 parts In-Stock

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Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Digiode

USA . 2,107 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,500 parts In-Stock

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R&J Components

USA . 463 parts In-Stock

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Anansix

USA . 368 parts In-Stock

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IDEA Electronic Components Group

UK . 1,903 parts In-Stock

1+ parts

$1.403

100+ parts

-

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$1.263

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1,903

$1.403

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$1.263

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Continental Prestige Electronics

USA . 641 parts In-Stock

1+ parts

$2.140

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$1.590

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641

$2.140

$1.590

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MKK Technologies

India . 1,231 parts In-Stock

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$2.638

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$2.638

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AZTECH Wire

Italy . 271 parts In-Stock

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$13.580

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Kepictronics

USA . 22,000 parts In-Stock

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Perfect Parts

USA . 18,931 parts In-Stock

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RC Electronics

USA . 7,356 parts In-Stock

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Epart123

USA . 4,000 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,000 parts In-Stock

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Corphita

USA . 2,376 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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Parana Technologies

USA . 1,801 parts In-Stock

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$1.678

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1,801

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$1.678

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Overview

Elevate your power management solutions with the STB21NM60ND from STMicroelectronics, a leader in semiconductor innovation. This N-channel power FET is designed for efficient switching in demanding applications, ensuring reliability and exceptional performance. With its robust 600V breakdown voltage and superior thermal stability, it stands out in power electronics, delivering high efficiency and reduced energy loss. Trust STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers durability and resistance to environmental factors, making it suitable for varied applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better efficiency and speed compared to their P-channel counterparts, making them more suitable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the protection and functionality of the FET in switching applications, providing additional design flexibility.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for efficient power management in various electronic devices.

Surface Mount: YES

Surface mount technology enables compact designs and simplifies automated assembly, enhancing manufacturability.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures reliability in high-voltage applications and reduces the risk of failure.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space in circuit designs, allowing for compact and efficient layouts.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide a secure connection, essential for reliable operation in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and better control in switching applications, making it a versatile choice.

Maximum Pulsed Drain Current (IDM): 68 A

A high pulsed drain current rating ensures the FET can handle high power spikes, suitable for demanding applications.

Avalanche Energy Rating (EAS): 610 mJ

A high avalanche energy rating provides added protection against voltage spikes, extending the longevity of the device.

Maximum Drain Current (Abs) (ID): 17 A

A maximum drain current capacity of 17 A allows the device to handle significant loads, making it practical for a range of applications.

No. of Terminals: 2

A two-terminal design simplifies connections, making it user-friendly and efficient for integration into circuits.

Maximum Power Dissipation (Abs): 140 W

High power dissipation capability enables this FET to manage heat effectively, crucial for maintaining performance under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, allowing for high-density circuit designs in compact devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides greater scalability and efficiency, enhancing performance in power and signal applications.

Maximum Operating Temperature: 150 °C

A high operating temperature range ensures reliability and performance in harsh environments or high-temperature applications.

Transistor Element Material: SILICON

Silicon is a well-established material for FETs, offering good thermal conductivity and reliable performance characteristics.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and reduces oxidation, contributing to better long-term reliability of connections.

Maximum Drain Current (ID): 17 A

The repeat mention of a maximum drain current of 17 A emphasizes its robustness and suitability for applications requiring reliable current handling.

Maximum Drain-Source On Resistance: 0.22 ohm

Low on-resistance minimizes power loss, improving overall efficiency and thermal performance during operation.

Terminal Position: SINGLE

Single terminal position simplifies design and layout, optimizing space utilization in circuit boards.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with standard soldering processes, making manufacturing easier and more cost-effective.

Peak Reflow Temperature: 245 °C

A peak reflow temperature of 245 °C indicates robustness during manufacturing processes, reducing the risk of thermal damage.

Technical Specifications

Power Field Effect Transistors (FET) STB21NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

610 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB21NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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