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STB21NM60N-1

STMicroelectronics

STB21NM60N-1 by STMicroelectronics

STB21NM60N-1 from STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 68A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,364 parts In-Stock

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8,364

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Digiode

USA . 3,379 parts In-Stock

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3,379

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Anansix

USA . 700 parts In-Stock

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700

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,264 parts In-Stock

1+ parts

$1.274

100+ parts

-

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$1.147

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1,264

$1.274

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$1.147

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MKK Technologies

India . 76 parts In-Stock

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$2.396

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76

$2.396

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DigiPath Technology Company

USA . 76 parts In-Stock

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$2.396

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76

$2.396

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AZTECH Wire

Italy . 770 parts In-Stock

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$12.270

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770

$12.270

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Component Stockers USA

USA . 568 parts In-Stock

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$99.990

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568

$99.990

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RC Electronics

USA . 88,635 parts In-Stock

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88,635

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Alle Elektronik GmbH

Germany . 3,648 parts In-Stock

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3,648

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Corphita

USA . 3,366 parts In-Stock

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3,366

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Parana Technologies

USA . 2,189 parts In-Stock

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$1.524

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$1.524

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A-Z Elektronik GmbH

Germany . 1,530 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Overview

Unlock the potential of your designs with the STB21NM60N-1 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET is engineered for high-efficiency switching applications, delivering unmatched reliability in demanding environments. With its impressive breakdown voltage and built-in diode, it ensures seamless performance while minimizing energy loss. Elevate your projects with a trusted partner that prioritizes quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and reliability, making it suitable for diverse environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically preferred for high-speed applications due to their higher electron mobility, ensuring better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration allows for effective control in switch mode applications, enhancing protection against reverse polarity.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET promotes efficient power management and signal processing.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures reliability in high-voltage applications, providing safety margins in power circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, making it easier to integrate into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure better mechanical stability and ease of soldering, which is advantageous for prototyping.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption while maintaining high performance in active circuits.

Maximum Pulsed Drain Current (IDM): 68 A

The capability to handle up to 68 A of pulsed current allows for robust performance in high-demand applications.

Avalanche Energy Rating (EAS): 610 mJ

A high avalanche energy rating indicates resilience to transient voltage spikes, improving overall circuit reliability.

Maximum Drain Current (Abs) (ID): 17 A

With a maximum drain current of 17 A, this FET can effectively manage substantial loads, making it suitable for various applications.

No. of Terminals: 3

Having three terminals simplifies connection and integration into circuit designs, enhancing layout flexibility.

Maximum Power Dissipation (Abs): 140 W

A high power dissipation rating allows this FET to handle significant power without overheating, ensuring reliable operation.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy assembly and integration into a wide array of electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET energy-efficient in use.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature enhances its capability to function in demanding environments without failure.

Transistor Element Material: SILICON

Silicon as a material provides excellent electrical properties, ensuring better performance and reliability.

Terminal Finish: TIN

Tin terminal finish resists oxidation and improves solderability, ensuring secure connections in various applications.

Maximum Drain Current (ID): 17 A

Repeating the maximum drain current underlines its consistent performance across different operation modes.

Maximum Drain-Source On Resistance: 0.22 ohm

A low on-resistance value minimizes power loss and improves efficiency, making it ideal for high-performance applications.

Terminal Position: SINGLE

Single terminal positioning simplifies board layout, allowing for more compact designs without sacrificing functionality.

Technical Specifications

Power Field Effect Transistors (FET) STB21NM60N-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

610 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB21NM60N-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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