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STA32813TR

STMicroelectronics

STA32813TR by STMicroelectronics

STA32813TR by STMicroelectronics is a consumer IC designed for efficient audio applications. It operates b/w 3V and 3.6V, features a compact 36-terminal package, and withstands temperatures from -20 °C to 85 °C. Ideal for surface mount designs, it ensures reliable performance in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,592 parts In-Stock

1+ parts

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6,592

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Anansix

USA . 2,814 parts In-Stock

1+ parts

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2,814

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Digiode

USA . 837 parts In-Stock

1+ parts

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837

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ACDS - Activité Composants Distribution Service

France . 700 parts In-Stock

1+ parts

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,077 parts In-Stock

1+ parts

$0.377

100+ parts

-

1k+ parts

$0.339

10k+ parts

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1,077

$0.377

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$0.339

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MKK Technologies

India . 1,121 parts In-Stock

1+ parts

$0.709

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1,121

$0.709

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DigiPath Technology Company

USA . 1,121 parts In-Stock

1+ parts

$0.709

100+ parts

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1,121

$0.709

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AZTECH Wire

Italy . 1,112 parts In-Stock

1+ parts

$16.030

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1,112

$16.030

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 2,402 parts In-Stock

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2,402

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Perfect Parts

USA . 1,568 parts In-Stock

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1,568

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Parana Technologies

USA . 1,003 parts In-Stock

1+ parts

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100+ parts

$0.451

1k+ parts

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1,003

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$0.451

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Cyclops Electronics Ltd (Excess)

UK . 700 parts In-Stock

1+ parts

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700

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Glotronic Ltd.

UK . 560 parts In-Stock

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560

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Overview

Elevate your audio experience with the STA32813TR from STMicroelectronics! Renowned for its reliability and innovation, STMicroelectronics brings you this compact consumer IC that seamlessly enhances sound quality in a variety of applications—from home entertainment systems to portable devices. With its robust design and superior performance, the STA32813TR delivers exceptional value, ensuring your projects achieve the highest standards without compromise. Experience crystal-clear audio and unparalleled efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easier and more compact PCB design, making it ideal for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape provides an optimized footprint for PCB layout, facilitating efficient use of space.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC meets the needs of everyday electronic devices, ensuring compatibility and performance.

Power Supplies: 3.3 V

Operating at 3.3 V makes this IC suitable for a wide range of consumer applications, promoting energy efficiency and battery longevity.

No. of Terminals: 36

With 36 terminals, this IC offers ample connections for various functionalities, enhancing versatility in circuit design.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This compact package style helps in thermal management and saves board space, essential for densely packed electronic designs.

Maximum Operating Temperature: 85 °C

Withstanding temperatures up to 85 °C ensures reliable performance in a variety of operating conditions, suitable for diverse applications.

Minimum Operating Temperature: -20 °C

A wide temperature range helps the product perform reliably in harsh environments, making it suitable for outdoor or industrial applications.

Terminal Position: DUAL

The dual terminal positioning allows for effective signal routing and provides flexibility in PCB layout design.

Maximum Seated Height: 3.43 mm

A low seated height contributes to a slimmer profile for devices, supporting modern aesthetics in consumer electronics.

Width: 11 mm

Compact width facilitates denser routing on PCBs, making it ideal for miniaturized electronic applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V enhances compatibility with various battery-powered devices, ensuring efficient operation.

Length: 15.9 mm

Short length aids in optimizing board space, allowing for more components to be integrated into a compact design.

Terminal Form: GULL WING

The gull wing terminal design enhances soldering performance and reliability, ensuring better electrical contact in connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a compact layout while maintaining ease of soldering, striking a balance between space-saving and manufacturing convenience.

Maximum Supply Voltage: 3.6 V

Operating up to 3.6 V provides design flexibility, allowing integration into a variety of systems with differing power supply requirements.

Technical Specifications

Other Function Consumer ICs STA32813TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

STA32813TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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