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ST92F150CV1T3

STMicroelectronics

ST92F150CV1T3 by STMicroelectronics

ST92F150CV1T3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at 4.5-5.5V, and supports up to 125 °C for automotive applications. It includes 77 I/O lines, DMA channels, and 16 ADCs for versatile connectivity. Ideal for embedded systems requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 17,551 parts In-Stock

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Vyrian

USA . 7,400 parts In-Stock

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7,400

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Digiode

USA . 3,477 parts In-Stock

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3,477

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Anansix

USA . 2,800 parts In-Stock

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2,800

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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6

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Microchip USA

USA . 134 parts In-Stock

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$7.139

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134

$7.139

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AZTECH Wire

Italy . 80 parts In-Stock

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$17.890

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80

$17.890

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

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$33.693

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$30.324

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1,904

$33.693

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$30.324

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MKK Technologies

India . 1,953 parts In-Stock

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$63.358

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$63.358

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DigiPath Technology Company

USA . 1,953 parts In-Stock

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$63.358

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$63.358

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QUARKTWIN TECHNOLOGY LTD

USA . 17,163 parts In-Stock

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Metaverse IC Inc.

Canada . 9,999 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Corphita

USA . 1,328 parts In-Stock

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1,328

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Parana Technologies

USA . 1,308 parts In-Stock

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$40.285

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$40.285

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Vigor

Singapore . 1,083 parts In-Stock

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1,083

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A-Z Elektronik GmbH

Germany . 335 parts In-Stock

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335

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Overview

Unlock your design's potential with the ST92F150CV1T3 microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. This powerful 16-bit device excels in automotive applications, delivering unmatched performance and reliability in extreme conditions. With advanced connectivity options and versatile peripherals, it simplifies integration while enhancing functionality. Elevate your projects with a product that embodies superior quality and efficiency, ensuring you stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the microcontroller lightweight and cost-effective, suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and automated assembly, which increases manufacturing speed.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage offers flexibility in powering the microcontroller in more demanding applications.

Address Bus Width: 22

A 22-bit address bus width enables access to a large memory space, improving data handling capabilities.

Package Shape: SQUARE

A square package shape facilitates easier placement on PCBs and can improve thermal efficiency.

Bit Size: 16

The 16-bit architecture allows for efficient data processing and improved performance for a range of applications.

No. of Terminals: 100

A higher number of terminals provides greater connectivity options, making it suitable for complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style is ideal for applications where space is limited and contributes to a sleek design.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for compatibility with a wider range of power sources, enhancing adaptability.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in harsh environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold makes it robust for outdoor or industrial applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish improves solderability and corrosion resistance, ensuring durability in various environments.

ADC Channels: YES

Built-in ADC channels allow for direct analog signal processing, which is beneficial in sensor applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency by allowing peripherals to access memory without CPU intervention.

Terminal Position: QUAD

Quad terminal position ensures strong mechanical connection and is ideal for high-density applications.

ROM Words: 131072

A sizeable ROM allows for complex program storage, necessary for sophisticated control requirements.

Maximum Seated Height: 1.6 mm

The low seated height enables compact design in PCB layouts, perfect for modern electronic devices.

Width: 14 mm

Compact width allows for better layout flexibility in space-constrained designs.

Data EEPROM Size: 1K

An EEPROM size of 1K is advantageous for storing non-volatile data, optimizing memory usage.

External Data Bus Width: 8

An 8-bit external data bus width supports compatibility with various peripherals.

Peripherals: DMA, TIMER(6)

Multiple timers and DMA greatly enhance functionality for time-critical applications and data handling.

Maximum Clock Frequency: 5 MHz

A maximum clock frequency of 5 MHz allows for adequate processing speed for most applications.

Length: 14 mm

The compact length is suitable for space-saving designs essential for modern electronics.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications ensures high reliability and durability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and I/O, making it ideal for embedded systems.

RAM Bytes: 4096

A significant amount of RAM enables efficient task handling and data manipulation.

Technology: HCMOS

HCMOS technology offers high-speed operation and low power consumption, making it efficient.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and improve thermal performance.

Analog To Digital Convertors: 16-Ch 10-Bit

Multiple high-resolution ADC channels facilitate precise data acquisition from various sensors.

Nominal Supply Voltage: 5 V

Standard 5V supply compatibility ensures ease of integration with existing systems.

PWM Channels: YES

PWM channels allow for efficient control of motors and LEDs, enhancing its utility in diverse applications.

Connectivity: CAN, I2C, LIN, SCI(2), SPI

Multiple connectivity options provide flexibility for communication with various devices and protocols.

ROM Programmability: FLASH

Flash ROM enables easy reprogramming of the microcontroller, which is ideal for product updates and development.

Terminal Pitch: 0.5 mm

A fine terminal pitch contributes to high-density designs, making it adaptable for compact circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that proper handling and storage are required, ensuring quality and performance.

Speed: 24 rpm

Speed rating makes it suitable for low-speed applications, ensuring precise control within that range.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a wide variety of applications and enhances programming efficiency.

No. of I/O Lines: 77

A large number of I/O lines increases the potential for interfacing with numerous sensors and devices.

Technical Specifications

Microcontrollers ST92F150CV1T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, LIN, SCI(2), SPI

Peripherals:

DMA, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92F150CV1T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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