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ST92F150CV1QB

STMicroelectronics

ST92F150CV1QB by STMicroelectronics

ST92F150CV1QB microcontroller from STMicroelectronics features a 16-bit architecture, operates at 5V with a max temp of 105 °C, and includes 77 I/O lines. Ideal for industrial applications, it supports CAN, I2C, and SPI connectivity. Its robust design ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,116 parts In-Stock

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Digiode

USA . 943 parts In-Stock

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943

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Anansix

USA . 238 parts In-Stock

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238

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Distributors (Availability)

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AZTECH Wire

Italy . 1,221 parts In-Stock

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$18.650

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$18.650

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

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$21.299

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$19.169

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Microchip USA

USA . 182 parts In-Stock

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$27.313

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MKK Technologies

India . 213 parts In-Stock

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$40.051

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DigiPath Technology Company

USA . 213 parts In-Stock

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$40.051

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QUARKTWIN TECHNOLOGY LTD

USA . 22,964 parts In-Stock

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Vigor

Singapore . 3,653 parts In-Stock

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Corphita

USA . 2,621 parts In-Stock

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Parana Technologies

USA . 86 parts In-Stock

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$25.466

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Overview

Elevate your projects with the ST92F150CV1QB microcontroller from STMicroelectronics, a leader in semiconductor innovation. With its robust design and industrial-grade reliability, this versatile 16-bit microcontroller is perfect for diverse applications, from automation to consumer electronics. Enjoy superior performance and seamless connectivity options, ensuring your designs are not just functional but also future-proof. Experience the quality and value that come from a trusted manufacturer, empowering your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials in the package helps ensure durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into automated manufacturing processes.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V makes it compatible with various power sources commonly used in electronic designs.

Address Bus Width: 22

A wider address bus width supports access to larger memory capacities, enhancing performance for complex applications.

Package Shape: RECTANGULAR

The rectangular shape promotes efficient use of PCB space, allowing for better layout and organization in designs.

Bit Size: 16

A 16-bit architecture enables processing of a larger set of data compared to 8-bit microcontrollers, offering better performance.

Power Supplies (V): 5

Operates at a nominal supply voltage of 5 V, making it ideal for interfacing with standard logic levels in digital circuits.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options to integrate multiple peripherals, enhancing its versatility.

Package Style (Meter): FLATPACK

Flatpack style provides a low profile suitable for space-constrained applications while maintaining reliability.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures flexibility in power supply choices, accommodating various design requirements.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature makes this microcontroller ideal for industrial applications where extreme conditions may be present.

CPU Family: ST9

The ST9 CPU family is known for high performance and efficiency, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is reliable in harsh environments, such as automotive or industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and resistance to corrosion, leading to enhanced longevity of connections.

ADC Channels: YES

Having ADC channels allows for the conversion of analog signals to digital, essential for applications requiring sensor data processing.

DMA Channels: YES

DMA capability allows for faster data transfers and reduced CPU load, leading to improved system efficiency.

Terminal Position: QUAD

Quad terminal position enhances soldering efficiency and allows for better thermal and electrical performance.

ROM Words: 131072

A substantial ROM size provides ample space for code storage, supporting complex application development.

Maximum Seated Height: 3.4 mm

The low seated height enables efficient design in compact spaces while facilitating better heat dissipation.

Width: 14 mm

A narrow width supports tighter packing of components on PCB, allowing for more complex designs.

Data EEPROM Size: 1K

1K of data EEPROM is useful for storing small amounts of data that must persist through power cycles.

External Data Bus Width: 8

An 8-bit external data bus width allows for simpler interfacing with various peripherals and memory units.

Peripherals: DMA, TIMER(6)

Rich peripheral offerings like six timers and DMA channels enable diverse functionality and efficient control of operations.

Maximum Clock Frequency: 5 MHz

With a maximum clock frequency of 5 MHz, this microcontroller provides sufficient speed for many general-purpose applications.

Length: 20 mm

The overall length accommodates various design constraints while managing to provide enough terminal connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable operation in environments subject to temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functions on one chip, reducing component count and complexity in designs.

RAM Bytes: 6144

With 6144 bytes of RAM, there is sufficient temporary storage for processing data, which is critical for performance.

Technology: HCMOS

HCMOS technology provides low power consumption and high speed, optimizing performance in battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and are effective for automated assembly processes.

Analog To Digital Converters: 16-Ch 10-Bit

The presence of 16 channels of 10-bit ADC provides extensive capability for real-time data processing from multiple sensors.

Maximum Supply Current: 60 mA

A maximum supply current of 60 mA indicates efficient power use, making it suitable for low-power applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V facilitates easy integration with a wide range of other electronic components.

PWM Channels: YES

PWM channels enable precise control of motors and other actuators, essential for applications requiring motor control.

Connectivity: CAN, I2C, SCI(2), SPI

Robust connectivity options like CAN and SPI ensure compatibility with many devices and systems, promoting versatility.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming of the microcontroller, facilitating development and deployment.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch fits well with modern PCB designs, ensuring compatibility with various mounting options.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product is suitable for exposure to moisture, which is significant for storage and handling.

Speed: 24 rpm

A speed specification of 24 rpm is appropriate for various slow-turn applications, enhancing motor control capabilities.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for better alignment with 8-bit data processing, resulting in efficient code execution.

No. of I/O Lines: 77

A total of 77 I/O lines provides flexibility in interfacing with multiple devices, making it ideal for modular designs.

Technical Specifications

Microcontrollers ST92F150CV1QB attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, SCI(2), SPI

Peripherals:

DMA, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92F150CV1QB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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