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ST92F150CR9TB

STMicroelectronics

ST92F150CR9TB by STMicroelectronics

ST92F150CR9TB microcontroller from STMicroelectronics features a 16-bit architecture, operates at a max voltage of 5.5V, and includes 64 terminals. With industrial-grade temp range (-40 °C to 105 °C), it's ideal for embedded applications requiring reliability. Its flash ROM supports versatile programming needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,013 parts In-Stock

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Vyrian

USA . 3,572 parts In-Stock

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3,572

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Anansix

USA . 811 parts In-Stock

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811

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Microchip USA

USA . 2,191 parts In-Stock

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$12.698

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$12.698

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AZTECH Wire

Italy . 1,171 parts In-Stock

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$17.240

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$17.240

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IDEA Electronic Components Group

UK . 1,376 parts In-Stock

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$61.542

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$55.387

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1,376

$61.542

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MKK Technologies

India . 1,611 parts In-Stock

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$115.725

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$115.725

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DigiPath Technology Company

USA . 1,611 parts In-Stock

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$115.725

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$115.725

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A-Z Elektronik GmbH

Germany . 7,319 parts In-Stock

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Corphita

USA . 4,313 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Parana Technologies

USA . 135 parts In-Stock

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$73.582

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Overview

Elevate your projects with the ST92F150CR9TB microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile 16-bit MCU is perfect for industrial applications, delivering reliability even in demanding environments. With its low power consumption, robust performance, and extensive functionality like ADC and PWM support, it empowers engineers to create efficient and advanced solutions tailored to their needs. Choose STMicroelectronics for trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable package material provides protection and a long lifespan, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing, saving space on the PCB.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows the microcontroller to be compatible with a wider range of power sources.

Address Bus Width: 22

A wide address bus enables the microcontroller to access larger memory, enhancing performance and functionality.

Package Shape: SQUARE

The square shape design can facilitate efficient space utilization on circuit boards.

Bit Size: 16

With a 16-bit size, this microcontroller can handle more complex operations than 8-bit counterparts.

Power Supplies (V): 5

Operating on a common 5V supply makes integration with other devices and systems straightforward.

No. of Terminals: 64

The availability of 64 terminals allows for extensive peripheral connections, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile flatpack styles are ideal for applications requiring space-efficient designs.

Minimum Supply Voltage: 4.5 V

This allows for a wider range of operational conditions and power supply options.

Maximum Operating Temperature: 105 °C

This high temperature tolerance ensures reliability in demanding thermal environments.

CPU Family: ST9

Being part of the ST9 family means compatibility with a strong ecosystem of tools and software.

Minimum Operating Temperature: -40 °C

Excellent low-temperature performance makes it suitable for use in harsh environments.

Terminal Finish: TIN SILVER COPPER

The robust terminal finish provides excellent solderability and prevents corrosion for long-term reliability.

ADC Channels: YES

Integrated ADC channels improve the microcontroller's capability to interface with analog signals.

DMA Channels: YES

Direct Memory Access channels enhance performance by allowing data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal positions offer easy mounting and versatility in PCB layouts.

ROM Words: 65536

A sizable ROM capacity allows for extensive program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

A low seated height is suitable for designs requiring minimal height profiles.

Width: 14 mm

Compact width is ideal for space-constrained applications.

External Data Bus Width: 8

An 8-bit external data bus supports compatibility with various peripherals and simplifies integration.

Maximum Clock Frequency: 5 MHz

A clock speed of 5 MHz provides sufficient performance for many embedded applications.

Length: 14 mm

Compact length facilitates easy integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability and reliability under tough conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it provides the essential control for a variety of electronic applications.

RAM Bytes: 2048

Adequate RAM allows for efficient data handling and processing for more advanced applications.

Technology: HCMOS

HCMOS technology ensures low power consumption while maintaining high speed and performance.

Terminal Form: GULL WING

Gull-wing terminal form offers excellent soldering characteristics and automated assembly compatibility.

Maximum Supply Current: 60 mA

A moderate current consumption ensures energy efficiency, extending battery life in portable applications.

Nominal Supply Voltage: 5 V

A commonly used nominal supply voltage provides easy compatibility with other devices.

PWM Channels: YES

Integrated PWM channels allow for precise control of motors and other devices.

ROM Programmability: FLASH

Flash programmability allows for easy updating and flexibility in application development.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch makes it compatible with modern PCB design and assembly processes.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates it can withstand some moisture without immediate concerns, aiding in storage and handling.

Speed: 24 rpm

Operating at a speed of 24 rpm is sufficient for many applications requiring basic mechanical movement.

No. of I/O Lines: 77

A high number of I/O lines provides exceptional versatility in interfacing with various devices and peripherals.

Technical Specifications

Microcontrollers ST92F150CR9TB attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST92F150CR9TB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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