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ST92F124V1QB

STMicroelectronics

ST92F124V1QB by STMicroelectronics

ST92F124V1QB microcontroller from STMicroelectronics features a 16-bit architecture, operates at 5 V with a max temp of 105 °C, and includes 77 I/O lines. Ideal for industrial applications, it supports CAN and SPI connectivity. Its robust design ensures reliable performance in demanding environments.

Median Price

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5

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1k+

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Vyrian

USA . 2,502 parts In-Stock

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Digiode

USA . 358 parts In-Stock

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Anansix

USA . 119 parts In-Stock

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Q Components

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ACDS - Activité Composants Distribution Service

France . 43 parts In-Stock

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Microchip USA

USA . 233 parts In-Stock

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$6.977

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AZTECH Wire

Italy . 1,041 parts In-Stock

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$19.980

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IDEA Electronic Components Group

UK . 703 parts In-Stock

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$61.599

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$55.439

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Component Stockers USA

USA . 286 parts In-Stock

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$99.990

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MKK Technologies

India . 5 parts In-Stock

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$115.832

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DigiPath Technology Company

USA . 5 parts In-Stock

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$115.832

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QUARKTWIN TECHNOLOGY LTD

USA . 23,940 parts In-Stock

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Corphita

USA . 3,958 parts In-Stock

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Vigor

Singapore . 1,449 parts In-Stock

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Parana Technologies

USA . 927 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of innovation with the ST92F124V1QB microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics delivers a versatile solution perfect for diverse applications—from industrial automation to consumer electronics. Experience seamless performance with advanced features that enhance efficiency, reduce power consumption, and enable rapid development, ensuring you stay ahead in today’s competitive market. Elevate your projects with a trusted partner!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers good durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

The surface mount design allows for compact placement on PCBs, saving space and enabling high-density designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard digital logic levels, enhancing flexibility in system design.

Address Bus Width: 22

The 22-bit address bus width enables the microcontroller to access a wider range of memory, allowing for more complex applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout options on the PCB, promoting better circuit design.

Bit Size: 16

A 16-bit architecture provides a good balance between processing capability and resource utilization, ideal for embedded applications.

Power Supplies (V): 5

Operating at a nominal power supply of 5V simplifies design requirements, making it easier to integrate into various systems.

No. of Terminals: 100

Having 100 terminals offers numerous input/output connections, facilitating complex inter-component communications.

Package Style (Meter): FLATPACK

The flatpack style ensures low profile design, making it advantageous for space-constrained applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V provides a wide operating voltage range, enhancing system reliability.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, this microcontroller is suitable for harsh conditions in industrial environments.

CPU Family: ST9

The ST9 CPU family brings robustness and efficiency, making it a trusted choice for varied applications.

Minimum Operating Temperature: -40 °C

This wide temperature range (-40 °C to 105 °C) allows operation in extreme conditions, perfect for outdoor or industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and oxidation resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels facilitate direct conversion of analog signals, simplifying interfacing with sensors and other analog devices.

DMA Channels: YES

Presence of DMA channels allows for efficient data transfer without CPU intervention, improving performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB layout design and improves thermal performance.

ROM Words: 131072

The substantial ROM size is ideal for complex applications requiring significant program storage.

Maximum Seated Height: 3.4 mm

The low seated height helps in achieving a compact design, beneficial for miniaturized applications.

Width: 14 mm

The compact width allows for efficient space utilization on the PCB, making it suitable for portable solutions.

Data EEPROM Size: 1K

A data EEPROM size of 1K allows for easy and efficient data storage, important for settings and configurations.

External Data Bus Width: 8

An 8-bit external data bus width provides compatibility with various peripherals, enhancing system integratability.

Peripherals: DMA, TIMER(6)

Multiple timers and DMA peripherals enhance the microcontroller's ability to handle timing-critical and data-intensive tasks.

Maximum Clock Frequency: 5 MHz

A maximum clock frequency of 5 MHz provides efficient processing speed for real-time applications.

Length: 20 mm

The length is optimized for compact PCB designs, benefiting space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various functionalities required for embedded systems, minimizing the need for additional components.

RAM Bytes: 4096

A RAM size of 4096 bytes allows for sufficient temporary data storage during processing tasks.

Technology: HCMOS

HCMOS technology offers low power consumption and high-speed operation, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, ensuring durability and ease of assembly.

Analog To Digital Convertors: 16-Ch 10-Bit

The 16-channel 10-bit ADC support allows multiple sensor inputs, which is ideal for monitoring and control systems.

Maximum Supply Current: 60 mA

A maximum supply current of 60 mA ensures efficient power consumption, critical for low-power applications.

Nominal Supply Voltage: 5 V

Operating at a standard voltage of 5V enhances compatibility with common electronic components.

PWM Channels: YES

Integrated PWM channels enable precise control over motor speeds and other applications requiring pulse-width modulation.

Connectivity: CAN, I2C, LIN, SCI(2), SPI

Diverse connectivity options provide flexibility in selecting communication protocols, facilitating easy integration into existing systems.

ROM Programmability: FLASH

With FLASH ROM programmability, updates and modifications can be easily implemented, adding to the product's versatility.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm ensures compatibility with modern high-density board designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, guiding proper handling and storage to ensure reliability.

Speed: 24 rpm

The specified operational speed can be advantageous for applications requiring specific actuation speeds, like motors.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates access and execution of instructions in an efficient manner.

No. of I/O Lines: 77

With 77 I/O lines, it offers significant interfacing capability for complex applications, making it a versatile choice.

Technical Specifications

Microcontrollers ST92F124V1QB attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, LIN, SCI(2), SPI

Peripherals:

DMA, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92F124V1QB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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