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ST72F63BE2M1

STMicroelectronics

ST72F63BE2M1 by STMicroelectronics

ST72F63BE2M1 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 24 MHz, operating voltage b/w 4-5.5 V, and includes ADC and PWM channels. Ideal for embedded applications, it offers 8192 ROM words and 384 RAM bytes in a compact SO package. Its commercial-grade design ensures reliability in various temperature conditions up to 70 °C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,302 parts In-Stock

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Anansix

USA . 2,286 parts In-Stock

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Digiode

USA . 586 parts In-Stock

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Microchip USA

USA . 313 parts In-Stock

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$10.908

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313

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AZTECH Wire

Italy . 946 parts In-Stock

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$20.530

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946

$20.530

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IDEA Electronic Components Group

UK . 1,756 parts In-Stock

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$41.325

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$37.193

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MKK Technologies

India . 2,158 parts In-Stock

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$77.710

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DigiPath Technology Company

USA . 2,158 parts In-Stock

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$77.710

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Component Stockers USA

USA . 798 parts In-Stock

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$99.990

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Vigor

Singapore . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,562 parts In-Stock

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Corphita

USA . 3,040 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Parana Technologies

USA . 768 parts In-Stock

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Kepictronics

USA . 218 parts In-Stock

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Overview

Elevate your projects with the ST72F63BE2M1 microcontroller from STMicroelectronics, a trusted leader in innovative technology. This versatile 8-bit MCU is designed for seamless integration and reliability, perfect for diverse applications like industrial automation and consumer electronics. Benefit from its compact design, low power consumption, and rich feature set, ensuring optimal performance and longevity. Choose STMicroelectronics for unmatched quality and performance that drive your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller designs and efficient use of PCB space, ideal for compact electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of circuits while maintaining stable performance.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCB layouts.

Bit Size: 8

An 8-bit architecture makes it suited for simpler applications while offering a balance between performance and power consumption.

Power Supplies (V): 5

Operating at a standard 5V supply voltage makes it easy to power using common sources, enhancing design flexibility.

No. of Terminals: 24

With 24 terminals, this microcontroller provides ample connectivity options for various peripherals and I/O lines.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it suitable for modern, compact electronic products.

Minimum Supply Voltage: 4 V

With a low minimum supply voltage of 4 V, it can operate efficiently in battery-powered applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in conditions that are common in many environments.

CPU Family: ST72

The ST72 CPU family provides a well-established architecture known for reliability and performance in applications.

Minimum Operating Temperature: 0 °C

The capability to operate from 0 °C makes this microcontroller versatile for various environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and long-term reliability in electronic assemblies.

ADC Channels: YES

Built-in ADC channels allow for effective analog signal processing, making it suitable for sensor applications.

DMA Channels: YES

DMA support improves data transfer efficiency, reducing CPU overhead for time-sensitive tasks.

Terminal Position: DUAL

Dual terminal position provides options for flexible board design and accommodates various mounting needs.

ROM Words: 8192

With 8192 ROM words, there's ample space for code storage, supporting more complex applications.

Maximum Seated Height: 2.65 mm

A low seated height facilitates tighter component placements on PCBs, crucial for modern electronics.

Width: 7.5 mm

At only 7.5 mm wide, this microcontroller contributes to space-efficient designs.

Maximum Clock Frequency: 24 MHz

A clock frequency of 24 MHz ensures decent processing speed for a variety of applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds helps ensure that the component can withstand the soldering process without damage.

Peak Reflow Temperature °C: 250

Ability to withstand a peak reflow temperature of 250 °C ensures compatibility with modern soldering methods.

Length: 15.4 mm

The compact length helps maintain a smaller footprint, making it ideal for space-constrained applications.

Temperature Grade: COMMERCIAL

A commercial temperature grade indicates suitability for general-purpose applications, making it versatile for various uses.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it provides integrated features that reduce the need for additional components.

RAM Bytes: 384

With 384 bytes of RAM, it can efficiently handle simple applications requiring temporary data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form is commonly used, making assembly straightforward and compatible with standard manufacturing processes.

Maximum Supply Current: 13 mA

A maximum supply current of just 13 mA ensures low power consumption, great for energy-efficient designs.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V indicates compatibility with common power sources and a widespread application range.

PWM Channels: YES

PWM channels enable precise control of motors and other devices, enhancing the microcontroller's versatility in applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easier updates and changes in firmware, providing flexibility for developers.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables high-density packing, suitable for modern compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate level of moisture sensitivity, guiding proper handling and storage for reliability.

Speed: 8 rpm

The 8 rpm operational speed is suitable for basic control applications where high-speed processing is not required.

No. of I/O Lines: 14

With 14 I/O lines, it offers sufficient interfacing options for connecting various peripherals and components.

Technical Specifications

Microcontrollers ST72F63BE2M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST72F63BE2M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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