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ST72F621L4M1

STMicroelectronics

ST72F621L4M1 by STMicroelectronics

ST72F621L4M1 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 12 MHz, supporting up to 34 terminals. It operates b/w 4-5.5 V and includes 8 ADC channels for versatile applications in embedded systems. Ideal for commercial use, it offers robust connectivity options like SPI and USB.

Median Price

$4.262

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

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$3.923

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1

$3.923

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Chip1Stop

Japan . 1 parts In-Stock

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$4.600

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1

$4.600

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Distributors (In-Stock)

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Digiode

USA . 1,207 parts In-Stock

1+ parts

$3.548

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1,207

$3.548

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Vyrian

USA . 4,160 parts In-Stock

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4,160

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Anansix

USA . 2,558 parts In-Stock

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2,558

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Electronics Depot

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Corphita

USA . 721 parts In-Stock

1+ parts

$3.362

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721

$3.362

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Microchip USA

USA . 293 parts In-Stock

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$7.686

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293

$7.686

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AZTECH Wire

Italy . 544 parts In-Stock

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$12.620

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544

$12.620

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IDEA Electronic Components Group

UK . 2,366 parts In-Stock

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$53.613

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$48.252

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$53.613

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$48.252

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MKK Technologies

India . 2,156 parts In-Stock

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$100.816

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$100.816

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DigiPath Technology Company

USA . 2,156 parts In-Stock

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$100.816

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$100.816

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A-Z Elektronik GmbH

Germany . 7,277 parts In-Stock

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Kepictronics

USA . 3,852 parts In-Stock

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Perfect Parts

USA . 2,176 parts In-Stock

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Vigor

Singapore . 1,257 parts In-Stock

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Parana Technologies

USA . 467 parts In-Stock

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$64.102

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467

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$64.102

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Overview

Unlock potential with the ST72F621L4M1 microcontroller from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for versatility and reliability, this 8-bit powerhouse excels in various applications, from industrial automation to consumer electronics. Enjoy enhanced performance and reduced power consumption, ensuring your projects run smoothly. With robust support and quality assurance from STMicroelectronics, elevate your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable package, making it ideal for a variety of applications.

Surface Mount: YES

Surface mount technology allows for more compact designs, enabling efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V supports low power consumption while ensuring reliable operation.

Package Shape: RECTANGULAR

The rectangular shape is well-suited for standard mounting processes and optimizes PCB layout.

Bit Size: 8

An 8-bit architecture simplifies programming and is sufficient for numerous embedded applications.

Power Supplies (V): 5

Designed for a nominal 5 V supply, making it compatible with a wide range of existing power systems.

No. of Terminals: 34

A sufficient number of terminals provides flexibility for numerous I/O connections, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements while allowing for efficient heat dissipation.

Minimum Supply Voltage: 4 V

The 4 V minimum supply voltage supports operation in diverse environments without risking performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microcontroller is suitable for commercial environments.

CPU Family: ST72

The ST72 CPU family is known for its reliability and performance, making it a trusted choice for developers.

Minimum Operating Temperature: 0 °C

Designed to operate from 0 °C, enabling use in a variety of controlled ambient conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Ni/Pd/Au terminal finish provides excellent corrosion resistance and reliable connectivity over time.

ADC Channels: YES

Integrated ADC channels allow for efficient digital-to-analog signal conversion, enhancing sensor application capabilities.

Terminal Position: DUAL

Dual terminal position improves layout flexibility and can assist in easier routing on PCB.

ROM Words: 16384

A generous ROM capacity of 16384 words allows for complex programs and increased functionality.

Maximum Seated Height: 2.642 mm

The low seated height ensures compatibility with a variety of compact device designs.

Width: 7.5 mm

The compact width enables denser assembly on PCBs, optimizing product designs with limited space.

Peripherals: POR, TIMER(3)

Includes essential peripherals like power-on reset and timers, enhancing operational stability and timing functions.

Maximum Clock Frequency: 12 MHz

With a maximum clock frequency of 12 MHz, this microcontroller can handle a range of moderate performance tasks.

Maximum Time At Peak Reflow Temperature: 30s

Designed to withstand peak reflow temperatures without compromising reliability during soldering processes.

Peak Reflow Temperature: 260 °C

Ability to tolerate high reflow temperatures ensures compatibility with modern surface-mount assembly techniques.

Length: 17.885 mm

The length fits well within standard footprints for microcontrollers, ensuring easy integration.

Temperature Grade: COMMERCIAL

Commercial temperature grading makes this microcontroller suitable for a wide range of consumer applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is specifically optimized for control-oriented tasks in embedded systems.

RAM Bytes: 768

768 bytes of RAM offer ample workspace for basic processing tasks, suitable for many embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form is commonly used and facilitates easier soldering and handling.

Analog To Digital Converters: 8-Ch 10-Bit

Having multiple ADC channels with 10-bit resolution allows it to accurately measure a range of analog signals.

Maximum Supply Current: 24 mA

A maximum supply current of 24 mA ensures efficient power usage during standard operations.

Nominal Supply Voltage: 5 V

Stable operation at nominal 5 V power supply allows for reliable performance in various applications.

PWM Channels: YES

The inclusion of PWM channels enables precise control of devices such as motors and lighting.

Connectivity: SCI, SPI, USB

Diverse connectivity options including SCI, SPI, and USB enhance integration potential with other devices and systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to software after deployment.

Terminal Pitch: 1.016 mm

A terminal pitch of 1.016 mm standardizes connections and eases PCB layout design.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate handling precautions necessary, which is acceptable for most assembly processes.

Speed: 8 rpm

Capable of achieving 8 rpm, this microcontroller is suitable for low to moderate speed applications.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, it can efficiently handle many control tasks in embedded applications.

No. of I/O Lines: 23

A generous number of I/O lines gives flexibility to interface with various sensors and actuators.

Technical Specifications

Microcontrollers ST72F621L4M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G34

JESD-609 Code:

e4

Length:

17.885 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

23

No. of Terminals:

34

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP34,.4,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2.642 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.016 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI, USB

Peripherals:

POR, TIMER(3)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F621L4M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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