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ST72F561R6TA

STMicroelectronics

ST72F561R6TA by STMicroelectronics

ST72F561R6TA microcontroller from STMicroelectronics features a 5V supply, 64 terminals, and operates at temperatures from -40 °C to 85 °C. With 32KB ROM and 1KB RAM, it supports various connectivity options like CAN and SPI. Ideal for industrial applications requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,666 parts In-Stock

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4,666

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Vyrian

USA . 2,036 parts In-Stock

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2,036

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Anansix

USA . 734 parts In-Stock

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734

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Distributors (Availability)

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Microchip USA

USA . 327 parts In-Stock

1+ parts

$9.482

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327

$9.482

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AZTECH Wire

Italy . 268 parts In-Stock

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$12.240

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268

$12.240

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IDEA Electronic Components Group

UK . 161 parts In-Stock

1+ parts

$76.961

100+ parts

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$69.265

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161

$76.961

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$69.265

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MKK Technologies

India . 2,371 parts In-Stock

1+ parts

$144.720

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2,371

$144.720

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DigiPath Technology Company

USA . 2,371 parts In-Stock

1+ parts

$144.720

100+ parts

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2,371

$144.720

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Vigor

Singapore . 6,580 parts In-Stock

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6,580

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Corphita

USA . 3,564 parts In-Stock

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3,564

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Parana Technologies

USA . 1,447 parts In-Stock

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$92.018

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1,447

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$92.018

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Overview

Unlock the potential of your projects with the ST72F561R6TA microcontroller from STMicroelectronics, a trusted leader in semiconductor solutions. Designed for versatility and reliability, this powerful 8-bit MCU is perfect for industrial applications, offering robust performance in challenging environments. With advanced features like multiple timers and ADC channels, it ensures precision and efficiency, delivering exceptional value to your designs while enhancing connectivity and flexibility. Elevate your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for easier integration into modern compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V makes this microcontroller suitable for a wide range of low-power applications.

Package Shape: SQUARE

The square package shape optimizes PCB space, making it convenient for various layout designs.

Bit Size: 8

The 8-bit architecture is well-suited for applications requiring efficient processing of medium complexity tasks.

Power Supplies (V): 5

Supports standard 5V power supply, ensuring compatibility with many existing systems and peripherals.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for various peripherals and interfacing.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design helps in achieving a compact and space-efficient PCB design.

Minimum Supply Voltage: 4.5 V

Operating at a minimum of 4.5 V ensures functionality under varying input conditions, enhancing flexibility.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C makes this microcontroller suitable for industrial-grade applications.

CPU Family: ST72

Being part of the ST72 family, it benefits from a rich ecosystem of tools and support for development.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature allows for deployment in harsh environments, adding to its versatility.

ADC Channels: YES

Integrated ADC channels support sensor interfacing, making it suitable for real-time data acquisition applications.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity options and layout simplicity on PCBs.

ROM Words: 32768

With 32K of ROM, it supports substantial code storage for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height optimizes space usage and compatibility with low-profile designs.

Width: 14 mm

Compact width allows for high-density layouts, saving board space.

Peripherals: TIMER(5)

Five built-in timers provide versatile timing options for control applications, enhancing functionality.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for decent processing speeds for most applications.

Length: 14 mm

The short length further contributes to a compact design footprint, facilitating integration.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for reliability ensures consistent performance in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates computing and peripheral functionalities, simplifying design and reducing costs.

No. of Timers: 5

The availability of multiple timers offers flexibility for various timing applications and enhances real-time performance.

RAM Bytes: 1024

With 1KB of RAM, it accommodates moderate data processing needs.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminal form provides robust connections and ease of soldering in surface-mount applications.

Analog To Digital Convertors: 16-Ch 10-Bit

The 16-channel 10-bit ADC allows for multiple simultaneous inputs, beneficial for sensor data collection.

Maximum Supply Current: 150 mA

A supply current of 150 mA ensures adequate power for various peripherals while maintaining energy efficiency.

Nominal Supply Voltage: 5 V

Nominal operation at 5V ensures compatibility with standard digital logic and peripherals.

PWM Channels: YES

Support for PWM channels enables control over motor speed and other applications requiring pulse-width modulation.

Connectivity: CAN, LIN(2), SCI(2), SPI

Multiple connectivity options provide flexibility for communication between devices, essential for modern applications.

ROM Programmability: FLASH

Flash programmability allows for easy field updates and flexibility in software design.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is standard for many surface mount applications, ensuring widespread manufacturability.

Speed: 8 rpm

An operational speed of 8 rpm is suitable for low-speed applications, making it versatile for specific tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides efficient usage for smaller applications.

No. of I/O Lines: 48

With 48 I/O lines, it offers extensive interfacing options for various peripheral devices, enhancing functionality.

Technical Specifications

Microcontrollers ST72F561R6TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of I/O Lines:

48

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, LIN(2), SCI(2), SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F561R6TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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