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ST72F561K9TC

STMicroelectronics

ST72F561K9TC by STMicroelectronics

ST72F561K9TC microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w -40 °C to 125 °C, and supports up to 24 I/O lines. Ideal for automotive applications, it offers FLASH ROM with 61440 words and includes ADC/PWM channels. Its compact flatpack design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,998 parts In-Stock

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3,998

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Vyrian

USA . 2,373 parts In-Stock

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2,373

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Anansix

USA . 2,320 parts In-Stock

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2,320

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Distributors (Availability)

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AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$18.720

100+ parts

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443

$18.720

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Microchip USA

USA . 338 parts In-Stock

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$24.683

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338

$24.683

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IDEA Electronic Components Group

UK . 1,823 parts In-Stock

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$30.607

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$27.547

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1,823

$30.607

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$27.547

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MKK Technologies

India . 1,930 parts In-Stock

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$57.555

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1,930

$57.555

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DigiPath Technology Company

USA . 1,930 parts In-Stock

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$57.555

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1,930

$57.555

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Component Stockers USA

USA . 302 parts In-Stock

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$99.990

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302

$99.990

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A-Z Elektronik GmbH

Germany . 6,888 parts In-Stock

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6,888

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,384 parts In-Stock

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3,384

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Parana Technologies

USA . 2,309 parts In-Stock

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$36.596

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2,309

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$36.596

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Vigor

Singapore . 1,257 parts In-Stock

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Overview

Unlock unparalleled performance with the ST72F561K9TC microcontroller from STMicroelectronics—your trusted partner in innovative solutions. This advanced 8-bit MCU excels in automotive applications, ensuring reliability and efficiency even in extreme conditions. Enjoy smooth integration with its low-profile design and robust features, offering exceptional power management and versatility. Elevate your projects with a product that embodies quality and supports your ambitions for cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability facilitates compact design and easier assembly on PCBs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard power supplies while providing some margin for safety.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, making it suitable for designs with tight space constraints.

Bit Size: 8

With an 8-bit architecture, this microcontroller is suitable for basic control tasks and low-power applications.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5 V makes it easy to power the device with commonly available supplies.

No. of Terminals: 32

A total of 32 terminals provides a good balance of I/O capability while maintaining a compact footprint.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style allows for better heat dissipation and is ideally suited for space-constrained applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage requirement of 4.5 V ensures stable operation during slight fluctuations in power supply.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this microcontroller suitable for automotive and industrial applications.

CPU Family: ST72

Part of the ST72 family, it benefits from a well-established lineage of reliable and efficient microcontrollers.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C ensures reliability in harsh environments.

ADC Channels: YES

Integrated ADC channels allow for the conversion of analog signals, enhancing its functionality in sensor applications.

Terminal Position: QUAD

The quad terminal position facilitates efficient PCB layout and easier soldering.

ROM Words: 61440

A large ROM capacity provides ample space for program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

A low seated height assists in maintaining a compact profile for embedded systems.

Width: 7 mm

At a width of only 7 mm, this microcontroller maximizes PCB space utilization.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for efficient processing of tasks and fast response times.

Maximum Time At Peak Reflow Temperature (s): 40

The specified reflow temperature time ensures compatibility with standard manufacturing processes.

Peak Reflow Temperature (°C): 260

The peak reflow temperature tolerance enhances its reliability during assembly.

Length: 7 mm

Its compact length makes it ideal for space-limited designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade specification ensures robustness for automotive applications, involving rigorous testing standards.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates essential control features, making it suitable for diverse applications.

RAM Bytes: 2048

With 2048 bytes of RAM, it supports moderate processing tasks and data manipulation.

Technology: CMOS

CMOS technology enables low power consumption, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals provide good soldering reliability and ease of handling during assembly.

Maximum Supply Current: 15 mA

Low maximum supply current helps in extending battery life in portable and battery-powered applications.

Nominal Supply Voltage: 5 V

Operating at a standard 5 V supply voltage simplifies design and integration with other components.

PWM Channels: YES

Integrated PWM channels allow for precise control in applications like motor control and light dimming.

ROM Programmability: FLASH

Flash programmability offers flexibility for in-field updates, which is crucial for evolving applications.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch facilitates modern manufacturing processes while ensuring stable connections.

Speed: 8 rpm

The operational speed of 8 rpm is suitable for specific low-speed applications, enhancing its versatility.

No. of I/O Lines: 24

With 24 I/O lines, it provides sufficient connectivity for a range of external peripherals and sensors.

Technical Specifications

Microcontrollers ST72F561K9TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3/e4

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F561K9TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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