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ST72F561K6TC

STMicroelectronics

ST72F561K6TC by STMicroelectronics

ST72F561K6TC microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w -40 °C to 125 °C, and supports 32 terminals. With 32 KB ROM and 1 KB RAM, it's ideal for automotive applications requiring reliable performance. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,611 parts In-Stock

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6,611

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Anansix

USA . 2,413 parts In-Stock

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2,413

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Digiode

USA . 359 parts In-Stock

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359

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Distributors (Availability)

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Microchip USA

USA . 371 parts In-Stock

1+ parts

$14.677

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371

$14.677

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AZTECH Wire

Italy . 1,139 parts In-Stock

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$17.920

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1,139

$17.920

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IDEA Electronic Components Group

UK . 1,561 parts In-Stock

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$72.389

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$65.150

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1,561

$72.389

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$65.150

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MKK Technologies

India . 2,132 parts In-Stock

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$136.123

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2,132

$136.123

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DigiPath Technology Company

USA . 2,132 parts In-Stock

1+ parts

$136.123

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2,132

$136.123

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A-Z Elektronik GmbH

Germany . 5,978 parts In-Stock

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Corphita

USA . 3,303 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,599 parts In-Stock

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$86.552

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$86.552

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Overview

Unlock unparalleled performance and reliability with the ST72F561K6TC microcontroller from STMicroelectronics. Renowned for its innovation and quality, STMicroelectronics delivers a robust solution ideal for automotive applications and more. With a compact design and versatile features, this microcontroller ensures efficient operation across various environments, empowering your projects with enhanced control and functionality. Elevate your designs with trusted technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection, making this microcontroller suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and increased assembly efficiency, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard power sources often used in embedded systems.

Package Shape: SQUARE

The square package shape aids in efficient PCB layout and contributes to uniform thermal distribution.

Bit Size: 8

The 8-bit architecture is well-suited for simple control applications and is widely supported by software tools.

Power Supplies (V): 5

Designed to operate at 5 V, this microcontroller can easily interface with a variety of sensors and peripherals that use standard power levels.

No. of Terminals: 32

32 terminals provide sufficient I/O options for connecting to multiple devices, making it versatile for different applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design minimizes space usage, which is beneficial for compact electronics.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows for operation in battery-powered applications, enhancing its versatility.

Maximum Operating Temperature: 125 °C

This high operating temperature range makes it suitable for automotive and industrial applications where heat might be a concern.

CPU Family: ST72

The ST72 CPU family is known for reliability and efficiency, which are crucial for stable system performance.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold makes this microcontroller ideal for outdoor applications and harsh environments.

ADC Channels: YES

Onboard ADC channels allow for easy analog signal processing, which is valuable for applications involving sensors.

Terminal Position: QUAD

The quad terminal position simplifies PCB design and facilitates easier soldering.

ROM Words: 32768

With 32k ROM words, this microcontroller can store substantial program code, enabling the implementation of complex algorithms.

Maximum Seated Height: 1.6 mm

A low seated height contributes to a thinner profile in designs, allowing for sleeker end products.

Width: 7 mm

A compact width of 7 mm enhances design flexibility and integration into space-critical applications.

Maximum Clock Frequency: 16 MHz

The 16 MHz clock frequency ensures adequate processing speed for most control applications, striking a good balance between performance and power.

Length: 7 mm

With a length of 7 mm, the microcontroller fits well into various compact electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade signifies high reliability and performance in automotive applications, where conditions can vary greatly.

Peripheral IC Type: MICROCONTROLLER

As a peripheral IC type microcontroller, it is optimized for dedicated functions while remaining cost-effective.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller provides adequate memory for handling immediate data needs and basic tasks.

Technology: CMOS

CMOS technology allows for low power consumption, making this microcontroller suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improved mechanical integrity on the PCB.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA means lower energy consumption, extending battery life in portable applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a common standard, ensuring compatibility with a wide range of other components.

PWM Channels: YES

The presence of PWM channels allows for precise control in applications like motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability enables easy reprogramming and updates, which is essential for product iteration and development.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for a compact layout, making it suitable for high-density designs.

Speed: 8 rpm

While this speed may be context-specific, it indicates the microcontroller's capability in various process control applications.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller can interact with multiple peripherals, sensors, and actuators, enhancing its functionality.

Technical Specifications

Microcontrollers ST72F561K6TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F561K6TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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