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ST72F561K6T6

STMicroelectronics

ST72F561K6T6 by STMicroelectronics

ST72F561K6T6 microcontroller from STMicroelectronics features a 16 MHz clock, 32 KB ROM, and operates within -40 °C to 85 °C. With 24 I/O lines and ADC/PWM capabilities, it's ideal for industrial applications requiring reliable performance. Its compact design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,532 parts In-Stock

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2,532

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Anansix

USA . 1,785 parts In-Stock

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1,785

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Digiode

USA . 1,675 parts In-Stock

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1,675

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Sensible Micro Corp

USA . 87 parts In-Stock

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87

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Distributors (Availability)

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Microchip USA

USA . 286 parts In-Stock

1+ parts

$6.378

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286

$6.378

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AZTECH Wire

Italy . 486 parts In-Stock

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$9.920

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486

$9.920

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IDEA Electronic Components Group

UK . 2,356 parts In-Stock

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$77.985

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$70.186

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2,356

$77.985

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$70.186

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Component Stockers USA

USA . 691 parts In-Stock

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$99.990

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691

$99.990

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MKK Technologies

India . 2,137 parts In-Stock

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$146.645

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DigiPath Technology Company

USA . 2,137 parts In-Stock

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$146.645

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2,137

$146.645

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Corphita

USA . 1,643 parts In-Stock

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1,643

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Parana Technologies

USA . 1,406 parts In-Stock

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$93.243

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$93.243

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Vigor

Singapore . 1,110 parts In-Stock

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Overview

Unlock unparalleled performance with the ST72F561K6T6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This compact yet powerful device offers reliability and efficiency for various applications, from industrial automation to consumer electronics. With built-in ADC and PWM channels, it ensures precise control while operating across extreme temperatures. Choose STMicroelectronics for quality you can trust, empowering your next project with cutting-edge technology and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the longevity and reliability of the microcontroller in various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs, making it suitable for modern electronics where space is a premium.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of applications, including battery-operated devices.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution and provides ease of placement on PCB layout.

Bit Size: 8

An 8-bit architecture allows for simple processing tasks, making it ideal for embedded systems and control applications.

Power Supplies (V): 5

Operating at a standard 5V simplifies integration into systems where this voltage is already used.

No. of Terminals: 32

With 32 terminals, the microcontroller can support multiple peripherals and functionalities, offering flexibility in applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows for better utilization of space in compact designs, ideal for handheld devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliable operation even when power supply conditions fluctuate.

Maximum Operating Temperature: 85 °C

The capability to operate at higher temperatures makes it suitable for industrial applications where environmental conditions can be harsh.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for deployment in extreme environments, making it versatile across various industries.

Terminal Finish: Matte Tin (Sn)

Matte tin finish offers good solderability and corrosion resistance, ensuring reliable connections over time.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, increasing the versatility of the microcontroller in data acquisition applications.

Terminal Position: QUAD

Quad terminal position enhances connectivity and signal integrity, ideal for complex circuit designs.

ROM Words: 32768

A generous amount of ROM words allows for more complex programs and features, expanding the application possibilities.

Maximum Seated Height: 1.6 mm

The low seated height contributes to the overall compact design, which is essential for space-constrained applications.

Width: 7 mm

A modest width enables tighter integration into smaller devices while still allowing for sufficient connection points.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides adequate processing speed for a wide range of applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand up to 30 seconds at peak reflow temperature ensures reliability during manufacturing processes.

Peak Reflow Temperature °C: 235

At a peak reflow temperature of 235 °C, the microcontroller can be efficiently manufactured using standard soldering techniques.

Length: 7 mm

The 7 mm length complements the compact design, making it more adaptable for a variety of embedded applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade assures performance and reliability in demanding environments, ideal for critical applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it can control a variety of peripherals and processes, making it essential for embedded control systems.

RAM Bytes: 1024

Having 1024 bytes of RAM allows for efficient temporary data storage, crucial for executing more complex algorithms.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form offers excellent soldering characteristics, leading to more reliable PCB assembly.

Maximum Supply Current: 150 mA

With a maximum supply current of 150 mA, the microcontroller provides adequate power for operating multiple peripherals without overloading.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is widely used and easily Accessible, ensuring compatibility with existing systems.

PWM Channels: YES

The presence of PWM channels allows for precise control of motors and LEDs, enhancing the functionality in automation projects.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming of the device, facilitating rapid development cycles.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch strikes a balance between compactness and ease of soldering, supporting high-density designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, making handling and storage considerations important for long-term reliability.

Speed: 8 rpm

A speed of 8 rpm can be sufficient for many applications requiring low-speed control, such as slow-moving actuators.

No. of I/O Lines: 24

Having 24 I/O lines allows for a wide range of input and output interfaces, providing versatility for various applications.

Technical Specifications

Microcontrollers ST72F561K6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F561K6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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