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ST72F561J9TA

STMicroelectronics

ST72F561J9TA by STMicroelectronics

ST72F561J9TA by STMicroelectronics is an 8-bit microcontroller with 5V supply, 16MHz clock frequency, and 2048 bytes of RAM. Ideal for industrial applications, it features flash ROM programmability, PWM channels, and ADC support in a low-profile flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,925 parts In-Stock

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6,925

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Digiode

USA . 3,844 parts In-Stock

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3,844

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Anansix

USA . 2,443 parts In-Stock

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2,443

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Microchip USA

USA . 100 parts In-Stock

1+ parts

$5.643

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-

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100

$5.643

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AZTECH Wire

Italy . 764 parts In-Stock

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$19.015

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764

$19.015

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IDEA Electronic Components Group

UK . 504 parts In-Stock

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$27.427

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$24.684

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504

$27.427

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$24.684

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Ampacity Inc.

Singapore . 935 parts In-Stock

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$29.000

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935

$29.000

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MKK Technologies

India . 1,193 parts In-Stock

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$51.575

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1,193

$51.575

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DigiPath Technology Company

USA . 1,193 parts In-Stock

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$51.575

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1,193

$51.575

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A-Z Elektronik GmbH

Germany . 4,629 parts In-Stock

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4,629

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Vigor

Singapore . 1,051 parts In-Stock

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1,051

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Parana Technologies

USA . 907 parts In-Stock

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$32.793

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907

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$32.793

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Corphita

USA . 291 parts In-Stock

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291

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Overview

Elevate your projects with the ST72F561J9TA microcontroller by STMicroelectronics, a top-tier manufacturer known for delivering high-quality components. This powerful microcontroller offers unmatched performance and reliability, making it perfect for a wide range of applications. With its advanced features and cutting-edge technology, this product provides exceptional value and benefits to customers. Upgrade your designs today and experience the advantages of using the ST72F561J9TA microcontroller in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the microcontroller, making it suitable for various operating conditions.

Maximum Supply Voltage: 5.5V

Ability to handle a maximum supply voltage of 5.5V provides flexibility in powering the microcontroller and compatibility with a wide range of applications.

Bit Size: 8

8-bit architecture allows for efficient processing of data and instructions, making the microcontroller suitable for tasks that do not require complex computations.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, allowing the microcontroller to interface with sensors and other analog devices for data acquisition.

ROM Words: 61440

Large ROM capacity of 61440 words provides ample space for storing program instructions and data, making the microcontroller suitable for complex software applications.

Maximum Clock Frequency: 16MHz

High maximum clock frequency of 16MHz allows for fast execution of instructions, making the microcontroller suitable for real-time control and processing tasks.

RAM Bytes: 2048

Sufficient RAM capacity of 2048 bytes enables efficient data storage and manipulation during program execution, enhancing the microcontroller's performance in handling complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating environments.

PWM Channels: YES

Availability of PWM channels allows for precise control of analog output signals, making the microcontroller suitable for applications requiring accurate voltage or frequency modulation.

Technical Specifications

Microcontrollers ST72F561J9TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561J9TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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