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ST72F561J9T3

STMicroelectronics

ST72F561J9T3 by STMicroelectronics

ST72F561J9T3 microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w -40 °C to 125 °C, and supports 34 I/O lines. With 61440 ROM words and 2048 RAM bytes, it's ideal for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,503 parts In-Stock

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Vyrian

USA . 1,993 parts In-Stock

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1,993

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Anansix

USA . 1,109 parts In-Stock

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1,109

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Distributors (Availability)

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Microchip USA

USA . 233 parts In-Stock

1+ parts

$10.617

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233

$10.617

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AZTECH Wire

Italy . 727 parts In-Stock

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$21.620

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727

$21.620

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IDEA Electronic Components Group

UK . 989 parts In-Stock

1+ parts

$22.289

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-

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$20.060

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989

$22.289

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$20.060

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MKK Technologies

India . 1,212 parts In-Stock

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$41.913

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1,212

$41.913

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DigiPath Technology Company

USA . 1,212 parts In-Stock

1+ parts

$41.913

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1,212

$41.913

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Vigor

Singapore . 2,468 parts In-Stock

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Corphita

USA . 2,255 parts In-Stock

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Parana Technologies

USA . 572 parts In-Stock

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$26.650

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$26.650

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Overview

Unlock unparalleled performance with the ST72F561J9T3 microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, this versatile component excels in automotive, industrial, and consumer applications. With robust features like multiple ADC channels and efficient power management, it empowers your designs while ensuring longevity in diverse environments. Elevate your projects with a trusted solution that drives innovation and productivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects the microcontroller from environmental factors.

Surface Mount: YES

Surface mounting allows for compact designs and efficient space utilization on printed circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supply voltages, making it versatile for various applications.

Package Shape: SQUARE

The square shape facilitates easy integration into different layouts and designs.

Bit Size: 8

An 8-bit architecture is suitable for simpler applications, providing adequate processing power with lower cost.

Power Supplies (V): 5

Works with common 5V power supplies, ensuring easy compatibility with existing systems.

No. of Terminals: 44

With 44 terminals, it offers ample connectivity options for peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile design allows for space-efficient placement in compact electronic devices.

Minimum Supply Voltage: 4.5 V

This range increases operational flexibility with varying power supply conditions.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes it suitable for automotive and other demanding applications.

Minimum Operating Temperature: -40 °C

Low temperature operation capability enhances reliability in extreme environments.

Terminal Finish: Matte Tin (Sn) - annealed

The terminal finish improves solderability and enhances durability over time.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface easily with analog sensors.

Terminal Position: QUAD

Quad terminal positioning allows for efficient and reliable connections.

ROM Words: 61440

A large ROM capacity provides ample space for program storage, enabling sophisticated applications.

Maximum Seated Height: 1.6 mm

Compact seated height aids in designing low-profile and space-saving electronic devices.

Width: 10 mm

Standard width allows the microcontroller to fit well in various applications.

Maximum Clock Frequency: 16 MHz

This frequency allows for efficient processing speeds suitable for a variety of tasks.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard reflow soldering processes.

Peak Reflow Temperature °C: 260

This allows for robust manufacturing processes without damaging the microcontroller.

Length: 10 mm

Uniform length ensures compatibility with standard circuit designs and PCB layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product assures reliability under rigorous conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing capabilities with peripheral control for versatile applications.

RAM Bytes: 2048

Adequate RAM facilitates moderate computation and data handling capabilities.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminals provide effective soldering options, improving manufacturability.

Maximum Supply Current: 150 mA

This current capacity allows for powering additional components while maintaining stable operation.

Nominal Supply Voltage: 5 V

Works seamlessly with standard microcontroller applications, ensuring broad compatibility.

PWM Channels: YES

The presence of PWM channels allows for precise control of devices such as motors and lights.

ROM Programmability: FLASH

Flash ROM allows for in-circuit reprogramming, making development and updates easier.

Terminal Pitch: 0.8 mm

Standard pitch width aids in compatibility with various PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate sensitivity to moisture, ensuring robustness in average environments.

Speed: 8 rpm

This speed is suitable for applications that do not require high-speed processing, enhancing reliability.

No. of I/O Lines: 34

With 34 I/O lines, it allows extensive interfacing possibilities for various devices.

Technical Specifications

Microcontrollers ST72F561J9T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561J9T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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