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ST72F521R9TC

STMicroelectronics

ST72F521R9TC by STMicroelectronics

ST72F521R9TC microcontroller from STMicroelectronics features a 16 MHz CPU, 64 terminals, and operates b/w -40 °C to 125 °C. With 48 I/O lines and integrated CAN/I2C/SPI connectivity, it's ideal for automotive applications. Its low-profile design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,424 parts In-Stock

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Anansix

USA . 1,889 parts In-Stock

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Digiode

USA . 1,434 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 374 parts In-Stock

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$15.860

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374

$15.860

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IDEA Electronic Components Group

UK . 1,489 parts In-Stock

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$54.418

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$48.976

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$48.976

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MKK Technologies

India . 2,347 parts In-Stock

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$102.330

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$102.330

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DigiPath Technology Company

USA . 2,347 parts In-Stock

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$102.330

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$102.330

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QUARKTWIN TECHNOLOGY LTD

USA . 28,411 parts In-Stock

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Microchip USA

USA . 5,153 parts In-Stock

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Corphita

USA . 4,125 parts In-Stock

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Vigor

Singapore . 3,300 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,327 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,280 parts In-Stock

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Assy Fe

Spain . 1,005 parts In-Stock

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Kepictronics

USA . 909 parts In-Stock

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Futuretech Components

Singapore . 909 parts In-Stock

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Metaverse IC Inc.

Canada . 660 parts In-Stock

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ChipstoGo Electronic ltd

UK . 60 parts In-Stock

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Overview

Unlock the potential of your designs with the ST72F521R9TC microcontroller from STMicroelectronics, a leader in innovation and quality. This robust 8-bit MCU delivers reliability for automotive applications with its temperature resilience and low power consumption, ensuring efficiency in critical environments. Enjoy seamless connectivity and enhanced performance while benefiting from STMicroelectronics' commitment to excellence and cutting-edge technology—empowering your projects to drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables compact design and high-density circuit layouts, which is ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage allows flexibility in power supply configurations, which is advantageous for different designs.

Package Shape: SQUARE

The square package shape allows for efficient PCB space utilization and simplifies the mounting process.

Bit Size: 8

An 8-bit architecture is sufficient for many embedded applications, providing a balance between performance and resource management.

Power Supplies (V): 5

Operating on a 5V supply is common in microcontrollers, ensuring compatibility with a wide range of peripherals and systems.

No. of Terminals: 64

A higher terminal count allows for more I/O options, enhancing functionality and connectivity with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design reduces height, which is beneficial for compact electronic assemblies and space-constrained applications.

Minimum Supply Voltage: 3.8 V

Operating down to 3.8V supports battery-powered applications and allows for energy-efficient designs.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this microcontroller is suitable for automotive applications that encounter harsh conditions.

CPU Family: ST72

The ST72 family is known for its performance and versatility, providing robust processing capabilities for various tasks.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extreme conditions, making it ideal for automotive and industrial applications.

Terminal Finish: MATTE TIN

Matte tin provides good solderability and protects against oxidation, ensuring reliable electrical connections.

ADC Channels: YES

The availability of ADC channels allows for digital processing of analog signals, enhancing the functionality of the controller.

Terminal Position: QUAD

Quad terminal positioning can facilitate better heat dissipation and enable easier routing on PCBs.

ROM Words: 61440

A large ROM capacity allows for complex programs to be stored, making it suitable for advanced applications.

Maximum Seated Height: 1.6 mm

The low seated height is perfect for space-constrained designs while maintaining performance and reliability.

Width: 14 mm

The compact width supports efficient layout designs, making it compatible with various circuit board designs.

Peripherals: TIMER(5)

Multiple timers provide advanced control capabilities, making this microcontroller ideal for applications requiring precise timing.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency ensures decent processing speed for many embedded applications.

Length: 14 mm

The compact length aids in lightweight and space-efficient designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature rating guarantees reliability and performance under varying temperatures typical in vehicle systems.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it's multi-functional, integrating processing and control in a single unit.

No. of Timers: 5

Having multiple timers allows for rich timing control in various applications, enhancing functionality.

RAM Bytes: 2048

With 2048 bytes of RAM, this microcontroller can efficiently handle moderate data processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, which is critical in portable applications.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and assembly, improving manufacturing efficiency.

Analog To Digital Convertors: 16-Ch 10-Bit

Having a 16-channel, 10-bit ADC allows for versatile sensor integration and data acquisition in various projects.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA allows for low-power designs, making the microcontroller suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage is standard in many systems, ensuring compatibility with a wide range of components.

PWM Channels: YES

The presence of PWM channels enables effective motor control and other applications requiring adjustable signals.

Connectivity: CAN, I2C, SCI, SPI

The diverse connectivity options facilitate integration with various devices and protocols, enhancing communication capabilities.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and improving functionality post-deployment.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for high-density packaging, which is beneficial for modern circuit designs.

Speed: 8 rpm

The 8 rpm speed capability supports various low-speed applications, contributing to energy efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data processing for many standard applications.

No. of I/O Lines: 48

Having 48 I/O lines significantly enhances the versatility and expandability of the microcontroller in a wide range of applications.

Technical Specifications

Microcontrollers ST72F521R9TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

48

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F521R9TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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