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ST72F521R9T6

STMicroelectronics

ST72F521R9T6 by STMicroelectronics

ST72F521R9T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 16 ADC channels. With a temperature range of -40 °C to 85°C, it's ideal for industrial applications. Its compact design supports various connectivity options like CAN and SPI.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,505 parts In-Stock

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Vyrian

USA . 2,893 parts In-Stock

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Anansix

USA . 2,710 parts In-Stock

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2,710

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Chip Stock

USA . 690 parts In-Stock

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690

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Vigor

Singapore . 2,706 parts In-Stock

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$8.910

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2,706

$8.910

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Microchip USA

USA . 105 parts In-Stock

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$9.596

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105

$9.596

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AZTECH Wire

Italy . 718 parts In-Stock

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$16.810

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718

$16.810

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IDEA Electronic Components Group

UK . 1,086 parts In-Stock

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$26.529

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$23.876

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1,086

$26.529

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$23.876

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MKK Technologies

India . 2,319 parts In-Stock

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$49.886

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2,319

$49.886

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DigiPath Technology Company

USA . 2,319 parts In-Stock

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$49.886

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2,319

$49.886

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QUARKTWIN TECHNOLOGY LTD

USA . 17,133 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,633 parts In-Stock

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Corphita

USA . 2,832 parts In-Stock

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Metaverse IC Inc.

Canada . 1,080 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 595 parts In-Stock

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595

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Parana Technologies

USA . 271 parts In-Stock

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$31.720

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271

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$31.720

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Overview

Unlock the potential of your projects with the ST72F521R9T6 microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile 8-bit MCU combines robust performance, low power consumption, and a compact design, making it ideal for industrial applications and embedded systems. Experience unparalleled reliability, enhanced connectivity options, and seamless integration, empowering you to elevate your designs while ensuring long-lasting quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material choice ensures the microcontroller can withstand various environmental conditions, making it reliable for industrial applications.

Surface Mount: YES

The surface mount capability allows for compact circuit designs, saving space and reducing weight in electronic assemblies.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in system design, accommodating different power supply environments.

Package Shape: SQUARE

The square package shape is conducive for efficient heat dissipation and optimized layout on PCBs.

Bit Size: 8

An 8-bit architecture suits applications requiring straightforward control tasks while keeping power consumption low.

Power Supplies (V): 3.8/5.5

Supporting a range of supply voltages enhances compatibility with various power systems and design requirements.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample I/O options for complex applications, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack design is ideal for space-constrained applications, providing a slim and efficient profile.

Minimum Supply Voltage: 3.8 V

A low minimum supply voltage allows the microcontroller to operate in battery-powered and energy-efficient designs.

Maximum Operating Temperature: 85 °C

This temperature rating enables reliable operation in various industrial environments without risk of failure.

CPU Family: ST72

The ST72 family offers a proven architecture with robust performance, ensuring longevity and support for development.

Minimum Operating Temperature: -40 °C

With a capability to operate at low temperatures, this microcontroller is suitable for harsh environments and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and helps prevent tin whiskers, enhancing the reliability of connections.

ADC Channels: YES

The presence of ADC channels allows for effective sensor interfacing, making it ideal for data acquisition applications.

Terminal Position: QUAD

Quad terminal positioning enhances ease of soldering and improves electrical connectivity on circuit boards.

ROM Words: 61440

A sizeable ROM capacity enables extensive programs and applications, supporting more complex operations.

Maximum Seated Height: 1.6 mm

This low profile ensures compatibility with compact designs, facilitating space-efficient project layouts.

Width: 14 mm

A compact width aids in creating denser circuit designs, suitable for modern electronic devices.

Peripherals: TIMER(5)

Multiple timer peripherals provide various timing functions, enhancing control capabilities for diverse applications.

Maximum Clock Frequency: 16 MHz

Operating at a 16 MHz clock frequency balances performance and power consumption, ideal for many embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

A robust soldering profile ensures reliability post-manufacture, facilitating high-quality assembly processes.

Peak Reflow Temperature °C: 250

This reflow temperature compatibility supports modern soldering techniques, ensuring reliable manufacturing.

Length: 14 mm

The small length provides a compact design, essential for applications where board space is limited.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable performance in demanding environments, suitable for factory automation.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing, control, and communication in a single chip for efficiency.

RAM Bytes: 2048

A decent amount of RAM allows for running complex algorithms and more responsive applications.

Technology: CMOS

CMOS technology offers low power consumption, suitable for battery-operated applications and environmentally friendly designs.

Terminal Form: GULL WING

Gull wing leads facilitate easier manufacturing and soldering processes, enhancing reliability in assembly.

Analog To Digital Converters: 16-Ch 10-Bit

Having 16 channels with 10-bit resolution enables precise data acquisition from multiple analog sources.

Maximum Supply Current: 15 mA

With a low maximum supply current, this microcontroller is ideal for low-power applications and prolonging battery life.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5 V makes it compatible with common power sources in many applications.

PWM Channels: YES

PWM channels allow for efficient motor control and signal modulation, enhancing design versatility.

Connectivity: CAN, I2C, SCI, SPI

The wide range of connectivity options facilitates communication with other devices and peripherals, improving integration.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy software updates and customization without requiring physical changes.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch supports higher density layouts for modern electronics, optimizing space usage.

Moisture Sensitivity Level (MSL): 3

This moisture level indicates handling precautions that help ensure device reliability in various environments.

Speed: 8 rpm

A speed rating of 8 rpm indicates suitability for applications involving slow actuators or precise control systems.

On Chip Program ROM Width: 8

An 8-bit wide on-chip ROM enhances data processing efficiency in simpler applications, optimizing performance.

No. of I/O Lines: 48

Having 48 I/O lines provides significant flexibility and scalability for different application needs.

Technical Specifications

Microcontrollers ST72F521R9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F521R9T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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