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ST72F361K9T3

STMicroelectronics

ST72F361K9T3 by STMicroelectronics

ST72F361K9T3 microcontroller from STMicroelectronics features a 16 MHz CPU, 2048 bytes of RAM, and supports up to 13 external interrupts. With a supply voltage range of 4.5-5.5 V, it's ideal for automotive applications requiring robust performance in extreme temperatures. Its low-profile design and integrated peripherals enhance versatility in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,395 parts In-Stock

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6,395

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Digiode

USA . 2,970 parts In-Stock

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2,970

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Anansix

USA . 1,176 parts In-Stock

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1,176

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Distributors (Availability)

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Microchip USA

USA . 269 parts In-Stock

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$6.995

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269

$6.995

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AZTECH Wire

Italy . 445 parts In-Stock

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$18.130

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445

$18.130

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

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$61.901

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$55.711

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1,982

$61.901

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$55.711

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Component Stockers USA

USA . 223 parts In-Stock

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$99.990

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223

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MKK Technologies

India . 2,371 parts In-Stock

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$116.401

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2,371

$116.401

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DigiPath Technology Company

USA . 2,371 parts In-Stock

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$116.401

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$116.401

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Parana Technologies

USA . 1,581 parts In-Stock

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$74.012

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$74.012

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Vigor

Singapore . 1,197 parts In-Stock

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Corphita

USA . 555 parts In-Stock

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Overview

Unlock the potential of your projects with the ST72F361K9T3 microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. Ideal for automotive applications, this low-profile chip combines advanced features like rich peripheral support and efficient performance, enabling seamless integration into your designs. Experience enhanced efficiency and robust functionality that empowers innovation while ensuring long-lasting durability for all your embedded solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliability and protection for the microcontroller, making it suitable for varied applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and simplifies integration into printed circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources while maintaining performance.

On Chip Data RAM Width: 8

An 8-bit data RAM width is ideal for handling data efficiently in low-power applications while keeping the power consumption low.

Package Shape: SQUARE

The square package shape provides uniformity and ease of placement in circuit designs.

Bit Size: 8

An 8-bit architecture reduces complexity and enhances performance in small-scale applications.

Number of Terminals: 32

With 32 terminals, the microcontroller supports extensive connectivity and integration capabilities with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for space-constrained applications, making it easy to incorporate into compact devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates robustness, allowing the microcontroller to function reliably in extreme conditions.

CPU Family: ST7

The ST7 family is recognized for its low power consumption and efficient processing abilities, making it ideal for embedded systems.

Number of External Interrupts: 13

Having 13 external interrupts enhances the microcontroller's capability to respond promptly to dynamic inputs, improving system responsiveness.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C means this product can be used in harsh environments, suitable for automotive and industrial applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish enhances solderability, ensuring reliable connections during assembly and operation.

ADC Channels: YES

The inclusion of ADC channels allows the microcontroller to read analog signals directly, enhancing its versatility in various applications.

Terminal Position: QUAD

The quad terminal position provides better access for programming and debugging, leading to simpler design processes.

ROM Words: 61440

With 61440 ROM words, the microcontroller offers substantial program storage, allowing for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height facilitates a compact overall design, suitable for modern electronics requiring slimmer profiles.

RAM Words: 1024

1024 RAM words provide sufficient temporary data storage for real-time processing, enhancing performance.

Width: 7 mm

The compact width allows for tight board layouts, accommodating more functionality in smaller spaces.

Peripherals: POR; TIMER(4); RTC; WDT

Diverse peripherals like timers and watchdog timers enhance reliability, allowing for better control of processes.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz ensures balanced performance for various applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum peak reflow time of 30 seconds indicates compatibility with various soldering methods, enhancing manufacturing efficiency.

Peak Reflow Temperature: 235 °C

A peak temperature of 235 °C ensures the microcontroller stands up to robust soldering processes.

Length: 7 mm

The length complements the width for a compact, low-profile design suited for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Being temperature graded for automotive applications makes it ideal for reliable operation in vehicles, even under extreme conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing and control functionalities, making it efficient for embedded control tasks.

RAM Bytes: 2048

2048 bytes of RAM allows for better performance in applications requiring real-time data management.

Technology: CMOS

CMOS technology provides a low power consumption profile, ideal for battery-operated and energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and easier soldering options for assembly.

Analog To Digital Converters: 16-Ch 10-Bit

The built-in 16-channel 10-bit ADC allows for accurate digital representation of varied analog signals, enhancing versatility.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA makes it suitable for low-power applications, enhancing battery life.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with common power supply standards, simplifying integration into existing systems.

Connectivity: LIN(2); SPI

LIN and SPI connectivity options provide flexible data communication protocols, broadening the range of applications.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming of the microcontroller, improving overall flexibility in development.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is standard for many devices, promoting compatibility with existing board designs.

Format: FLOATING POINT

Support for floating-point format enables precise mathematical operations, essential for complex calculations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates it is suitable for surface mounting but requires specific storage conditions, ensuring long-term reliability.

Speed: 8 rpm

An operating speed of 8 rpm is adequate for many control applications, offering enough performance without excessive power draw.

Low Power Mode: YES

The existence of a low power mode helps optimize the microcontroller's energy consumption for battery-driven applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width means efficient data handling and reduced complexity in program design.

Number of I/O Lines: 24

With 24 I/O lines, the microcontroller can interface with multiple peripherals, enabling a wide range of applications.

Technical Specifications

Microcontrollers ST72F361K9T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

13

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361K9T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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