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ST72F361K6T6

STMicroelectronics

ST72F361K6T6 by STMicroelectronics

ST72F361K6T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 terminals, and operates b/w -40 °C to 85 °C. With 768 RAM bytes and 32 KB ROM, it's ideal for industrial applications requiring reliable performance. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,126 parts In-Stock

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Vyrian

USA . 1,915 parts In-Stock

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1,915

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Anansix

USA . 105 parts In-Stock

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105

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Microchip USA

USA . 140 parts In-Stock

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$6.135

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140

$6.135

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AZTECH Wire

Italy . 107 parts In-Stock

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$17.740

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107

$17.740

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IDEA Electronic Components Group

UK . 1,589 parts In-Stock

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$62.450

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$56.205

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1,589

$62.450

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$56.205

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Component Stockers USA

USA . 493 parts In-Stock

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$99.990

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493

$99.990

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MKK Technologies

India . 465 parts In-Stock

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$117.432

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465

$117.432

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DigiPath Technology Company

USA . 465 parts In-Stock

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$117.432

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465

$117.432

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Corphita

USA . 4,606 parts In-Stock

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Vigor

Singapore . 2,333 parts In-Stock

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Perfect Parts

USA . 1,312 parts In-Stock

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Parana Technologies

USA . 1,053 parts In-Stock

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$74.668

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1,053

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$74.668

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Overview

Unlock the potential of your projects with the ST72F361K6T6 microcontroller from STMicroelectronics—a leader in innovative semiconductor solutions. With its robust performance in various applications, this 8-bit powerhouse delivers reliability in industrial environments while offering low power consumption and extensive peripheral support. Experience seamless integration and superior quality that ensures excellence in every design, giving you the competitive edge you need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy provides a lightweight and robust solution, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, enabling modern electronics designs.

Maximum Supply Voltage: 5.5 V

The capability to handle up to 5.5 V maximizes flexibility in power supply options for diverse applications.

On Chip Data RAM Width: 8

An 8-bit RAM width is ideal for handling applications that require compact and efficient data processing.

Package Shape: SQUARE

The square shape facilitates easy alignment during assembly, improving manufacturing efficiency.

Bit Size: 8

An 8-bit bit size is well-suited for common applications that do not require extensive data processing, keeping costs down.

No. of Terminals: 32

With 32 terminals, this microcontroller can support a variety of peripheral devices and interfaces, enhancing connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile design contributes to space-saving in compact electronic devices, ideal for portable applications.

Minimum Supply Voltage: 4.5 V

This range allows for compatibility with standard 5V systems, increasing its usability in various electronic circuits.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this microcontroller suitable for industrial applications where heat management is essential.

CPU Family: ST7

The ST7 family is known for its reliability and performance, ensuring consistent operation across applications.

No. of External Interrupts: 13

With 13 external interrupts, this microcontroller can respond quickly to a variety of external signals, enhancing responsiveness in real-time applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures opens up usage in harsh environments such as automotive and outdoor applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finishing provides excellent solderability and corrosion resistance, enhancing the longevity of the connections.

ADC Channels: YES

Inclusion of ADC channels allows for analog signal processing, making it suitable for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient routing on PCBs, optimizing layout and performance.

ROM Words: 32768

A ROM capacity of 32KB allows for substantial program storage, enabling more complex applications.

Maximum Seated Height: 1.6 mm

The low seated height aids in designing compact electronic layouts, essential for miniaturized devices.

RAM Words: 768

Adequate RAM allows for efficient data storage and manipulation, improving overall processing speed.

Width: 7 mm

The compact width contributes to space-saving designs, ideal for devices with limited real estate.

Peripherals: POR; TIMER(4); RTC; WDT

Included peripherals enhance functionality, enabling power management, timing operations, and real-time clock features.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz offers a good balance of performance for a variety of applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures compatibility with standard soldering processes, simplifying manufacturing.

Peak Reflow Temperature °C: 235

A peak reflow temperature of 235 °C ensures compatibility with commonly used solder material, facilitating easy assembly.

Length: 7 mm

The compact length pairs with its width to create a small footprint, well-suited for tight spaces.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability in demanding environments, suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller allows for integrated functionalities, streamlining designs and reducing costs.

RAM Bytes: 1536

With 1536 bytes of RAM, the microcontroller supports moderate application needs, striking a balance between performance and resource usage.

Technology: CMOS

CMOS technology offers low power consumption, ideal for battery-operated devices and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering and assembly reliability, which is crucial for production efficiency.

Analog To Digital Convertors: 16-Ch 10-Bit

16 channel 10-bit ADCs provide versatility for interfacing with multiple sensors, enhancing functional application.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA allows for reasonably efficient power usage in embedded applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns with many existing electronic systems, simplifying integration.

Connectivity: LIN(2); SPI

Flexible communication options like LIN and SPI enable versatile integration in various electronic ecosystems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to software, enhancing product longevity.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is ideal for high-density PCB layouts, optimizing routing space.

Format: FLOATING POINT

Floating-point format support allows for more expansive calculations and processing capability in various applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity, allowing for routine handling and making it easier to manage during manufacturing.

Speed: 8 rpm

Operating at 8 rpm is sufficient for many control applications, delivering appropriate performance for on/off type actions.

Low Power Mode: YES

The availability of a low power mode extends battery life in portable applications, enhancing usability.

On Chip Program ROM Width: 8

An 8-bit program ROM width is efficient for many embedded applications, allowing for simpler coding and low memory usage.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller can interface with a variety of devices, making it highly versatile for multiple applications.

Technical Specifications

Microcontrollers ST72F361K6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

13

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

RAM Bytes:

1536

RAM Words:

768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361K6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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