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ST72F361K6T3

STMicroelectronics

ST72F361K6T3 by STMicroelectronics

ST72F361K6T3 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 KB ROM, and 1.5 KB RAM, making it ideal for automotive applications. It operates b/w -40 °C to 125 °C with low power modes and supports multiple connectivity options like LIN and SPI. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,679 parts In-Stock

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2,679

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Vyrian

USA . 2,293 parts In-Stock

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2,293

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Anansix

USA . 1,033 parts In-Stock

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1,033

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Microchip USA

USA . 241 parts In-Stock

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$6.800

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241

$6.800

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AZTECH Wire

Italy . 734 parts In-Stock

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$15.110

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734

$15.110

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IDEA Electronic Components Group

UK . 341 parts In-Stock

1+ parts

$55.865

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$50.279

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341

$55.865

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$50.279

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MKK Technologies

India . 233 parts In-Stock

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$105.051

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233

$105.051

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DigiPath Technology Company

USA . 233 parts In-Stock

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$105.051

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233

$105.051

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Corphita

USA . 4,821 parts In-Stock

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4,821

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Vigor

Singapore . 2,390 parts In-Stock

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2,390

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Parana Technologies

USA . 501 parts In-Stock

1+ parts

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$66.795

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501

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$66.795

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Overview

Unlock endless possibilities with the ST72F361K6T3 microcontroller from STMicroelectronics—a trusted name in cutting-edge technology. Designed for diverse applications, this robust component ensures reliability even in extreme conditions, making it ideal for automotive and industrial projects. With its compact design and powerful performance, customers benefit from enhanced efficiency and seamless integration, empowering their innovations to thrive in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for compact circuit designs and easier automated assembly, improving manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V offers flexibility and compatibility with most common power supplies.

On Chip Data RAM Width: 8

8-bit RAM width supports efficient processing and ease of integration in 8-bit applications.

Package Shape: SQUARE

The square package shape facilitates space-efficient layout on PCBs, which is critical in space-constrained designs.

Bit Size: 8

An 8-bit architecture is ideal for basic controller applications, ensuring straightforward programming and design.

No. of Terminals: 32

32 terminals provide ample connectivity options for various peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low-profile design is advantageous for applications requiring a slim form factor.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V allows for operation with a wide range of power sources, enhancing versatility.

Maximum Operating Temperature: 125 °C

The extended operating temperature range ensures reliable performance in high-temperature environments.

CPU Family: ST7

Being part of the ST7 family ensures robust support and proven technology, beneficial for established development paths.

No. of External Interrupts: 13

Having 13 external interrupts facilitates responsive control and interaction with various external stimuli.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this microcontroller suitable for automotive and harsh environments.

ADC Channels: YES

Integrated ADC channels add analog-to-digital conversion capability, broadening application possibilities.

Terminal Position: QUAD

Quad terminal position aids in the ease of soldering and enhances layout options on the PCB.

ROM Words: 32768

With 32768 ROM words, this microcontroller has ample memory for storing firmware and application code.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for compact electronic designs where minimal vertical space is essential.

RAM Words: 768

768 RAM words provide sufficient volatile memory for data processing and temporary storage during operations.

Width: 7 mm

A width of 7 mm contributes to a compact design, making it suitable for space-limited applications.

Peripherals: POR; TIMER(4); RTC; WDT

These integrated peripherals offer enhanced functionality, such as timers and real-time clock, increasing the microcontroller's utility.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency allows for efficient processing speed, suitable for real-time applications.

Length: 7 mm

The compact length further minimizes the footprint on the PCB, ideal for space-saving applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller can withstand harsh conditions typically encountered in vehicles.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing, memory, and interface capabilities all in one chip, simplifying design.

RAM Bytes: 1536

1536 bytes of RAM provide enough memory for effective variable storage and data manipulation in applications.

Technology: CMOS

CMOS technology promotes low power consumption and makes the microcontroller suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals ensure strong mechanical bonds and compatibility with standard soldering techniques.

Analog To Digital Convertors: 16-Ch 10-Bit

With 16 channels of 10-bit ADC, the microcontroller can effectively measure various signal inputs, enhancing versatility.

Maximum Supply Current: 15 mA

Low maximum supply current allows for energy-efficient designs, beneficial for power-sensitive applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures compatibility with a wide range of power supplies in different systems.

Connectivity: LIN(2); SPI

Multiple connectivity options like LIN and SPI enhance the microcontroller's application in communication-heavy projects.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications, extending the product's life cycle and flexibility.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is standard for precision soldering, contributing to reliability in connections.

Format: FLOATING POINT

Support for floating-point operations enhances the microcontroller's capabilities in applications requiring precision calculations.

Speed: 8 rpm

Operating at 8 rpm allows for slow, controlled processes, suitable for applications requiring gradual modulation.

Low Power Mode: YES

The low power mode feature enables energy savings during idle times, extending battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit width for on-chip ROM makes the microcontroller straightforward to program for small tasks.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller allows for extensive interaction with various sensors and devices, increasing its application range.

Technical Specifications

Microcontrollers ST72F361K6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

13

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Bytes:

1536

RAM Words:

768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361K6T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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