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ST72F361J9T3

STMicroelectronics

ST72F361J9T3 by STMicroelectronics

ST72F361J9T3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, 2048 bytes of RAM, and supports up to 18 external interrupts. It operates in automotive applications within -40 °C to 125 °C. Its low power mode and integrated ADC make it ideal for efficient control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,506 parts In-Stock

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7,506

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Digiode

USA . 2,821 parts In-Stock

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2,821

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Anansix

USA . 1,070 parts In-Stock

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1,070

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Distributors (Availability)

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Microchip USA

USA . 322 parts In-Stock

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$8.555

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-

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322

$8.555

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AZTECH Wire

Italy . 219 parts In-Stock

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$10.140

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219

$10.140

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IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$70.105

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$63.094

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712

$70.105

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$63.094

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MKK Technologies

India . 1,723 parts In-Stock

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$131.828

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1,723

$131.828

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DigiPath Technology Company

USA . 1,723 parts In-Stock

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$131.828

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1,723

$131.828

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Corphita

USA . 4,957 parts In-Stock

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4,957

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Parana Technologies

USA . 2,340 parts In-Stock

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$83.821

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2,340

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$83.821

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Vigor

Singapore . 1,493 parts In-Stock

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1,493

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Overview

Unlock innovation and efficiency with the ST72F361J9T3 microcontroller from STMicroelectronics, a leader in cutting-edge semiconductor solutions. Designed for versatility, this robust 8-bit MCU excels in automotive applications and more, delivering reliable performance in demanding environments. Experience low power consumption, extensive peripherals, and superior quality assurance, ensuring your projects thrive. Elevate your designs with STMicroelectronics—where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, which is essential in modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources commonly used in microcontroller applications.

On Chip Data RAM Width: 8

8-bit RAM width optimizes performance for simple data processing tasks, perfect for embedded applications.

Package Shape: SQUARE

The square package shape enables efficient use of PCB space, facilitating easier integration into circuit designs.

Bit Size: 8

An 8-bit architecture is suitable for handling basic control tasks in embedded systems, delivering sufficient performance for numerous applications.

No. of Terminals: 44

A greater number of terminals allows for more I/O options, enhancing connectivity and functionality in various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low profile design is advantageous for low-height applications and can be easily mounted on compact PCBs.

Minimum Supply Voltage: 4.5 V

The minimum operating voltage of 4.5 V allows for broad operational flexibility, making it adaptable to different power conditions.

Maximum Operating Temperature: 125 °C

A higher operating temperature rating enables usage in harsh environments, particularly in automotive applications.

CPU Family: ST7

The ST7 family is well-known for reliability and efficiency, providing a solid foundation for development in embedded systems.

No. of External Interrupts: 18

Multiple external interrupts enhance responsiveness to real-time events, improving user experience in interactive applications.

Minimum Operating Temperature: -40 °C

Operation in low-temperature environments expands the potential application range, especially in automotive and industrial sectors.

Terminal Finish: MATTE TIN

Matte tin termination provides reliable solderability, ensuring consistent connections in manufacturing and usage.

ADC Channels: YES

Having ADC channels allows for seamless interfacing with analog sensors, greatly enhancing the microcontroller's versatility.

Terminal Position: QUAD

Quad terminal positioning aids in compact layout designs and effective heat dissipation, particularly beneficial in high-performance scenarios.

ROM Words: 61440

A substantial ROM size enables the storage of complex programs, ideal for applications requiring rich functionality.

Maximum Seated Height: 1.6 mm

A low seated height allows for solutions in space-constrained applications, promoting compact system designs.

RAM Words: 1024

1024 RAM words provide adequate temporary storage for processing, ensuring smooth execution of tasks.

Width: 10 mm

A compact width allows easy integration into various circuit designs, catering to space-limited applications.

Peripherals: POR; TIMER(4); RTC; WDT

Integrated peripherals enhance the microcontroller's capability, enabling it to perform multiple tasks without needing external components.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency ensures adequate performance for most control tasks, balancing power consumption and processing capability.

Maximum Time At Peak Reflow Temperature (s): 30

A specified reflow heat limit helps ensure proper soldering during assembly, enhancing product reliability.

Peak Reflow Temperature °C: 260

The high peak temperature capability of 260 °C provides flexibility in assembly processes, supporting various manufacturing techniques.

Length: 10 mm

The compact length is conducive to efficient PCB layout design, helping to save space in electronic products.

Temperature Grade: AUTOMOTIVE

Automotive-grade certification implies robust performance in varying conditions, crucial for automotive and safety-critical applications.

Peripheral IC Type: MICROCONTROLLER

This specification clearly positions the product in the microcontroller category, making it suitable for control applications.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can manage moderate data loads, effectively supporting its processing tasks.

Technology: CMOS

CMOS technology contributes to low power consumption, making the microcontroller more energy-efficient for battery-powered applications.

Terminal Form: GULL WING

Gull-wing terminals facilitate effective soldering, ensuring reliable long-term connections in high-volume productions.

Analog To Digital Converters: 16-Ch 10-Bit

Multiple ADC channels with sufficient resolution offer enhanced data acquisition capabilities from analog sources, broadening application horizons.

Maximum Supply Current: 15 mA

A low maximum supply current guarantees energy efficiency, which is essential for battery-operated devices.

Nominal Supply Voltage: 5 V

Standardized nominal voltage of 5 V ensures compatibility with a wide range of electronic components, simplifying circuit design.

Connectivity: LIN(2); SPI

Integrated LIN and SPI connectivity options allow for efficient communication with other devices and sensors, enhancing flexibility in applications.

ROM Programmability: FLASH

Flash programmability enables users to easily update firmware, ensuring the device remains adaptable to new requirements.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is a standard for many PCB designs, allowing for easy integration and compatibility with existing layouts.

Format: FLOATING POINT

Support for floating-point processing enhances the microcontroller's ability to handle complex mathematical computations efficiently.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates standard handling precautions, ensuring the product remains reliable during the manufacturing process.

Speed: 8 rpm

An operational speed of 8 rpm is adequate for many control applications, balancing performance and efficiency.

Low Power Mode: YES

The inclusion of a low power mode is essential for energy-sensitive applications, especially in battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates straightforward programming techniques, making it user-friendly for developers.

No. of I/O Lines: 34

A total of 34 I/O lines provide robust interfacing capabilities, allowing the microcontroller to handle various input and output tasks effectively.

Technical Specifications

Microcontrollers ST72F361J9T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

18

No. of I/O Lines:

34

No. of Terminals:

44

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361J9T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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