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ST72F361J7T3

STMicroelectronics

ST72F361J7T3 by STMicroelectronics

ST72F361J7T3 microcontroller from STMicroelectronics features a 16 MHz CPU, 49152 ROM words, and operates b/w -40 °C to 125 °C. With 34 I/O lines and integrated ADC channels, it's ideal for automotive applications. Its low power mode enhances efficiency in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,337 parts In-Stock

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6,337

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Digiode

USA . 4,288 parts In-Stock

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4,288

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Anansix

USA . 1,774 parts In-Stock

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1,774

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 379 parts In-Stock

1+ parts

$8.307

100+ parts

-

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379

$8.307

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AZTECH Wire

Italy . 920 parts In-Stock

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$22.230

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920

$22.230

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IDEA Electronic Components Group

UK . 239 parts In-Stock

1+ parts

$36.611

100+ parts

-

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$32.950

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239

$36.611

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$32.950

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MKK Technologies

India . 1,677 parts In-Stock

1+ parts

$68.845

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1,677

$68.845

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DigiPath Technology Company

USA . 1,677 parts In-Stock

1+ parts

$68.845

100+ parts

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1,677

$68.845

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Vigor

Singapore . 1,200 parts In-Stock

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1,200

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Corphita

USA . 833 parts In-Stock

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833

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Parana Technologies

USA . 188 parts In-Stock

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$43.774

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188

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$43.774

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Overview

Elevate your projects with the ST72F361J7T3 microcontroller from STMicroelectronics, a leader in quality and innovation. This versatile device is designed for automotive applications, ensuring reliable performance even under extreme conditions. Benefit from its low power consumption, rich features, and robust support that streamline development and enhance functionality. Trust in STMicroelectronics’ legacy of excellence to deliver cutting-edge solutions tailored to your needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options.

On Chip Data RAM Width: 8

8-bit RAM width is suitable for simpler applications requiring efficient data handling.

Package Shape: SQUARE

Square shape provides uniformity in layout and can ease the design process.

Bit Size: 8

8-bit architecture is ideal for low-power applications, keeping energy consumption minimal.

No. of Terminals: 44

44 terminals offer a variety of interfacing options, making it versatile for different projects.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design assists in space-constrained applications, enabling thinner devices.

Minimum Supply Voltage: 4.5 V

The ability to operate at lower voltages allows for increased battery life in portable applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range makes it suitable for automotive and industrial applications.

CPU Family: ST7

The ST7 family ensures trusted performance and a strong ecosystem for development.

No. of External Interrupts: 18

18 external interrupts can handle multiple real-time events, enhancing responsiveness in applications.

Minimum Operating Temperature: -40 °C

Operates effectively in extreme cold, suitable for outdoor and harsh environments.

ADC Channels: YES

Integrated ADC channels enable seamless analog-to-digital conversion for sensor interfacing.

Terminal Position: QUAD

Quad terminal position aids in easy PCB design and improves signal integrity.

ROM Words: 49152

Large ROM capacity allows for complex applications and extensive program storage.

Maximum Seated Height: 1.6 mm

A low seated height complements sleek device designs and assists in space optimization.

RAM Words: 1024

Sufficient RAM supports reliable data handling for moderately complex applications.

Width: 10 mm

Compact width of 10 mm is advantageous for space-limited designs.

Peripherals: POR; TIMER(4); RTC; WDT

Multiple peripherals enhance functionality, offering advanced features for timing and power management.

Maximum Clock Frequency: 16 MHz

A max clock frequency of 16 MHz balances performance and power consumption effectively.

Length: 10 mm

Short length facilitates compact builds, essential for modern electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature ratings ensure reliability and safety in vehicles.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control in one chip, streamlining design.

RAM Bytes: 2048

2048 bytes of RAM offers ample workspace for variables, enhancing computational capacity.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and facilitate automatic assembly.

Analog To Digital Convertors: 16-Ch 10-Bit

16-channel 10-bit ADCs offer extensive input options, perfect for multi-sensor applications.

Maximum Supply Current: 15 mA

A low maximum supply current preserves battery life in portable devices.

Nominal Supply Voltage: 5 V

5 V nominal supply voltage is standard, reducing design complexity and compatibility issues.

Connectivity: LIN(2); SPI

Flexible connectivity options like LIN and SPI support a range of communication needs.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and reprogramming, ensuring adaptability.

Terminal Pitch: 0.8 mm

0.8 mm terminal pitch enables high-density PCB designs without sacrificing reliability.

Format: FLOATING POINT

Floating-point format support allows for advanced mathematical computations, ideal for complex applications.

Speed: 8 rpm

Operating at a low speed of 8 rpm is suitable for applications requiring stable and reliable performance.

Low Power Mode: YES

Low power mode enhances efficiency, critical for battery-operated and energy-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for easy handling of program instructions and data.

No. of I/O Lines: 34

34 I/O lines provide flexibility for interfacing with various components, maximizing functionality.

Technical Specifications

Microcontrollers ST72F361J7T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

18

No. of I/O Lines:

34

No. of Terminals:

44

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361J7T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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