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ST72F361J6T3

STMicroelectronics

ST72F361J6T3 by STMicroelectronics

ST72F361J6T3 microcontroller from STMicroelectronics features a 16 MHz CPU, 768 bytes of RAM, and supports up to 18 external interrupts. With a temperature range of -40 °C to 125 °C, it's ideal for automotive applications. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,338 parts In-Stock

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3,338

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Digiode

USA . 3,336 parts In-Stock

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3,336

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Anansix

USA . 1,264 parts In-Stock

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1,264

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Distributors (Availability)

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Microchip USA

USA . 493 parts In-Stock

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$7.456

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493

$7.456

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AZTECH Wire

Italy . 652 parts In-Stock

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$9.430

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652

$9.430

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IDEA Electronic Components Group

UK . 1,169 parts In-Stock

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$50.093

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$45.084

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$50.093

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$45.084

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MKK Technologies

India . 679 parts In-Stock

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$94.197

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679

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DigiPath Technology Company

USA . 679 parts In-Stock

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$94.197

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679

$94.197

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Component Stockers USA

USA . 701 parts In-Stock

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$99.990

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701

$99.990

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Vigor

Singapore . 9,036 parts In-Stock

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Corphita

USA . 3,667 parts In-Stock

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3,667

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Parana Technologies

USA . 1,119 parts In-Stock

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$59.894

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$59.894

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Overview

Discover the ST72F361J6T3 microcontroller from STMicroelectronics, where quality meets innovation! This robust solution offers exceptional performance for automotive applications, featuring low power consumption and versatile connectivity options. With a temperature grade designed for extreme conditions, it ensures reliability in any environment. Elevate your projects with a trusted partner known for excellence, empowering your designs with efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures robustness and longevity, making the microcontroller suitable for various applications.

Surface Mount: YES

The surface mount design facilitates easy integration into compact circuit boards, promoting efficient space utilization.

Maximum Supply Voltage: 5.5 V

This allows compatibility with a wide range of power supplies while ensuring reliability and safety.

On Chip Data RAM Width: 8

An 8-bit RAM width optimizes memory access for applications requiring efficient data processing.

Package Shape: SQUARE

The square shape is advantageous for even thermal distribution and simplified PCB design.

Bit Size: 8

The 8-bit architecture is suitable for many simple control applications and enhances processing speed.

No. of Terminals: 44

With 44 terminals, this microcontroller supports extensive connectivity, accommodating various inputs and outputs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design aids in fitting into space-constrained environments without compromising performance.

Minimum Supply Voltage: 4.5 V

This low minimum voltage gives flexibility in power design, making it easier to integrate into battery-operated devices.

Maximum Operating Temperature: 125 °C

A high operating temperature rating means reliable performance in extreme conditions, suitable for automotive applications.

CPU Family: ST7

Belonging to the ST7 family, this microcontroller benefits from established technology and extensive community support.

No. of External Interrupts: 18

The availability of 18 external interrupts enhances the ability to respond rapidly to external events in real-time applications.

Minimum Operating Temperature: -40 °C

This feature makes the microcontroller ideal for applications in harsh environments like automotive and industrial systems.

ADC Channels: YES

The presence of ADC channels enables conversion of analog signals to digital, enhancing versatility in sensor applications.

Terminal Position: QUAD

Quad terminal configuration allows for better heat dissipation and signal integrity during operation.

ROM Words: 32768

A generous ROM size allows for complex programs and algorithms to be stored directly on the microcontroller.

Maximum Seated Height: 1.6 mm

The low height profile supports compact designs, making it suitable for space-critical applications.

RAM Words: 768

With 768 RAM words, it provides sufficient memory for temporary data storage during program execution.

Width: 10 mm

A compact width results in ease of fitting into various electronic devices and modules.

Peripherals: POR; TIMER(4); RTC; WDT

The extensive peripherals enhance the microcontroller's functionality for diverse applications, improving user experience.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures fast processing speeds suitable for time-sensitive tasks.

Length: 10 mm

The small length complements its width, making it an ideal choice for compact electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive grade qualifies it for use in vehicle applications, ensuring long-term reliability under extreme conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed to handle multiple I/O operations, making it versatile for various embedded applications.

RAM Bytes: 1536

A total of 1536 bytes of RAM supports efficient handling of data for complex applications and operations.

Technology: CMOS

CMOS technology provides low power consumption, enhancing the energy efficiency of the application.

Terminal Form: GULL WING

Gull wing leads facilitate easy soldering and improve connectivity with PCB for reliable electrical connections.

Analog To Digital Convertors: 16-Ch 10-Bit

This feature allows for high-resolution analog inputs, enabling better performance in sensor applications.

Maximum Supply Current: 15 mA

Low current draw enhances the overall energy efficiency, especially in battery-powered devices.

Nominal Supply Voltage: 5 V

The standard nominal voltage makes it compatible with common power supplies, facilitating integration in existing systems.

Connectivity: LIN(2); SPI

The available connectivity options make it suitable for communication in automotive and multi-device environments.

ROM Programmability: FLASH

The use of flash memory allows for easy reprogramming and updates, ensuring adaptability for various applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables a smaller footprint on PCBs, ideal for densely packed electronic circuits.

Format: FLOATING POINT

Support for floating point calculations enhances processing power for complex numerical computations.

Speed: 8 rpm

The low speed specification indicates suitability for control applications requiring gradual response actions.

Low Power Mode: YES

The low power mode feature extends battery life in portable applications, making it eco-friendly.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data handling, suitable for various embedded applications.

No. of I/O Lines: 34

With 34 I/O lines, it provides ample interfacing options for connecting various peripherals, enhancing flexibility.

Technical Specifications

Microcontrollers ST72F361J6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

18

No. of I/O Lines:

34

No. of Terminals:

44

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Bytes:

1536

RAM Words:

768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361J6T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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