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ST72F325J6T6

STMicroelectronics

ST72F325J6T6 by STMicroelectronics

ST72F325J6T6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 3.8-5.5 V, and 32 I/O lines. It’s ideal for industrial applications requiring low power modes and robust performance in extreme temperatures (-40 °C to 85 °C). With integrated ADC and PWM channels, it supports versatile control tasks efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,960 parts In-Stock

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2,960

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R&J Components

USA . 391 parts In-Stock

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391

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Digiode

USA . 319 parts In-Stock

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319

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Anansix

USA . 239 parts In-Stock

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239

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Distributors (Availability)

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Microchip USA

USA . 320 parts In-Stock

1+ parts

$7.990

100+ parts

-

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320

$7.990

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AZTECH Wire

Italy . 58 parts In-Stock

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$14.690

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58

$14.690

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IDEA Electronic Components Group

UK . 800 parts In-Stock

1+ parts

$38.285

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-

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$34.456

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800

$38.285

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$34.456

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MKK Technologies

India . 823 parts In-Stock

1+ parts

$71.992

100+ parts

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823

$71.992

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DigiPath Technology Company

USA . 823 parts In-Stock

1+ parts

$71.992

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823

$71.992

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A-Z Elektronik GmbH

Germany . 6,461 parts In-Stock

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6,461

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Perfect Parts

USA . 6,451 parts In-Stock

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6,451

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Vigor

Singapore . 3,004 parts In-Stock

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3,004

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Corphita

USA . 2,269 parts In-Stock

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2,269

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Parana Technologies

USA . 171 parts In-Stock

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$45.775

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171

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$45.775

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Overview

Elevate your projects with the ST72F325J6T6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, it excels in industrial applications, offering robust performance in harsh environments. With low power consumption and multiple I/O options, this microcontroller enhances efficiency while delivering reliable functionality. Trust STMicroelectronics to power your next breakthrough—experience unparalleled value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection for the microcontroller, ensuring reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of circuit board space.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage offers flexibility in power supply options for various applications.

Package Shape: SQUARE

The square shape aids in uniform heat distribution and simplifies PCB layout.

Bit Size: 8

An 8-bit architecture is suitable for simple control applications, making it user-friendly and cost-effective.

No. of Terminals: 44

The ample number of terminals allows for extensive connectivity and integration options, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is ideal for space-constrained applications, making it versatile for varied designs.

Minimum Supply Voltage: 3.8 V

This flexibility in voltage requirements ensures compatibility with a range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature is suitable for demanding industrial applications.

CPU Family: ST72

This family offers a balance of performance and power efficiency, making it an ideal choice for embedded systems.

No. of External Interrupts: 9

Multiple external interrupts enhance responsiveness to events, improving overall system reliability.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature enables operation in extreme environments, critical for industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, enhancing the microcontroller's versatility.

Terminal Position: QUAD

Quad terminal positioning aids in efficient layout and better electrical performance.

ROM Words: 32768

A substantial amount of ROM allows for extensive program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a thinner profile in final products, ideal for compact designs.

Width: 10 mm

This width allows for easy compatibility with standard PCB layouts and other components.

Maximum Clock Frequency: 16 MHz

A higher clock frequency provides improved processing speed, which is essential for performance-oriented applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the microcontroller can withstand standard soldering processes during assembly.

Peak Reflow Temperature °C: 260

A high reflow temperature tolerance supports compatibility with various assembly methods and materials.

Length: 10 mm

Standard length aids in PCB design flexibility and ensures compatibility with other components.

Temperature Grade: INDUSTRIAL

Designating this as an industrial grade component guarantees reliability in tough operational conditions.

Peripheral IC Type: MICROCONTROLLER

The core classification as a microcontroller assures ease of integration into various control applications.

RAM Bytes: 1024

An adequate amount of RAM allows for efficient data processing and handling of multiple tasks.

Technology: CMOS

CMOS technology ensures low power consumption, ideal for battery-operated applications.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and help facilitate automated assembly processes.

Maximum Supply Current: 15 mA

Low supply current consumption enhances energy efficiency, suitable for portable and energy-sensitive applications.

Nominal Supply Voltage: 5 V

Standard 5 V supply ensures compatibility with most existing circuits and power supplies.

PWM Channels: YES

The presence of PWM channels enables control of motor speeds and dimming of lights, broadening application potential.

ROM Programmability: FLASH

Flash programmability allows for easy updates and changes, improving product lifecycle management.

Terminal Pitch: 0.8 mm

A smaller terminal pitch enables denser layouts, allowing for more compact designs.

Format: FIXED POINT

Fixed point format enhances performance in real-time applications where floating-point calculations aren't necessary.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates suitable handling requirements, ensuring durability during storage and usage.

Speed: 8 rpm

Operating at a speed of 8 rpm is ideal for specific applications requiring controlled movements in mechanical systems.

Low Power Mode: YES

Low power mode capability is essential for battery-operated devices, extending operational time between charges.

On Chip Program ROM Width: 8

The 8-bit program ROM width is compatible with a range of applications, enhancing system functionality.

No. of I/O Lines: 32

Thirty-two I/O lines provide ample connections for user interface and peripheral devices, enhancing integration capabilities.

Technical Specifications

Microcontrollers ST72F325J6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

9

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F325J6T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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